QFN 5x5
Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
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com/data/tb/TB389
dwg/plastic/P4171
QFN 5x5
qfn stencil
"exposed pad" PCB via
"thermal via"
solder mask
P4171
X-RAY INSPECTION
via diameter pitch
40-QFN
QFN "exposed die"
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QFN 5X5
Abstract: "thermal via" qfn land pattern
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
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com/data/tb/TB389
dwg/plastic/P4171
QFN 5X5
"thermal via"
qfn land pattern
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AD1882AJCIZ
Abstract: virage AD1882AJCPZ AD1882A
Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011D September 2012 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to +70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -40 °C to +85 °C
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AD1882A
DSH-202011D
AD1882AJCPZ*
AD1882AJCIZ*
48-Lead
MO-220-VKKD-2
AD1882AJCIZ
virage
AD1882AJCPZ
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AD1882AJCIZ
Abstract: AD1882AJCPZ 882A 401F conexant hd audio Widgets
Text: AD1882A High Definition Audio Codec Data Sheet DSH-202011C November 2009 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to 70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -20 °C to 85 °C
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AD1882A
DSH-202011C
AD1882AJCPZ*
48-Lead
AD1882AJCIZ*
MO-220-VKKD-2
AD1882A
AD1882AJCIZ
AD1882AJCPZ
882A
401F
conexant hd audio
Widgets
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size 0204
Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select
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Untitled
Abstract: No abstract text available
Text: MPQ8636 High Efficiency, 10/20A, 18V Synchronous, Step-Down Converter FEATURES Part Number Package Input Voltage MPQ8636GLE10 QFN 3x4mm 4.5V to 18V Latch-off MPQ8636HGLE10 QFN(3x4mm) 4.5V to 18V NonLatch MPQ8636GVE20 QFN(5x4mm) 4.5V to 18V NonLatch OVP DESCRIPTION
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MPQ8636
10/20A,
MPQ8636GLE10
MPQ8636HGLE10
MPQ8636GVE20
MPQ8636
0A/20A
MO-220.
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ZL30110LDG1
Abstract: C25ao C25AB Crystal oscillator 12 MHz C25D ZL30110 ZL30110LDE C25E C25co
Text: ZL30110 Telecom Rate Conversion DPLL Data Sheet Features May 2009 • Synchronizes to 8 kHz, 2.048 MHz, 8.192 MHz or 16.384 MHz • Provides a range of output clocks: Ordering Information ZL30110LDE ZL30110LDG1 ZL30110LDF1 32 Pin QFN 32 Pin QFN* 32 Pin QFN*
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ZL30110
ZL30110LDE
ZL30110LDG1
ZL30110LDF1
ZL30110LDG1
C25ao
C25AB
Crystal oscillator 12 MHz
C25D
ZL30110
ZL30110LDE
C25E
C25co
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PDF
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QFN leadframe
Abstract: omnix 5000 nsmd smd qfn stencil
Text: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface
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AND8086/D
r14525
QFN leadframe
omnix 5000
nsmd smd
qfn stencil
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J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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IPC-7095B
Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
Text: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5312QI
IPC-7095B
IPC-7095
7095B
IPC 7095B
en5312
qfn stencil
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TB389
Abstract: No abstract text available
Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
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TB389
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J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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TB389
J-STD-005
nozzle heater
Soldering guidelines and SMD footprint design
Technical Brief TB389
IPC-SM-782
MO-220
XQFN
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PDF
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EN5311Qi
Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
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EN5311QI
EN5311
IPC-7095
IPC-7095B
QFN PACKAGE thermal resistance
"exposed pad" PCB via
qfn 32 land pattern
qfn stencil
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MAX3737
Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472 NE164
Text: 19-2818; Rev 2; 7/04 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN MAX3737ETJ+ -40°C to +85°C 32 Thin QFN MAX3737EGJ -40°C to +85°C +Denotes lead-free packaging. 32 QFN 26 APCFILT1 27 APCFILT2
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OC-48
100mA
MAX3737ETJ
MAX3737ETJ+
MAX3737EGJ
MAX3737
MAX3737
HFAN-02
MAX3737EGJ
MAX3737ETJ
SFF8472
NE164
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MAX3737
Abstract: HFAN-02 MAX3737EGJ MAX3737ETJ SFF8472
Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.
