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    QFN JC JB Search Results

    QFN JC JB Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QFN JC JB Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    si514

    Abstract: SI510
    Text: AN765 T HERMAL A NALYSIS OF S I L I C O N L ABS T I M I N G D EVICES 1. Introduction The junction temperature of semiconductor devices affects reliability and performance of Integrated Circuits ICs , including timing devices. This application note provides the following:


    Original     		PDF AN765 si514 SI510

    IDTP9090

    Abstract: No abstract text available
    Text: High and Low Side N-Channel Gate Driver Product Datasheet IDTP9090 Features Description • Input Voltage Range: 4.5 to 5.5 • Output Voltage Range: Control Range 0-30V  Peak MOSFET Drive current into 3nF • LGDRV Sink 3A  LGDRV Source 1A  UGDRV Sink


    Original     		PDF IDTP9090 IDTP9090

    MAX3208E

    Abstract: No abstract text available
    Text: MAX3207E RELIABILITY REPORT FOR MAX3207EAUT+ PLASTIC ENCAPSULATED DEVICES April 12, 2010 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Don Lipps Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.


    Original     		PDF MAX3207E MAX3207EAUT+ MAX3207E /-250mA. 96hrs. C/150 MAX3208E

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52110 Rev. 1, 3/2011 MCF52110 MCF52110 ColdFire Microcontroller Supports MCF52110 and MCF52100 The MCF52110 microcontroller family is a member of the ColdFire family of reduced instruction set computing


    Original     		PDF MCF52110 MCF52110 MCF52100 32-bit

    Untitled

    Abstract: No abstract text available
    Text: bq20z40-R1 SLUS993A – DECEMBER 2009 – REVISED MARCH 2011 www.ti.com SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29330 Check for Samples: bq20z40-R1 FEATURES APPLICATIONS • • • • 1 2 • • • •


    Original     		PDF bq20z40-R1 SLUS993A bq29330

    pin diagram for core i7 processor

    Abstract: JESD51-2 JESD51-3 JESD51-7 MCF52110 uart in pin diagram for core i3 processor BKD C6
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52110 Rev. 1, 3/2011 MCF52110 MCF52110 ColdFire Microcontroller Supports MCF52110 and MCF52100 The MCF52110 microcontroller family is a member of the ColdFire family of reduced instruction set computing


    Original     		PDF MCF52110 MCF52110 MCF52100 32-bit pin diagram for core i7 processor JESD51-2 JESD51-3 JESD51-7 uart in pin diagram for core i3 processor BKD C6

    Untitled

    Abstract: No abstract text available
    Text: bq20z60-R1 SLUS991A – DECEMBER 2009 – REVISED MARCH 2011 www.ti.com SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29330 Check for Samples: bq20z60-R1 FEATURES APPLICATIONS • • • • 1 2 • • • •


    Original     		PDF bq20z60-R1 SLUS991A bq29330

    MCF5221X

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52211 Rev. 2, 3/2011 MCF52211 MCF52211 ColdFire Microcontroller Supports MCF52210 / 52211 / 52212 / 52213 The MCF52211 microcontroller family is a member of the ColdFire family of reduced instruction set computing


    Original     		PDF MCF52211 MCF52211 MCF52210 32-bit MCF5221X

    MCF52210CEP66

    Abstract: MCF52211 MCF52211CAE66 MCF52211CEP66 MCF52211CVM66 MCF52210 MCF52210CAE66 MCF5221X
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52211 Rev. 2, 3/2011 MCF52211 MCF52211 ColdFire Microcontroller Supports MCF52210 / 52211 / 52212 / 52213 The MCF52211 microcontroller family is a member of the ColdFire family of reduced instruction set computing


    Original     		PDF MCF52211 MCF52211 MCF52210 32-bit MCF52210CEP66 MCF52211CAE66 MCF52211CEP66 MCF52211CVM66 MCF52210CAE66 MCF5221X

    Untitled

    Abstract: No abstract text available
    Text: TPS744xx TP S7 44x x TP S7 44 xx www.ti.com SBVS066O – DECEMBER 2005 – REVISED MARCH 2013 3.0A Ultra-LDO with Programmable Soft-Start Check for Samples: TPS744xx FEATURES 1 • 2 • • • • • • • • • • Soft-Start SS Pin Provides a Linear Startup


