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    QFN FOOTPRINT Search Results

    QFN FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPSM53603RDAR Texas Instruments 36-V, 3-A step-down power module in small 5.5 x 5 x 4mm RLF QFN package with small footprint Visit Texas Instruments Buy
    PTPSM53604RDAR Texas Instruments 36-V, 4-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint 15-B3QFN Visit Texas Instruments
    TPSM53604RDAR Texas Instruments 36-V, 4-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint 15-B3QFN -40 to 125 Visit Texas Instruments
    U91D101100130 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions
    U91D1L1100130 Amphenol Communications Solutions CXP, High Speed Input Output Connector, ENHANCED FOOTPRINT Visit Amphenol Communications Solutions

    QFN FOOTPRINT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: MPQ8636 High Efficiency, 10/20A, 18V Synchronous, Step-Down Converter FEATURES Part Number Package Input Voltage MPQ8636GLE10 QFN 3x4mm 4.5V to 18V Latch-off MPQ8636HGLE10 QFN(3x4mm) 4.5V to 18V NonLatch MPQ8636GVE20 QFN(5x4mm) 4.5V to 18V NonLatch OVP DESCRIPTION


    Original     		MPQ8636 10/20A, MPQ8636GLE10 MPQ8636HGLE10 MPQ8636GVE20 MPQ8636 0A/20A MO-220. PDF

    QFN leadframe

    Abstract: omnix 5000 nsmd smd qfn stencil
    Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface


    Original     		AND8086/D r14525 QFN leadframe omnix 5000 nsmd smd qfn stencil PDF

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389 PDF

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil PDF

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		TB389 PDF

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN PDF

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil PDF

    22V10A

    Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
    Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		ispGAL22V10A AN8074 22V10A 22V10 sizCMOS25 LVCMOS18 ispGAL22V10A 1800adapter 1-800-LATTICE LVCMOS33 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn PDF

    22V10

    Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
    Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		ispGAL22V10A AN8074 22V10A 22V10 1800adapter 1-800-LATTICE 22V10 LVCMOS25 LVCMOS33 ABEL plastron PDF

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer PDF

    QFN-32 footprint

    Abstract: QFN-32 QFN32 MK20DX128ZVFM5 QFN32 footprint 704 Diode
    Text: QFN-32 Case 32-Pin Plastic Surface-Mount Case 5.0 X 5.0 mm Nominal Footprint TOP VIEW www.RFM.com E-mail: info@rfm.com 2010 by RF Monolithics, Inc. BOTTOM VIEW Technical support + 1.800.704.6079 Page 1 of 1 QFN-32 - 04/27/10


    Original     		QFN-32 32-Pin QFN-32 footprint QFN32 MK20DX128ZVFM5 QFN32 footprint 704 Diode PDF

    MAX3737

    Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737 HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 PDF

    MAX3737

    Abstract: No abstract text available
    Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control PART TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.


    Original     		MAX3737ETJ MAX3737ETJ+ MAX3737EGJ 68mA/mA 82mA/mA 95mA/mA 62mA/mA 76mA/mA 90mA/mA MAX3737 PDF

    NIS5102

    Abstract: PNC0106A
    Text: AND8249/D Board Mounting Notes for NIS5102 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or


    Original     		AND8249/D NIS5102 PNC0106A PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SIDACtor Protection Thyristors Broadband Optimized Protection Q2L Series - 3.3x3.3 QFN Pb e3 RoHS Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients.


    Original     		E133083 PDF

    DFN 10 socket

    Abstract: 44-Pin QFN 16 pin QFN 9 pin socket QFN footprint XLT28QFN4
    Text: Transition Socket Specification SOT/DFN/QFN TRANSITION SOCKETS SOT/DFN/QFN transition sockets and associated hardware are shown below. FIGURE 7: SOT TRANSITION SOCKET WITH CABLE FIGURE 10: DFN TRANSITION SOCKET WITH CABLE Cable to Processor Module PDIP Device Adapter


    Original     		XLT16QFN1 14-lead XLT28QFN3 18-lead XLT28QFN4 28-lead XLT28QFN3/4 XLT44QFN2 40-lead DFN 10 socket 44-Pin QFN 16 pin QFN 9 pin socket QFN footprint XLT28QFN4 PDF

    3773 SMD

    Abstract: smd 3773 NIS6111 PNC0106A
    Text: AND8188/D Board Mounting Notes for NIS6111 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or


    Original     		AND8188/D NIS6111 3773 SMD smd 3773 PNC0106A PDF

    3773 SMD

    Abstract: smd 3773 metal package case 601 stencil tension NIS6111 PNC0106A
    Text: AND8188/D Board Mounting Notes for NIS6111 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat-Pack No-Lead Package (QFN) or


    Original     		AND8188/D NIS6111 3773 SMD smd 3773 metal package case 601 stencil tension PNC0106A PDF

    DUAL ROW QFN leadframe

    Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This


    Original     		PDF

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station PDF

    Untitled

    Abstract: No abstract text available
    Text: PA5131-32QN Data Sheet 32 pin QFN socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of an Atmel AT89C5131 in the 32 pin QFN package using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via


    Original     		PA5131-32QN socket/40 AT89C5131 PA5131-32QN PA5131-32QD 5131QN32 PDF

    operational amplifier discrete schematic

    Abstract: Schematics 5250 ISL6563 ISL6563CR-T ISL6563EVAL1 ISL6563IR-T MO-220
    Text: ISL6563 Data Sheet December 2003 Two-Phase Multi-Phase Buck PWM Controller with Integrated MOSFET Drivers Features • Integrated Two-Phase Power Conversion ISL6563CR-T 0 to 70 24 Ld 4x4 QFN L24.4x4B ISL6563IR-T 0 to 70 24 Ld 4x4 QFN L24.4x4B ISL6563EVAL1


    Original     		ISL6563 FN9126 VRM10, PUB95 MO-220 operational amplifier discrete schematic Schematics 5250 ISL6563 ISL6563CR-T ISL6563EVAL1 ISL6563IR-T MO-220 PDF

    440G

    Abstract: ATXN6077A CYWUSB6935 LR06
    Text: CYWUSB6935 WirelessUSB LR 2.4-GHz DSSS Radio SoC 1.0 Features • 2.4-GHz radio transceiver The CYWUSB6935 is offered in an industrial temperature range 48-pin QFN and a commercial temperature range 48-pin QFN. • Operates in the unlicensed Industrial, Scientific, and


    Original     		CYWUSB6935 CYWUSB6935 48-pin 95-dBm 13-MHz 440G ATXN6077A LR06 PDF