Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PQFP 132 PACKAGE DIMENSION Search Results

    PQFP 132 PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PQFP 132 PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIMENSIONS PQFP 132

    Abstract: MO-069 TS-0361
    Text: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package


    Original     		PDF MO-069 TS-0361-10 DIMENSIONS PQFP 132 TS-0361

    MO-069

    Abstract: TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807
    Text: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package


    Original     		PDF MO-069 TS-0361-13 TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807

    DSP56001A

    Abstract: PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP
    Text: Pin-out and Package General Purpose I/O Pin Tables The DSP56001A signals which may be programmed as general purpose I/O are listed with their primary function in Table 18. Table 19 and Table 20 identify pins on each package in numeric order. Table 21 identifies each signal name in order while giving the pin number for each


    Original     		PDF DSP56001A B13B-01 132-pin 88-pin 789D-01 PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP

    LC4064V

    Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
    Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch


    Original     		PDF 32-Pin 100-Ball 132-Ball 56-Ball 269-Ball 208-Ball 256-Ball 100-Pin 128-Pin 44-Pin LC4064V Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55

    N1056

    Abstract: D1589 A9422 DSP56002 PB10 PB12 a12e3 TQFP 144 PACKAGE DIMENSION
    Text: Pin-out and Package General Purpose I/O The DSP56002/L002 signals which may be programmed as general purpose I/O are listed with their primary function in Table 22. Table 23-Table 25 identify pins on each package in numeric order. Table 26 identifies each signal name in order while giving the pin number for each


    Original     		PDF DSP56002/L002 23-Table 51-Figure 132-pin 144-pin 789B-01 132-pin DSP56002 N1056 D1589 A9422 PB10 PB12 a12e3 TQFP 144 PACKAGE DIMENSION

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    M68ICD32

    Abstract: DIMENSIONS PQFP 132 68HC16Y1 ICD16 M68MPFB1632 Motorola 514 MEVB1632 M68MPB331B M68MEVB1632 ICD32 debugging
    Text: MEVB1632/D Rev 1 A modular approach to product development - MEVB1632 Modular Evaluation Board The M68MEVB1632 Modular Evaluation Board MEVB provides an economical, integrated solution for designing, debugging, and evaluating MCU operations of the M68HC16 and M68300 MCU families.


    Original     		PDF MEVB1632/D MEVB1632 M68MEVB1632 M68HC16 M68300 M68ICD32 DIMENSIONS PQFP 132 68HC16Y1 ICD16 M68MPFB1632 Motorola 514 M68MPB331B ICD32 debugging

    actel 1240a

    Abstract: TI1139 UI02 1280xl actel 1240xl 132 pga UJ-01 U1H-18 110E06 SI 1020A Actel A1225
    Text: Actel Device Reliability Report Actel’s field programmable gate arrays FPGAs are currently available in five product families—ACT 1, ACT 2, 1200XL, 3200DX, and ACT 3. The ACT 1 family consists of the A1010 and A1020, which are 1200- and 2000-gate FPGAs,


    Original     		PDF 1200XL, 3200DX, A1010 A1020, 2000-gate A1225, A1240, A1280 1200XL A1225XL, actel 1240a TI1139 UI02 1280xl actel 1240xl 132 pga UJ-01 U1H-18 110E06 SI 1020A Actel A1225

    Intel 8086 physical characteristics

    Abstract: Intel 100 pin PQFP dimension 80286 microprocessor features 80286 microprocessor paging mechanism 8088 microprocessor DIMENSIONS PQFP 132 PQFP 132 PACKAGE DIMENSION intel 8088 microprocessor applications 241267 MOTHERBOARD CIRCUIT intel 8088
    Text: Intel386 TM DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Y Y Y Y Y Y Flexible 32-Bit Microprocessor 8 16 32-Bit Data Types 8 General Purpose 32-Bit Registers Very Large Address Space 4 Gigabyte Physical


    Original     		PDF Intel386 32-BIT Intel 8086 physical characteristics Intel 100 pin PQFP dimension 80286 microprocessor features 80286 microprocessor paging mechanism 8088 microprocessor DIMENSIONS PQFP 132 PQFP 132 PACKAGE DIMENSION intel 8088 microprocessor applications 241267 MOTHERBOARD CIRCUIT intel 8088

