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    QFN 56 7X7 0.5 Search Results

    QFN 56 7X7 0.5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPS62110RSARG4 Texas Instruments Adjustable, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS62110RSAR Texas Instruments Adjustable, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS61091RSAR Texas Instruments 3.3-V Output, 500-mA, 96% Efficient Boost Converter, 20uA, QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS62110RSAT Texas Instruments Adjustable, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy
    TPS62112RSAR Texas Instruments 5-V, 1.5-A, 17-V Vin Step-Down Converter in QFN-16 16-QFN -40 to 85 Visit Texas Instruments Buy

    QFN 56 7X7 0.5 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    QFN 56 7x7 footprint

    Abstract: QFN 56 7x7 0.5 TEXTOOL 56 qfn 7x7
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


    Original     		PDF

    NP364

    Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
    Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.


    Original     		10mA/20mV NP445 NP364 QFN11T040-005 QFN11T040-006 QFN11T048-005 QFN11T048-008 QFN11T048-008 A101121-001 NP364 QFN11T032-003 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003 PDF

    QFN 64 8x8 dimension

    Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7 PDF

    QFN 64 8x8 dimension

    Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension 56 qfn 7x7 2x2 dfn qfn 52 6x6 PDF

    QFN 64 8x8 dimension

    Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6 PDF

    QFN 64 8x8 dimension

    Abstract: No abstract text available
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension PDF

    QFN 64 8x8 dimension

    Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
    Text: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


    Original     		PDF

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


    Original     		PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon PDF

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    s1l50552

    Abstract: encounter conformal equivalence check user guide circuit diagram of mini ips system S1L50062 RTC SL 5500 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory BGA and QFP Package epson lq 300
    Text: ASIC Gate Array / Embedded Array / Standard Cell 2007/4- SEIKO EPSON CORPORATION Our goal is to be a true partner that strategically contributes to your product development through our concept of "saving technologies" that save power, time, and space. Gate Array / Embedded Array / Standard Cell


    Original     		S1L60843F00A000 ARM720T: s1l50552 encounter conformal equivalence check user guide circuit diagram of mini ips system S1L50062 RTC SL 5500 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory BGA and QFP Package epson lq 300 PDF

    mlag

    Abstract: A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS
    Text: Shortform Catalog August 2013 Generation Innovation Delivering Innovation Through Te c h n o l o g y f o r t h e D i g i t a l G e n e r a t i o n Shortform Catalog August 2013 2013 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		M0009-081213 mlag A NEW GENERATION OF HIGH PERFORMANCE MOSFET DRIVERS FEATURES HIGH CURRENT, HIGH SPEED OUTPUTS PDF

    prt0

    Abstract: No abstract text available
    Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB


    Original     		CY7C6431x CY7C6434x, CY7C6435x prt0 PDF

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132 PDF

    micrel shortform

    Abstract: MIC33163 SM802
    Text: February 2015 Shortform Catalog Shortform Catalog February 2015 2015 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		M0009-022415 micrel shortform MIC33163 SM802 PDF

    MIC33163

    Abstract: voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765
    Text: September 2014 Shortform Catalog Shortform Catalog September 2014 2014 Micrel, Inc. The information furnished by Micrel, Inc., in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use, nor any infringements of patents


    Original     		M0009-090514 MIC33163 voip ata soc MICREL top marking for DSC557-0344FI0T ksz8765 PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB


    Original     		CY7C6431x CY7C6434x, CY7C6435x PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C6431x CY7C6434x, CY7C6435x enCoRe V Full Speed USB Controller Features • ■ Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB


    Original     		CY7C6431x CY7C6434x, CY7C6435x PDF