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    QFN 8X8 Search Results

    QFN 8X8 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy

    QFN 8X8 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFN 7X7

    Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
    Text: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2


    Original     		PDF 20-Lead 48-Lead 56-Lead QFN 7X7 qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


    Original     		PDF

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		PDF AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer

    QFN 64 8x8 dimension

    Abstract: No abstract text available
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension

    QFN 64 8x8 dimension

    Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


    Original     		PDF

    QFN 64 8x8 dimension

    Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension 56 qfn 7x7 2x2 dfn qfn 52 6x6

    QFN 64 8x8 dimension

    Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6

    QFN 64 8x8 dimension

    Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
    Text: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    WAN0158

    Abstract: X-RAY INSPECTION qfn 32 stencil WAN-0236 QFN PCB Layout guide die paddle 32-pin QFN PCB Layout guide 81-pin EH11 qfn 44 PACKAGE footprint
    Text: w WAN-0236 Recommendations on Soldering a Dual Row QFN Package to a PCB INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF WAN-0236 WAN0158 X-RAY INSPECTION qfn 32 stencil WAN-0236 QFN PCB Layout guide die paddle 32-pin QFN PCB Layout guide 81-pin EH11 qfn 44 PACKAGE footprint

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 19-3758; Rev 0; 8/05 KIT ATION EVALU E L B AVAILA High-Dynamic-Range, 16-Bit, 80Msps ADC with -82dBFS Noise Floor PART TEMP RANGE -40°C to +85°C 56 Thin QFN-EP MAX19586ETN+ -40°C to +85°C 56 Thin QFN-EP MAX19586ETN T5688-2 DVDD DGND DGND D0 D1 D5 D6 D7


    Original     		PDF 16-Bit, 80Msps -82dBFS 80dB/79 10MHz/70MHz 96dBc/102dBc 10MHz 3dBc/100dBc

    CHL8228G

    Abstract: CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6
    Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN packages APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based


    Original     		PDF CHL8225G/8G 200kHz CHL8225G CHL8228G CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6

    Untitled

    Abstract: No abstract text available
    Text: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6  Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN


    Original     		PDF CHL8225G/8G 40-pin 56-pin CHL8225G/8G CHL8225G CHL8228G

    QFN leadframe

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) QFN leadframe

    CSR8615

    Abstract: No abstract text available
    Text: CSR8615 Description Key Features The BlueCore CSR8615 QFN single-chip Bluetooth audio ROM device targets mono speakers and headsets Bluetooth® v4.0 specification compliant Radio includes integrated balun and RF performance of 9dBm transmit power and -91dBm receive sensitivity


    Original     		PDF CSR8615 CSR8615â -91dBm 80MHz 80MIPS com/products/csr8615 GB787433096) CSR8615

    AK08D300-CLCC

    Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) AK08D300-CLCC AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5

    CSR8635

    Abstract: No abstract text available
    Text: CSR8635 Description Key Features The BlueCore CSR8635 QFN single-chip Bluetooth audio ROM device targets stereo speakers and headsets Bluetooth® v4.0 specification compliant Radio includes integrated balun and RF performance of 9dBm transmit power and -91dBm receive sensitivity


    Original     		PDF CSR8635 CSR8635â -91dBm 80MHz 80MIPS com/products/csr8635 GB787433096) CSR8635

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    QFN56

    Abstract: No abstract text available
    Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10510D QUAD FLAT NON-LEADED PACKAGE QFN CASE NUMBER: 1674-02 56 TERMINAL, 0.5 PITCH ( 8X8X0. 9) STANDARD: NON-JEDEC CASE-OUTLINE


    OCR Scan     		PDF 98ARJ10510D 98ARJ10510D QFN56

    Untitled

    Abstract: No abstract text available
    Text: VIEW ROTATED 90° CW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10509D QUAD FLAT NON-LEADED PACKAGE QFN; CASE NUMBER: 1657-01 56 TERMINAL, 0.5 PITCH (8X8X1 STANDARD: NON-JEDEC


    OCR Scan     		PDF 98ARJ10509D 20MECHANICAL 5M-1994. 98ARJ10509D

    56-L

    Abstract: M0-220 TOP MARK AX
    Text: IN D E X D /2 : TOP VIEW I DETAIL A SIDE VIEW y v i / \ x ij v \ PROPRIETARY TITLEi PACKAGE OUTLINE, 56L QFN, 8x8x0.8 MM APPROVAL DOCUMENT CONTROL NO. 21-0135 REV A ¥ NOTES: 1. DIE THICKNESS ALLOWABLE IS 0 .3 0 5 m m


    OCR Scan     		PDF