    Original     		PDF TPS744xx SBVS066O 115mV

    Untitled

    Abstract: No abstract text available
    Text: TPS62150 TPS62151, TPS62152, TPS62153 www.ti.com SLVSAL5A – NOVEMBER 2011 – REVISED OCTOBER 2012 3-17V 1A Step-Down Converter in 3x3 QFN Package Check for Samples: TPS62150, TPS62151, TPS62152, TPS62153 FEATURES DESCRIPTION 1 • • • • • • •


    Original     		PDF TPS62150 TPS62151, TPS62152, TPS62153 TPS62150,

    Untitled

    Abstract: No abstract text available
    Text: TPS62130, TPS62131 TPS62132, TPS62133 www.ti.com SLVSAG7A – NOVEMBER 2011 – REVISED SEPTEMBER 2012 3-17V 3A Step-Down Converter in 3x3 QFN Package Check for Samples: TPS62130, TPS62131, TPS62132, TPS62133 FEATURES DESCRIPTION 1 • • • • • •


    Original     		PDF TPS62130, TPS62131 TPS62132, TPS62133 TPS62131,

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    Untitled

    Abstract: No abstract text available
    Text: TPS62140 TPS62141, TPS62142, TPS62143 www.ti.com SLVSAJ0A – NOVEMBER 2011 – REVISED OCTOBER 2012 3-V to 17-V 2-A Step-Down Converter in 3-mm x 3-mm QFN Package Check for Samples: TPS62140, TPS62141, TPS62142, TPS62143 FEATURES DESCRIPTION 1 • • •


    Original     		PDF TPS62140 TPS62141, TPS62142, TPS62143 TPS62140, TPS6214X

    Untitled

    Abstract: No abstract text available
    Text: TPS61183 www.ti.com SLVSAB4B – JUNE 2010 – REVISED FEBRUARY 2012 WLED Driver for Notebooks with PWM Interface and Programmable PWM Dimming Check for Samples: TPS61183 FEATURES DESCRIPTION • • • • The TPS61183 IC provides a highly integrated WLED


    Original     		PDF TPS61183 TPS61183

    Untitled

    Abstract: No abstract text available
    Text: TLV62150 www.ti.com SLVSB71A – FEBRUARY 2012 – REVISED FEBRUARY 2013 4-17V 1A Step-Down Converter with DCS-Control Check for Samples: TLV62150 FEATURES DESCRIPTION • • • • • • • • • • • • • • • The TLV62150 is an easy to use synchronous step


    Original     		PDF TLV62150 SLVSB71A TLV62150

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: TLV62130 www.ti.com SLVSB74A – FEBRUARY 2012 – REVISED FEBRUARY 2013 4-17V 3A Step-Down Converter with DCS-ControlTM Check for Samples: TLV62130 FEATURES DESCRIPTION • • • • • • • • • • • • • • • The TLV62130 is an easy to use synchronous step


    Original     		PDF TLV62130 SLVSB74A TLV62130

    Untitled

    Abstract: No abstract text available
    Text: bq771800, bq771801 bq771802, bq771803 www.ti.com SLUSAX1 – DECEMBER 2012 Overvoltage Protection for 2-Series to 5-Series Cell Li-Ion Batteries with Internal Delay Timer Check for Samples: bq771800, bq771801, bq771802, bq771803 FEATURES • 1 • • •


    Original     		PDF bq771800 bq771801 bq771802 bq771803

    Untitled

    Abstract: No abstract text available
    Text: TPS61187 www.ti.com SLVSA85D – JUNE 2010 – REVISED FEBRUARY 2012 WLED Driver for Notebooks with PWM Interface and Auto Phase Shift Check for Samples: TPS61187 FEATURES DESCRIPTION • • • • The TPS61187 IC provides a highly integrated WLED driver solution for notebook LCD backlight. This


    Original     		PDF TPS61187 SLVSA85D TPS61187

    Untitled

    Abstract: No abstract text available
    Text: TPS7A7100 www.ti.com SBVS189D – MARCH 2012 – REVISED JANUARY 2013 1-A, Fast-Transient, Low-Dropout Voltage Regulator FEATURES 1 • • • • • • Wireless Infrastructure: SerDes, FPGA, DSP RF Components: VCO, ADC, DAC, LVDS Set-Top Boxes: Amplifier, ADC, DAC, FPGA,


    Original     		PDF TPS7A7100 SBVS189D TPS7A7100