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    QFN 64 PCB LAYOUT Search Results

    QFN 64 PCB LAYOUT Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy

    QFN 64 PCB LAYOUT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    WPCE775LA0DG

    Abstract: RT8206B RT8207A winbond wpce775 wpce775la winbond wpce775la0dg ALC269X alcor au6433 IC WPCE775LA0DG WPCE775 AU-6433
    Text: 5 4 3 2 1 JM11_MS ZH7 BLOCK DIAGRAM PCB STACK UP 8L HDI XTAL Y2 14.318MHZ LAYER 1 : TOP LAYER 2 : GND LAYER 3 : IN1 LAYER 4 : VCC LAYER 5 : IN2 LAYER 6 : IN3 LAYER 7 : GND LAYER 8 : BOT D POWER SYSTEM 5V/3V RT8206B P24 CLOCK CK505 (QFN-64) PG2 FAN & THERMAL


    Original     		PDF 318MHZ CK505 QFN-64) RT8206B ISL6261A RT8207A RT8202A Micro-FCBGA956/10W G9334/AO4466 ISL6263A WPCE775LA0DG winbond wpce775 wpce775la winbond wpce775la0dg ALC269X alcor au6433 IC WPCE775LA0DG WPCE775 AU-6433

    SLG8SP513V

    Abstract: LE82GM965 NH82801HBM R5C833 NH82801HB r433a 78H24 ITE8512 LE82GM965-SLA5T-MM isl62371
    Text: 1 2 3 4 5 6 7 8 FM6B Hepburn Intel UMA VER : 3B FM6B M/B PCB A A FAN & THERMAL Merom or Penryn POWER SYSTEM RESET CIRCUIT BATT CHARGER AC/BATT CONNECTOR PG 54 SMSC1423 478 Micro-FCPGA PG 3,4 SLG8SP513V (QFN-64) +3.3V_SUS/+5V_SUS CPU VR PG 48 REGULATOR PG 17


    Original     		PDF SMSC1423 SLG8SP513V QFN-64) SiI1392 BLM18BD601SN1. 10Kohm SLG8SP513V LE82GM965 NH82801HBM R5C833 NH82801HB r433a 78H24 ITE8512 LE82GM965-SLA5T-MM isl62371

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    schematic diagram scart to vga

    Abstract: schematic diagram vga to scart 7 pin mini din schematic diagram vga to rca c5027-0 CH7022 S-video 4 pin to 7pin 965GM CH7021 schematic diagram vga to svideo
    Text: AN-84 Chrontel CHRONTEL CHRONTEL CHRONTEL Application Notes PCB Layout and Design Considerations for the CH7021/CH7022 Encoder 1. Introduction This application note focuses on the basic PCB layout and design guidelines for the CH7021/CH7022 SDTV/HDTV Output


    Original     		PDF AN-84 CH7021/CH7022 schematic diagram scart to vga schematic diagram vga to scart 7 pin mini din schematic diagram vga to rca c5027-0 CH7022 S-video 4 pin to 7pin 965GM CH7021 schematic diagram vga to svideo

    R42 SOT223

    Abstract: 10UF 150UH 2N2222 W682388 ZX5T955G winbond CODEC AN-CS006a
    Text: W682388 Layout Guideline Rev 1.3 - AN-CS006a W682388 Pro-X CODEC Layout Guideline 1. W682388 Layout Considerations The Winbond W682388 Pro-X™ CODEC family is an excellent solution for short loop telephony applications. Place the components carefully to insure best performance. This document outlines critical


    Original     		PDF W682388 AN-CS006a D00336 AN-CS006a R42 SOT223 10UF 150UH 2N2222 ZX5T955G winbond CODEC

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    CH7317A

    Abstract: crt monitor spc 17" schematic CH7317A-BF FS8660 25CJ Chrontel CH7317A application notes 965GM EC2SMC-27MHz CH7317 22PF 74ACT08
    Text: AN-99 Chrontel CHRONTEL CHRONTEL CHRONTEL Application Notes PCB Layout and Design Considerations for the CH7317A SDVO* / RGB DAC 1. Introduction This application note focuses on the basic PCB layout and design guidelines for the CH7317A VGA RGB Bypass Output


    Original     		PDF AN-99 CH7317A crt monitor spc 17" schematic CH7317A-BF FS8660 25CJ Chrontel CH7317A application notes 965GM EC2SMC-27MHz CH7317 22PF 74ACT08

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    XLT08SO

    Abstract: XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint
    Text: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION 2005 Microchip Technology Inc. DS51194L Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