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    floppy drive emulator

    Abstract: motorola 5118 motorola Base Station motorola Built in self-test 9pin rs232 motorola 3906 611 motorola data sheet mmds hi-light MC68332A M68HC12
    Text: MMDS1632/D REV 1 A modular approach to product development - MMDS1632 Motorola Modular Development System The MMDS1632 provides high-speed, real-time hardware and software emulation for target systems based on Motorola’s M68HC16 and M68300 families. This full-featured development system uses


    Original     		PDF MMDS1632/D MMDS1632 M68HC16 M68300 floppy drive emulator motorola 5118 motorola Base Station motorola Built in self-test 9pin rs232 motorola 3906 611 motorola data sheet mmds hi-light MC68332A M68HC12

    HP16505A

    Abstract: No abstract text available
    Text: Discontinued Product—Support Information Only This literature was published years prior to the establishment of Agilent Technologies as a company independent from Hewlett-Packard and describes products or services now available through Agilent. It may also refer to products/services no longer supported by Agilent.


    Original     		PDF E8115A/16A/18A CPU32 prep900 17-21/F HP16505A

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
    Text: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch


    OCR Scan     		PDF Intel386TM Intel386 PQFP 132 PACKAGE DIMENSION intel Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel

    b 87 af s 1080

    Abstract: DB3-5D
    Text: CMOS SyncFlFO 512x36,1,024x36 and 2,048 x 36 \dt ! IDT723631 IDT723641 IDT723651 Integrated Device Technology, Inc. • Available in 132-pin plastic quad flat package PQFP) or space-saving 120-pin thin quad flat package (TQFP) • Industrial temperature range ( ^ 0 ° C to +85°C) is available


    OCR Scan     		PDF 512x36 024x36 IDT723631 IDT723641 IDT723651 IDT723651 O-136, 727-S11* b 87 af s 1080 DB3-5D

    MC68330

    Abstract: MC68330FC16
    Text: SECTION 9 ORDERING INFORMATION AND MECHANICAL DATA This section contains the pin assignments and package dimensions of the MC68330. In addition, detailed information is provided to be used as a guide when ordering. 9.1 STANDARD MC68330 ORDERING INFORMATION


    OCR Scan     		PDF MC68330. MC68330 MC68330FC16 132-LEAD

    T23B

    Abstract: PQFP 132 PACKAGE DIMENSION intel 82308 intel 82308 82311 231369 Intel 100 pin PQFP dimension intel 82385 386 chipset 386 AT chipset
    Text: intei* Micro Channel INTERFACE AND SPECIFICATIONS • introduction ■ Micro Channel Specifications ■ Micro Channel Interface Logic Requirements — 386 DX System Data Path — 386 DX System Address/Command Path — 386 SX System Data Path — 386 SX System Address Command


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: t r ä n S w it c h -X-TB-524 TECHNICAL BULLETIN QEIM VLSI Device, TXC-04252 PRODUCT PREVIEW Plastic Ball Grid Array Package Option for OE1M Device PURPOSE OF THTS TECHNICAL BULLETIN TranSwitch is introducing an additional package option for the QEIM Quad E l Mapper VLSI Device. The


    OCR Scan     		PDF TB-524 TXC-04252 208-Lead MO-151-AAF-1 TXC-04252 TXC-04252-TB1

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: 82358 EISA chip set intel 82350 PQFP dimension intel DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 82350 Intel PQFP 231369
    Text: ¡ntéT M y M O N IM V 82350 MECHANICAL DATA Introduction PACKAGING INFORMATION See Packaging Spec. Order # 231369 The individual components of Intel’s EISA Chip Set come in JEDEC standard Gull Wing packages (25 MIL pitch), with "bumpers” on the corners for ease


    OCR Scan     		PDF

    land pattern PQFP 132

    Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208

    m0-112

    Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: No abstract text available
    Text: intei G^dUKfflOIMOW DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT ln t e l 386 TM Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space


    OCR Scan     		PDF 32-BIT ICEtm-386 PQFP 132 PACKAGE DIMENSION intel

    Untitled

    Abstract: No abstract text available
    Text: [ P f ô iy R i f l O l M G W in te i Intel386 DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space


    OCR Scan     		PDF Intel386â 32-BIT

    Untitled

    Abstract: No abstract text available
    Text: in te i ß N iy B M M V Intel386 DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Flexible 32-Blt Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space


    OCR Scan     		PDF Intel386â 32-BIT 32-Blt A2-A31 DO-D31 4fi2bl75 G144135