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    PRESSURE LOW DIE ATTACH Search Results

    PRESSURE LOW DIE ATTACH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCR5RG28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DM18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, DFN4 Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DG18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, WCSP4E Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR3RM28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 300 mA, DFN4C Visit Toshiba Electronic Devices & Storage Corporation

    PRESSURE LOW DIE ATTACH Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SM5430

    Abstract: SM5470 MEDICAL PRESSURE die
    Text: SILICON MICROSTRUCTURES INCORPORATED • SM5430/SM5470 Low Cost Packaged Pressure Sensors SURFACE MOUNT AND DIP PRESSURE SENSORS LOW-COST PACKAGED DIE DESCRIPTION Silicon Microstructures provides its two most popular pressure sensor die in surface mount dual in-line package SO-16


    Original     		PDF SM5430/SM5470 SO-16) SM5430 SM5470 MEDICAL PRESSURE die

    Untitled

    Abstract: No abstract text available
    Text: SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP I N C O R P O R A T E D an company Surface Mount and DIP Pressure Sensors Low-cost packaged die Description Silicon Microstructures provides its two most popular pressure sensor


    Original     		PDF SM-5310 SM-5350 SM-5410 SM-5450 SM5350-008-G-P

    SENSYM SX7100D

    Abstract: span zero circuits working SX7030D SX7100D SX7150D RTV 730 SX7300D SENSYM 150 SX7015D SENSYM
    Text: 1 to 300 psig Pressure Sensors in a Button Package APPLICATIONS Medical Equipment Computer Peripherals Pneumatic Controls HVAC FEATURES Button Package High Pressure Small Size Low Noise RTV 730 Die Attach EQUIVALENT CIRCUITS Vs The SX7 Series sensors offer a high pressure sensor


    Original     		PDF SX7001D) SX7300D) SENSYM SX7100D span zero circuits working SX7030D SX7100D SX7150D RTV 730 SX7300D SENSYM 150 SX7015D SENSYM

    CPR3-AN03

    Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
    Text: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.


    Original     		PDF CPR3-AN02, CPR3-AN03 pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree

    SX7100D

    Abstract: SX7300D RTV 730 SX7300 SX7001D SX7005D SX7015D SX7030D SX7150D
    Text: SX7 Series 1 psig to 300 psig Button Package Plastic Silicon Pressure Sensors DESCRIPTION The SX7 Series sensors offer a high pressure sensor in a very small “button” style package. These special devices use an RTV 730 for die attach to allow measurement of gauge pressures of 1 psi SX7001D to 300


    Original     		PDF SX7001D) SX7300D) 008180-2-EN SX7100D SX7300D RTV 730 SX7300 SX7001D SX7005D SX7015D SX7030D SX7150D

    RSK-401

    Abstract: Thomas Betts wt RSK-201 RSK-301 MIL-F-21608 WT-740 trap connector RSK401 301JG RSK101
    Text: Connector for Shielded Wire SHIELD-KON “Wrap-Around” RSK Connector for Shielded Pair Wire This solderless wrap-around connector provides a quick means of attaching a ground lead to shielded pair wire…without soldering. The low profile crimping tool and connector make grounding in crowded central offices much quicker, cleaner and easier.


    Original     		PDF

    SMT330

    Abstract: No abstract text available
    Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged


    Original     		PDF 008098-5-EN SMT330

    Untitled

    Abstract: No abstract text available
    Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged


    Original     		PDF 008098-3-EN

    SMT330

    Abstract: No abstract text available
    Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged


    Original     		PDF 008098-2-EN SMT330

    Untitled

    Abstract: No abstract text available
    Text: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged


    Original     		PDF 008098-4-EN

    MPX10DP motorola

    Abstract: pressure low die bond sensor RTV MPXL10
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXL10 series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied


    Original     		PDF MPX10 MPXL10 EPX10 MPX10D MPX10DP MPX10GP MPX10GP MPX10DP motorola pressure low die bond sensor RTV

    MPX5010

    Abstract: No abstract text available
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX5010 MPXL5010 SERIES Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, INTEGRATED PRESSURE SENSOR 0 to 10 kPa 0 to 1.45 psi 0.2 to 4.7 V Output Temperature Compensated and Calibrated The MPX5010 and MPXL5010 series piezoresistive


    Original     		PDF MPX5010 MPXL5010 MPX5010D MPX5010DP MPX5010GP MPX5010GP

    MEMS blood pressure sensor

    Abstract: mems brake pressure ptc fuel level sensor Capacitive Pressure Transducer MLX90807-0 PTC-04 mems brake pressure chip capacitive pressure sensor washing MLX90807 Q100
    Text: MLX90807/90808 Integrated Relative and Absolute Pressure Sensors Features and Benefits Application Examples Compact monolithic single die solution Absolute and Relative pressure sensors for different ranges Fully programmable through the connector with OTP memory


