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    QFN 32 5X5 STENCIL Search Results

    QFN 32 5X5 STENCIL Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    BQ24751BRHDT Texas Instruments Multi-Cell Synchronous Switch-mode Charger in 5x5 QFN 28-VQFN -40 to 125 Visit Texas Instruments Buy
    BQ24751BRHDR Texas Instruments Multi-Cell Synchronous Switch-mode Charger in 5x5 QFN 28-VQFN -40 to 125 Visit Texas Instruments Buy

    QFN 32 5X5 STENCIL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		PDF AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Bias conditions: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm


    Original     		PDF TGA2706-SM TGA2706-SM

    Untitled

    Abstract: No abstract text available
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    TGA2706-SM

    Abstract: No abstract text available
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM

    TGA2706-SM

    Abstract: No abstract text available
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    qfn 32 5x5 STENCIL

    Abstract: No abstract text available
    Text: TGA4906-SM 4 Watt Ka-Band Packaged HPA Key Features • • • • • • Measured Performance Frequency Range: 28 - 31 GHz Psat: 36 dBm Gain: 23 dB Return Loss: -12 dB Bias: Vd = 6 V, Idq = 1.6 A, Vg = -0.75 V Typical Package Dimensions: 5 x 5 x 1.19 mm


    Original     		PDF TGA4906-SM TGA4906-SM qfn 32 5x5 STENCIL

    TGA2706-SM

    Abstract: RO4350
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM RO4350

    s2083

    Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
    Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder


    Original     		PDF S2083 s2083 qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220

    AVR181: Automotive Grade0 - PCB and Assembly Recommendations

    Abstract: ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
    Text: AVR181: Automotive Grade0 - PCB and Assembly Recommendations 1. Foreword Modern cars still involve control loops between a set of captors and different actuators elements responsible for the transportation, but also the comfort and the safety of the occupants. To satisfy the constant growth of these elements, car makers and their


    Original     		PDF AVR181: AVR181: Automotive Grade0 - PCB and Assembly Recommendations ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101

    Untitled

    Abstract: No abstract text available
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM

    "thermal printer" schematic

    Abstract: RO4350 TGA2706-SM TGA2706
    Text: TGA2706-SM 2 Watt C-Band Packaged Power Amplifier Key Features • • • • • • • Measured Performance Frequency Range: 5.5 – 8.5 GHz Power: 34 dBm Psat, 32 dBm P1dB Gain: 31 dB TOI: 42 dBm NF: 7 dB Bias: Vd = 6 V, Id = 1.26 A, Vg = +0.6 V Typical


    Original     		PDF TGA2706-SM TGA2706-SM "thermal printer" schematic RO4350 TGA2706

    RO4003

    Abstract: No abstract text available
    Text: TGA4906-SM 4 Watt Ka-Band Packaged HPA Key Features • • • • • • Measured Performance Frequency Range: 28 - 31 GHz Psat: 36 dBm Gain: 23 dB Return Loss: -12 dB Bias: Vd = 6 V, Idq = 1.6 A, Vg = -0.75 V Typical Package Dimensions: 5 x 5 x 1.19 mm


    Original     		PDF TGA4906-SM TGA4906-SM RO4003

    Ka-band 29-31 GHz hpa

    Abstract: RO4003 R6C12
    Text: TGA4906-SM 4 Watt Ka-Band Packaged HPA Key Features • • • • • • Measured Performance Frequency Range: 28 - 31 GHz Psat: 36 dBm Gain: 23 dB Return Loss: -12 dB Bias: Vd = 6 V, Idq = 1.6 A, Vg = -0.75 V Typical Package Dimensions: 5 x 5 x 1.19 mm


    Original     		PDF TGA4906-SM TGA4906-SM Ka-band 29-31 GHz hpa RO4003 R6C12

    qfn 5x5 thermal resistance

    Abstract: QFN 5x5
    Text: TGA4906-SM 4 Watt Ka-Band Packaged HPA Key Features • • • • • • Measured Performance Frequency Range: 28 - 31 GHz Psat: 36 dBm Gain: 23 dB Return Loss: -12 dB Bias: Vd = 6 V, Idq = 1.6 A, Vg = -0.75 V Typical Package Dimensions: 5 x 5 x 1.19 mm


    Original     		PDF TGA4906-SM TGA4906-SM qfn 5x5 thermal resistance QFN 5x5

    QFN 20 5x5 "recommended PCB Layout"

    Abstract: TGA2703
    Text: TGA2703-SM 3.5GHz WiMAX Driver / Power Amplifier Key Features • • • • • • • • • • 3.3-3.8 GHz Bandwidth 41 dBc IMR3 @ 21 dBm Pout/tone 24 dB Nominal Gain 30 dBm Nominal P1dB 2.5% EVM at 22 dBm output power 13 dB step attenuator function


    Original     		PDF TGA2703-SM 770mA TGA2703-SM 30dBm QFN 20 5x5 "recommended PCB Layout" TGA2703

    Untitled

    Abstract: No abstract text available
    Text: TGA2703-SM 3.5GHz WiMAX Driver / Power Amplifier Key Features • • • • • • • • • • 3.3-3.8 GHz Bandwidth 41 dBc IMR3 @ 21 dBm Pout/tone 24 dB Nominal Gain 30 dBm Nominal P1dB 2.5% EVM at 22 dBm output power 13 dB step attenuator function


    Original     		PDF TGA2703-SM 770mA TGA2703-SM

    Si53314

    Abstract: in 5007
    Text: Si53314 1 : 6 L O W J IT TE R U N I V E R S A L B U FF E R / L E V E L T R A N S L A T O R W IT H 2 : 1 I N P U T M U X A N D I N D I V I D U A L O E < 1 . 2 5 G H Z Features        6 differential or 12 LVCMOS outputs  Ultra-low additive jitter: 100 fs rms 


    Original     		PDF Si53314 32tial in 5007

    ic 5304 smd 8 pin

    Abstract: AN198810-1 5304 smd 8 pin bf2520 balun 75/150 datasheet EM198810H 7B12000028 Specification Quartz Crystals of 3Mhz HDR-1X14 EM198810
    Text: EM198810 Datasheet INTEGRATED CIRCUIT Elan Design DATA SHEET EM198810 2.4 GHz ISM Band Transceiver/Framer IC Preliminary Data Sheet ELAN MICROELECTRONICS CORP. No.12, Innovation 1st RD., Science-based Industrial Park Hsin Chu, Taiwan, R.O.C. TEL: 03 5639977


    Original     		PDF EM198810 EM198810 23/Bldg. ic 5304 smd 8 pin AN198810-1 5304 smd 8 pin bf2520 balun 75/150 datasheet EM198810H 7B12000028 Specification Quartz Crystals of 3Mhz HDR-1X14

    Si53304

    Abstract: No abstract text available
    Text: Si53304 1:6 L OW J I T T E R U NIVERSAL B U F F E R /L EVEL T RANSLATOR WITH 2 : 1 I NPUT M UX A N D I NDIVIDUAL OE Features         6 differential or 12 LVCMOS outputs  Ultra-low additive jitter: 100 fs rms  Wide frequency range: 1 to 725 MHz


    Original     		PDF Si53304 32-QFN