QFN LEADFRAME Search Results

QFN LEADFRAME Result Highlights (5)

Part	Manufacturer	Description
NBSG53AMNG	Rochester Electronics LLC	53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16
EL9112ILZ	Renesas Electronics Corporation	Triple Differential Receiver/Equalizer, QFN, /Tube
ISL59445IRZ	Renesas Electronics Corporation	1GHz Triple Multiplexing Amplifiers, QFN, /Tube
ISL99125BDRZ-T	Renesas Electronics Corporation	DrMOS (Driver + FET), QFN, /
ISL99135BDRZ-T	Renesas Electronics Corporation	DrMOS (Driver + FET), QFN, /

QFN LEADFRAME Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
IPC-7095B Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package	Original	EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil	PDF
EN5311Qi Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package	Original	EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil	PDF
QFN leadframe Abstract: omnix 5000 nsmd smd qfn stencil Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface	Original	AND8086/D r14525 QFN leadframe omnix 5000 nsmd smd qfn stencil	PDF
J-STD-005 Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389 Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently	Original	TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389	PDF
TB389 Abstract: No abstract text available Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing	Original	TB389	PDF
J-STD-005 Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently	Original	TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN	PDF
qfn 32 land pattern Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and	Original	32-pin MO-220 199707558G qfn 32 land pattern MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern	PDF
DUAL ROW QFN leadframe Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This	Original		PDF
QFN 76 9x9 footprint Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses	Original		PDF
qfn 48 7x7 stencil Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical	Original		PDF
TEXAS INSTRUMENTS, Mold Compound QFN Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance Text: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is	Original	SLOA122 TEXAS INSTRUMENTS, Mold Compound QFN SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance	PDF
jedec package MO-247 Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB	Original	AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline	PDF
qfn 48 7x7 stencil Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die	Original	XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance	PDF
SLUA271 Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface	Original	SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station	PDF

J-STD-005 Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging	Original	TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN	PDF
Analog devices marking Information APA Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557 Analog devices marking Information APA	PDF
Untitled Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557	PDF
Untitled Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557	PDF
jedec footprint MO-220 VHHD-2 Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the	Original		PDF
Untitled Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557	PDF
JEDEC Drawing MO-220 qfn Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the	Original		PDF
Untitled Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557	PDF
Untitled Abstract: No abstract text available Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557	PDF
Q100 Abstract: SLMA002 TPA3100D2 TPA3100D2IRGZRQ1 BEAD FILTER AEC Text: TPA3100D2-Q1 QFN www.ti.com . SLOS557 – SEPTEMBER 2008 20-W STEREO CLASS-D AUDIO POWER AMPLIFIER	Original	TPA3100D2-Q1 SLOS557 Q100 SLMA002 TPA3100D2 TPA3100D2IRGZRQ1 BEAD FILTER AEC	PDF

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QFN LEADFRAME Search Results

QFN LEADFRAME Result Highlights (5)

QFN LEADFRAME Datasheets Context Search

IPC-7095B

EN5311Qi

QFN leadframe

J-STD-005

TB389

J-STD-005

qfn 32 land pattern

DUAL ROW QFN leadframe

QFN 76 9x9 footprint

qfn 48 7x7 stencil

TEXAS INSTRUMENTS, Mold Compound QFN

jedec package MO-247

qfn 48 7x7 stencil

SLUA271

J-STD-005

Analog devices marking Information APA

Untitled

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jedec footprint MO-220 VHHD-2

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JEDEC Drawing MO-220 qfn

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Q100