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MAX3737ETJ
MAX3737ETJ+
MAX3737EGJ
68mA/mA
82mA/mA
95mA/mA
62mA/mA
76mA/mA
90mA/mA
MAX3737
HFAN-02
MAX3737EGJ
MAX3737ETJ
SFF8472
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MAX3737
Abstract: No abstract text available
Text: 19-2818; Rev 3; 6/11 Multirate Laser Driver with Extinction Ratio Control PART TEMP RANGE PIN-PACKAGE MAX3737ETJ -40°C to +85°C 32 Thin QFN-EP* MAX3737ETJ+ -40°C to +85°C 32 Thin QFN-EP* MAX3737EGJ -40°C to +85°C 32 QFN-EP* +Denotes a lead Pb -free/RoHS-compliant package.
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MAX3737ETJ
MAX3737ETJ+
MAX3737EGJ
68mA/mA
82mA/mA
95mA/mA
62mA/mA
76mA/mA
90mA/mA
MAX3737
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QFN PACKAGE Junction to PCB thermal resistance
Abstract: en5322 double sided pcb, thermal via EN5322QI J-STD-020A double sided pcb thermal
Text: THERMAL NOTE EN5322QI DC-DC Converters September 2008 Thermal Characteristics The Enpirion EN5322QI DC-DC converter is packaged in 4x6x1.1mm, 24-pin QFN package. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for
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EN5322QI
24-pin
QFN PACKAGE Junction to PCB thermal resistance
en5322
double sided pcb, thermal via
J-STD-020A
double sided pcb thermal
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EN5336
Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via"
Text: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal
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EN5365Q/EN5366Q
EN5365Q
EN5366Q
12x10x1
58-pin
EN5336
QFN "100 pin" PACKAGE thermal resistance
QFN PACKAGE Junction to PCB thermal resistance
EN5356
EN5335Q
EN5365
J-STD-020A
"thermal via"
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TEXAS INSTRUMENTS, Mold Compound QFN
Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
Text: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is
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SLOA122
TEXAS INSTRUMENTS, Mold Compound QFN
SLUA271
SLOA122
dsp layout guidelines
QFN PACKAGE thermal resistance
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temperature controller peltier 15V
Abstract: pwm control of tec temperature controller using microcontroller PWM Regulator peltier TEC Driver peltier cooler peltier driver Peltier module MAX1978 temperature controller h bridge 15V
Text: 19-2490; Rev 1; 2/07 Integrated Temperature Controllers for Peltier Modules ATE Ordering Information PART TEMP RANGE PIN-PACKAGE PKG CODE MAX1978ETM -40°C to +85°C 48 Thin QFN-EP* T4877-6 MAX1979ETM -40°C to +85°C 48 Thin QFN-EP* *EP = Exposed paddle.
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MAX1978ETM
T4877-6
MAX1979ETM
MAX1978
MAX1979
MAX1978/MAX1979
temperature controller peltier 15V
pwm control of tec
temperature controller using microcontroller
PWM Regulator peltier
TEC Driver
peltier cooler
peltier driver
Peltier module
MAX1978
temperature controller h bridge 15V
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PDF
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jedec package MO-247
Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB
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AC322
jedec package MO-247
qfn 88 stencil
QN180
IEC-68-2-32
QFN PCB Layout guide
QN108
Amkor TSCSP
qfn 32 land pattern
IPC-TM-650 2.6.9
QN180 outline
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NIS5102
Abstract: PNC0106A
Text: AND8249/D Board Mounting Notes for NIS5102 Leadless Package QFN Prepared by: Alan Ball ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or
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AND8249/D
NIS5102
PNC0106A
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qfn 48 7x7 stencil
Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die
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XAPP439
qfn 48 7x7 stencil
qfn 28 land pattern
land pattern for QFN 7x7
24 leads qfn 5x5
qfn 3X3 land pattern
"exposed pad" PCB via
XAPP439
pcb design 0,5 mm pitch 5x5 matrix
qfg48 dimensions
QFN PACKAGE thermal resistance
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EN5336Q
Abstract: EN5335Q EN5336 QFN PACKAGE Junction to PCB thermal resistance via diameter pitch J-STD-020A
Text: THERMAL NOTE EN5335Q/EN5336Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5335Q and EN5336Q DC-DC converters are packaged in 10x7.5x1.85mm 44-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed
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EN5335Q/EN5336Q
EN5335Q
EN5336Q
44-pin
EN5336
QFN PACKAGE Junction to PCB thermal resistance
via diameter pitch
J-STD-020A
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PDF
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