Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 28 LEAD QFN 5x5mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN55-28LD-PL-9 Rev A ECN 010512HC04 Originator S. YEH Change New release UNIT MM Reason Per George C.
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QFN55-28LD-PL-9
010512HC04
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Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 28 LEAD QFN 5X6mm PACKAGE (Co-Package) OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN56-28LD-PL-2 Lead Frame NiPdAu Via size/Pitch Solder stencil opening/Pitch Comments 0.300-0.350mm/0.80mm 1.55x1.20mm/1.75mm Must be connected to GND plane
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QFN56-28LD-PL-2
350mm/0
20mm/1
11mm/1
113012HC25
HQFN56-28LD-PL-1
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200123K
Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These
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IPC-SM-782)
200123K
200123K
QFN 88 land pattern
LGA-28 land pattern
SOIC 8 pcb pattern
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qfn 48 7x7 stencil
Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die
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XAPP439
qfn 48 7x7 stencil
qfn 28 land pattern
land pattern for QFN 7x7
24 leads qfn 5x5
qfn 3X3 land pattern
"exposed pad" PCB via
XAPP439
pcb design 0,5 mm pitch 5x5 matrix
qfg48 dimensions
QFN PACKAGE thermal resistance
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QFPN-28
Abstract: qfn 44 PACKAGE footprint QFPN 28 footprint 4x4x1 QFPN-24 TN0019 7x7x1 MEMS ic 7551-1 qfn 28 land pattern
Text: TN0019 Technical note MEMS in QFPN package surface mounting guidelines Introduction This document is a general guideline about soldering MEMS products packaged in Quad Flat Package No lead surface mount. April 2010 Doc ID 12708 Rev 2 1/14 www.st.com Contents
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TN0019
QFPN-28
qfn 44 PACKAGE footprint
QFPN 28 footprint
4x4x1
QFPN-24
TN0019
7x7x1
MEMS ic
7551-1
qfn 28 land pattern
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24 leads qfn 5x5
Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some
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AN0017
AN0017-8206
24 leads qfn 5x5
qfn 3X3 land pattern
JESD47D
28 leads qfn 4x5
QFN 20 5x5 "recommended PCB Layout"
JEDEC J-STD-033b
marking 8206
Jedec jesd47d
AN0017
qfn 5x5 thermal resistance
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max17428
Abstract: MAX17401
Text: MAX8796, MAX8797, MAX17401 1-Phase, Quick-PWM Intel IMVP-6/GMCH Controllers 1-Phase, Intel IMVP-6/6+ Controllers Ideal for Atom CPU and UMPC Designs Overview Technical Documents Ordering Info Related Products User Comments 0
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MAX8796,
MAX8797,
MAX17401
MAX8796
MAX8797
MAX8796/MAX8797/MAX17401
max17428
MAX17401
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s2083
Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder
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S2083
s2083
qfn 32 5x5 STENCIL
rf 4 mm PQFN
s2083 application
PQFN
jedec package MO-220 32 5x5
qfn 3X3 land pattern
PDFN
STQFN-14
MO-220
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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MARKING T6C
Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change
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PX10051EJ35V0TN
G0706
MARKING T6C
lga 1155
package Code T6S
M33 TRANSISTOR
14SSOP
QFN-36 LAND PATTERN
14LGA
36pin qfn
marking 6-PIN PLASTIC TSON
nec 44pin
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marking 6-PIN PLASTIC TSON
Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
Text: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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R50ZZ0001EJ0200
marking 6-PIN PLASTIC TSON
MARKING M53
MARKING CODE T5E
RENESAS marking code 30SSOP
Renesas 30SSOP marking code
lga 1155
M33 TRANSISTOR
Microwave Devices
QFN-52
p5 6pin
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Si85
Abstract: Si850x Si851x Si85xx SOIC-20 VDE0884
Text: Si85xx Si85 XX U N ID I R E C TI ON A L A C C URRENT S ENSORS Features Single-chip ac current sensor Low loss: <1.3 m primary series resistance and <2 nH inductance Leading-edge noise suppression eliminates need for leading-edge
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Si85xx
Si85xx
20-pin
Si85
Si850x
Si851x
SOIC-20
VDE0884
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DS51140
Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
Text: Transition Socket Specification 2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •
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DS51194R
DS51194R-page
DS51140
PIC32
PICC-18
XLT28QFN4
DS51298
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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DS51140
Abstract: DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1
Text: Transition Socket Specification 2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •
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DS51194S
DS51194S-page
DS51140
DS51298
PIC32
PICC-18
44-pin plcc pcb mount footprint
44L PLCC socket
XLT18SO-1
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EMC4001
Abstract: No abstract text available
Text: USB2514 USB 2.0 High-Speed 4-Port Hub Controller PRODUCT FEATURES Data Brief General Description The SMSC 4-Port Hub is low power, OEM configurable, MTT multi transaction translator hub controller IC with 4 downstream ports for embedded USB solutions. The
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USB2514
48-Pin
MO-48QFN-7x7
MO-220
EMC4001
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Untitled
Abstract: No abstract text available
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
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LVEP222
Abstract: MC100LVE222 NB100LVEP222 lqfp52 AG QC TRANSISTOR
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
MC100LVE222
lqfp52
AG QC TRANSISTOR
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QFN 64 8x8 footprint
Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
QFN 64 8x8 footprint
QFN-52
MC100LVE222
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Si8501-C-GM
Abstract: No abstract text available
Text: Si85xx Si85 XX U N ID I R E C TI ON A L A C C URRENT S ENSORS Features Single-chip ac current sensor Low loss: <1.3 m primary series resistance and <2 nH inductance Leading-edge noise suppression eliminates need for leading-edge
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Si85xx
Si85xx
20-pin
Si8501-C-GM
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