Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A ECN 112111HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.
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QFN55-32LD-PL-1
112111HC04
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Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-2 Rev A ECN 022813HC08 Originator A. Kungo Change New Release UNIT MM Reason Replaces MLF55Q-32LD-PD-1
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QFN55-32LD-PL-2
022813HC08
MLF55Q-32LD-PD-1
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Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 32 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-32LD-PL-1 Rev A B ECN 112111HC04 091014HC05 Originator S. YEH E. dlSantos Change New release Update typo error on note #4 UNIT MM Reason Per George C. Typo error
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QFN55-32LD-PL-1
112111HC04
091014HC05
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200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
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IPC-SM-782)
200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
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qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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24 leads qfn 5x5
Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some
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AN0017
AN0017-8206
24 leads qfn 5x5
qfn 3X3 land pattern
JESD47D
28 leads qfn 4x5
QFN 20 5x5 "recommended PCB Layout"
JEDEC J-STD-033b
marking 8206
Jedec jesd47d
AN0017
qfn 5x5 thermal resistance
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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max17428
Abstract: MAX17401
Text: MAX8796, MAX8797, MAX17401 1-Phase, Quick-PWM Intel IMVP-6/GMCH Controllers 1-Phase, Intel IMVP-6/6+ Controllers Ideal for Atom CPU and UMPC Designs Overview Technical Documents Ordering Info Related Products User Comments 0
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MAX8796,
MAX8797,
MAX17401
MAX8796
MAX8797
MAX8796/MAX8797/MAX17401
max17428
MAX17401
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ECS-200-CDX-0914
Abstract: LQM18FN GRM610C0G010B25K500 AYU1-1P-02676-120 ECS 327-12.5-34b SPI flash PCB LAYOUT GUIDE DUST Networks LQM18FN2R2m00d QH072AF2A wave guide
Text: Dust Networks Eterna Integration Guide Table of Contents About This Audience .3
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AN4077
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade
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AN4077
MMA845xQ
AN4077
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s2083
Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder
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S2083
s2083
qfn 32 5x5 STENCIL
rf 4 mm PQFN
s2083 application
PQFN
jedec package MO-220 32 5x5
qfn 3X3 land pattern
PDFN
STQFN-14
MO-220
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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MARKING T6C
Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change
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PX10051EJ35V0TN
G0706
MARKING T6C
lga 1155
package Code T6S
M33 TRANSISTOR
14SSOP
QFN-36 LAND PATTERN
14LGA
36pin qfn
marking 6-PIN PLASTIC TSON
nec 44pin
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JEDEC Drawing MO-220 qfn
Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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Abstract: No abstract text available
Text: Adaptive Digital DC/DC Controller with Current Sharing ZL2004-01 Features The ZL2004-01 is specialized version of the ZL2004 DC/DC controller that has been optimized for high output accuracy within a given set of operating conditions. The ZL2004-01 is otherwise identical to the ZL2004 in features and functionality.
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ZL2004-01
ZL2004-01
ZL2004
ZL1505
5m-1994.
FN6847
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32 pins qfn 5x5 footprint
Abstract: ISL6421A ISL6421AER ISL6421AERZ MO-220 TB389 qfn 5x5 thermal resistance 24 leads qfn 5x5
Text: ISL6421A Data Sheet Single Output LNB Supply and Control Voltage Regulator with I2C Interface for Advanced Satellite Set-top Box Designs The ISL6421A is a highly integrated solution for providing power and control signals from advanced satellite set-top
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ISL6421A
ISL6421A
5m-1994.
32 pins qfn 5x5 footprint
ISL6421AER
ISL6421AERZ
MO-220
TB389
qfn 5x5 thermal resistance
24 leads qfn 5x5
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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Si4705-D60-GU
Abstract: No abstract text available
Text: Si4704/05-D60 B ROADCAST F M R ADIO R ECEIVER WITH R D S / R B D S Features Applications Ordering Information: See page 30. Pin Assignments Table and portable radios Mini/micro systems CD/DVD and Blu-ray players
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Si4704/05-D60
EN55020
Si4705-D60
Si4705-D60-GU
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Untitled
Abstract: No abstract text available
Text: Adaptive Digital DC/DC Controller with Current Sharing ZL2004-01 Features The ZL2004-01 is specialized version of the ZL2004 DC/DC controller that has been optimized for high output accuracy within a given set of operating conditions. The ZL2004-01 is otherwise identical to the ZL2004 in features and functionality.
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ZL2004-01
ZL2004
ZL1505
5m-1994.
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marking 6-PIN PLASTIC TSON
Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
Text: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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R50ZZ0001EJ0200
marking 6-PIN PLASTIC TSON
MARKING M53
MARKING CODE T5E
RENESAS marking code 30SSOP
Renesas 30SSOP marking code
lga 1155
M33 TRANSISTOR
Microwave Devices
QFN-52
p5 6pin
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pcb design of zigbee
Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor
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CH370
pcb design of zigbee
FBGA 17X17 DRAWING
AN3345
LGA71
an3553
lga 115
71-Contact
AN2731
AN3003
QFN-32
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Abstract: No abstract text available
Text: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features Not recommended for new designs. For alternatives, see the Si533x family of products. Selectable output frequencies ranging from 19.44 to 1050 MHz
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Si5322
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