    Original     		PDF MLX90807/90808 AEC-Q100 ISO14001 3901090808P001 MEMS blood pressure sensor mems brake pressure ptc fuel level sensor Capacitive Pressure Transducer MLX90807-0 PTC-04 mems brake pressure chip capacitive pressure sensor washing MLX90807 Q100

    MPX200DP application notes

    Abstract: MPX200 circuit 344C-01
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX200 SERIES 200 kPa Uncompensated Silicon Pressure Sensors The MPX200 series device is a silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure. This


    Original     		PDF MPX200 MPX200D MPX200DP MPX200GP MPX200GP MPX200DP application notes MPX200 circuit 344C-01

    KTH-1000

    Abstract: KTH-1000 tools and dies KTH-1000 dies KTH1000 KTH-2000 SERIES DIE SETS KTM-5000 KTH-5000 Kings Electronics KTH-2000 CRIMP TOOLS
    Text: Winchester Electronics Presents. Crimp Tools Machine Crimp Tool Product Benefits Portable, bench-mounted with no permanent airline attached. Designed for use with KINGS KTH-1000 and KTH-2000 die sets. Ideal for long or short production runs. Convenient foot control frees operator


    Original     		PDF KTH-1000 KTH-2000 KTM-5000 KTH-5000 KTH-1000 KTH-1000 tools and dies KTH-1000 dies KTH1000 KTH-2000 SERIES DIE SETS KTM-5000 KTH-5000 Kings Electronics CRIMP TOOLS

    Kings kth-1000 dies

    Abstract: KTH-2000 SERIES DIE SETS KTM-5000 KTH-1000 KTH-1000 dies KTH-5000 KTH-1000 tools and dies KTH-2000 kth1000 pneumatic crimping tools
    Text: Crimp Tools Product Benefits - KTM-5000 KTM-5000, KTH-1000, KTH-5000 Portable, bench-mounted with no permanent air line attached Designed for use with KINGS KTH-1000 and KTH-2000 die sets Ideal for long or short production runs Convenient foot control frees


    Original     		PDF KTM-5000 KTH-1000 KTH-2000 KTM-5000, KTH-1000, KTH-5000 KTH-5000 Kings kth-1000 dies KTH-2000 SERIES DIE SETS KTM-5000 KTH-1000 dies KTH-1000 tools and dies kth1000 pneumatic crimping tools

    pressure low die bond sensor RTV

    Abstract: 344C 10 pin MPX10 MPX10DP pressure sensor strain gauge 344C Pressure Sensor MPXV10GC7U MPXV10GC6T1 pressure sensor response time ms Piezoresistive pressure sensors
    Text: Freescale Semiconductor Technical Data MPX10 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated


    Original     		PDF MPX10 MPX10 MPXV10GC MPX10D MPX10DP MPX10GP MPX10GS MPXV10GC6U MPXV10GC7U pressure low die bond sensor RTV 344C 10 pin MPX10DP pressure sensor strain gauge 344C Pressure Sensor MPXV10GC7U MPXV10GC6T1 pressure sensor response time ms Piezoresistive pressure sensors

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data MPX12 Rev 4, 05/2005 10 kPa Uncompensated Silicon Pressure Sensors MPX12 SERIES The MPX12 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied


    Original     		PDF MPX12 MPX12D MPX12DP MPX12GP

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount and DIP Pressure Sensors Low-cost packaged die Model Model Model Model 5310 standard pressure surface m ount 5350 ( low-pressure surface m ount) 5410 ( standard pressure DIP) 5450 ( low-pressure D IP) Description Silicon Microstructures provides its


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SILICON MICROSTRUCTURES DIVISION SM5310 Std. Pressure SMT SM5350 Low Pressure SMT SM5410 Std. Pressure DIP SM5450 Low Pressure DIP October 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­


    OCR Scan     		PDF SM5310 SM5350 SM5410 SM5450

    5310

    Abstract: barometric pressure sensor SM5310
    Text: SILICON MICROSTRUCTURES DIVISION SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP April 1997-4 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­


    OCR Scan     		PDF SM-5310 SM-5350 SM-5410 SM-5450 5310 barometric pressure sensor SM5310

    Untitled

    Abstract: No abstract text available
    Text: Z *EX A R SILICON MICROSTRUCTURES DIVISION SM5310 SM5350 SM5410 SM5450 Std. Pressure SMT Low Pressure SMT Std. Pressure DIP Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­


    OCR Scan     		PDF SM5310 SM5350 SM5410 SM5450

    MEDICAL PRESSURE die

    Abstract: consumer LOW PRESSURE SENSOR pressure low die attach Exar cross low PRESSURE die pressure low die bond sensor SM5310 Silicon Microstructures
    Text: ær EXAR SILICON MICROSTRUCTURES SM5310 Std. Pressure SMT ImSi n Z . Low Pressure SMT Std. Pressure DIP SM5450 d iv is io n Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip


    OCR Scan     		PDF