    Original     		PDF DS51194L likel011-632-634-9065 DS51194K1-page XLT08SO XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint

    plcc socket 68 PLCC bottom view

    Abstract: TQFP 100 pin Socket 68 pin plcc socket view bottom PLCC 44 socket layout footprint tqfp 208 tqfp 56 socket qfn 44 PACKAGE footprint tqfp 64 socket Microchip Product Line DS00148 84 pin plcc ic base
    Text: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION  2004 Microchip Technology Inc. DS51194K Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


    Original     		PDF DS51194K likely334-8870 DS51194K-page plcc socket 68 PLCC bottom view TQFP 100 pin Socket 68 pin plcc socket view bottom PLCC 44 socket layout footprint tqfp 208 tqfp 56 socket qfn 44 PACKAGE footprint tqfp 64 socket Microchip Product Line DS00148 84 pin plcc ic base

    QFN-64 footprint

    Abstract: No abstract text available
    Text: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194Q o-3-572-9526 DS51194Q-page QFN-64 footprint

    qfn 44 PACKAGE footprint

    Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
    Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The


    Original     		PDF AN-002 ML6652 AN-002 ML6652CM/EM QFN/LPCC44 ML6652. ML6652CH/EH qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 eco solder paste

    DS51140

    Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
    Text: Transition Socket Specification  2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194R DS51194R-page DS51140 PIC32 PICC-18 XLT28QFN4 DS51298

    DS51140

    Abstract: DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1
    Text: Transition Socket Specification  2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194S DS51194S-page DS51140 DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1

    LE9540

    Abstract: Broadcom fxs ve950
    Text: VE950 SERIES PRODUCT PREVIEW Zarlink’s VoiceEdge VE950 Series offers high performance, voice over broadband SLIC devices with universal differential ringing and codec interfaces optimized for short loop, power-sensitive applications. Providing the complete functionality required for interfacing to a subscriber loop, the VE950 products maintain


    Original     		PDF VE950 Le9540 11ZS052 LE9540 Broadcom fxs

    AN4077

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade


    Original     		PDF AN4077 MMA845xQ AN4077

    qfn 44 PACKAGE footprint

    Abstract: PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead
    Text: TRANSITION SOCKET SPECIFICATION 2006 Microchip Technology Inc. DS51194P Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194P so36-4803 DS51194P-page qfn 44 PACKAGE footprint PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead

    GS12141

    Abstract: No abstract text available
    Text: UHD-SDI FEATURING New UHD-SDI Solutions Broadcast Video Selector Guide • • • • Equalizers Cable Drivers Reclockers Configurable Input/Output Devices • • • • Transmitters Receivers Crosspoint Switches Timing Spring 2015 Complete Portfolio of Broadcast UHD-SDI solutions


    Original     		PDF Broadcast-SG15 GS12141

    EBK-GS3490-00

    Abstract: No abstract text available
    Text: video Featuring New UHD-SDI Solutions Broadcast Video Selector Guide • Equalizers • Cable Drivers • Reclockers • Configurable SDI I/O • SDI Transmitters • SDI Receivers • Crosspoint Switches • Timing Gen-Clocks Spring 2014 End-To-End Portfolio of Broadcast Video Solutions


    Original     		PDF

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32

    Untitled

    Abstract: No abstract text available
    Text: video Featuring New UHD-SDI Solutions Broadcast Video Selector Guide • Equalizers • Cable Drivers • Reclockers • Configurable SDI I/O • SDI Transmitters • SDI Receivers • Crosspoint Switches • Timing Gen-Clocks Spring 2014 End-To-End Portfolio of Broadcast Video Solutions


    Original     		PDF Broadcast-SG14

    GL850G application circuit

    Abstract: GL850G Design Guideline GL850G
    Text: Genesys Logic, Inc. GL852 USB 2.0 MTT HUB Controller Datasheet Revision 1.16 Mar. 18, 2009 GL852 USB 2.0 MTT HUB Controller Copyright: Copyright 2009 Genesys Logic Incorporated. All rights reserved. No part of the materials may be reproduced in any form or by any means without prior written consent of Genesys Logic, Inc.


    Original     		PDF GL852 GL852 GL852-MSNXX 64-pin GL852-MNNXX 48-pin GL852-MSGXX GL852-MNGXX GL850G application circuit GL850G Design Guideline GL850G

    AN4077

    Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
    Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade


    Original     		PDF AN4077 MMA845xQ AN4077 Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8