DS811
Abstract: No abstract text available
Text: data sheet CERAMIC / HERMETIC PPGA Plastic Pin Grid Array Package PPGA Amkor Technology incorporates the most advanced assembly processes for today and tomorrow's cost/performance applications. This IC package technology allows application and design engineers to optimize innovations while
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DS811
DS811
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UP124A
Abstract: UP159A UP175A
Text: Plastic Pin Grid Array PPGA 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A 159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A 2000 National Semiconductor Corporation MS101166 www.national.com Plastic Pin Grid Array (PPGA) May 1999
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UP124A
UP159A
MS101166
UP175A
UP124A
UP159A
UP175A
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PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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88 lead cpga
Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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CH13WIP
88 lead cpga
JEDEC Matrix Tray outlines
cpu Shipping Trays
outline of the heat slug for JEDEC
ceramic pin grid array package wire bond
I 6506
PLASTIC PIN GRID ARRAY PACKAGING
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cqfp package outline
Abstract: ceramic
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK
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PQFP chip size
Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ
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ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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Untitled
Abstract: No abstract text available
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK
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2N7042
Abstract: ipos 150 3.3 CD100 transistor intel pentium 4 motherboard schematic diagram cd114b SOT-23 la22 CD102 cd110 capacitor CD85 cdqa2
Text: Intel Celeron Processor PPGA with the Intel® 440LX AGPset Design Guide February 1999 Order Number: 245088-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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440LX
66MHz
FM5-62
440LX
2N7042
ipos 150 3.3
CD100 transistor
intel pentium 4 motherboard schematic diagram
cd114b
SOT-23 la22
CD102
cd110 capacitor
CD85
cdqa2
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outline of the heat slug for JEDEC
Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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Untitled
Abstract: No abstract text available
Text: MAIN INDEX GO TO WEB The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA Thin BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP
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apic - s03
Abstract: APIC D06 active aa33 APIC S03 AH36 T04 943 AK32 AM32 AM34 AN33
Text: Pentium Processor with MMX Technology 8.0 Pentium Processor® with MMX™ Technology Packaging Information 8.1 Pinout Figure 31. Pentium® Processor with MMX™ Technology PPGA Package Pinout - Top Side View 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
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Pentium Processors
Abstract: C 548 B 430TX 82430TX 296-Pin
Text: Low-Power Embedded Pentium Processors with MMX Technology PRODUCT HIGHLIGHTS • Low-power Pentium® processor with MMX™ technology for embedded applications: 166 and 266 MHz, PPGA and HL-PBGA packaging ■ Surface mount high thermal, low-profile Plastic Ball Grid Array
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64-bit
5K/IL1943
Pentium Processors
C 548 B
430TX
82430TX
296-Pin
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t3055el
Abstract: 82443zX hd Intel 440ZX-66 AGPset philips HD6 series 82443ZX foxconn t15 intel pentium 4 motherboard schematic diagram what is the state name for 74HC112 CRYSTAL 14.318MHZ 440ZX-66
Text: Intel Celeron Processor PPGA with the Intel® 440ZX-66 AGPset Design Guide March 1999 Order Number: 245126-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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440ZX-66
t3055el
82443zX hd
Intel 440ZX-66 AGPset
philips HD6 series
82443ZX
foxconn t15
intel pentium 4 motherboard schematic diagram
what is the state name for 74HC112
CRYSTAL 14.318MHZ
440ZX-66
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pentium MOTHERBOARD CIRCUIT diagram
Abstract: T40 N03 am24 "pin compatible" processor cross reference intel pentium MMX simd 1997 z02 surface mounted transistor
Text: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)
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32-Bit
64-Bit
166-MHz
Core/66-MHz
266-MHz
16-Kbyte
16-Kbyte
pentium MOTHERBOARD CIRCUIT diagram
T40 N03
am24 "pin compatible"
processor cross reference
intel pentium MMX simd 1997
z02 surface mounted transistor
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Bulk Decoupling 430TX
Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
Text: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)
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32-Bit
64-Bit
166-MHz
Core/66-MHz
266-MHz
16-Kbyte
pdf/2000/273209
Bulk Decoupling 430TX
Socket-7 296
430TX Configuration
273232
SL Enhanced
GC80503CSM66166
FV80503
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Untitled
Abstract: No abstract text available
Text: PERFORMANCE SEMICONDUCTOR 70^25^7 □□□23b? 10b « P S C SOE » PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES ¿4- High performance field programmable gate
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00023bfl
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design ideas
Abstract: Q002 CP21200 TRANSISTOR ARRAY CP21600
Text: PERFORMANCE SEMI CONDUCTOR SOE » • 7 G b 2 S cì 7 D0G23fcj7 ID b «PSC PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES T^ÿé —{*?—}/ ¿4 -
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55cJ7
61992Psr1ormanc9Senik
Q0023bfl
design ideas
Q002
CP21200
TRANSISTOR ARRAY
CP21600
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BPNPA16P
Abstract: No abstract text available
Text: Data Sheet November 1997 microelectronics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,
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26LS31
TT350
BPNPA16P
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Untitled
Abstract: No abstract text available
Text: March 1997 DataSheet microelectronics group * r Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features Description • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,
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26LS31
DS97-229LDRT
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Untitled
Abstract: No abstract text available
Text: Data Sheet August 1997 microelectronics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,
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26LS31
16-pin,
005002b
0027b0b
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Untitled
Abstract: No abstract text available
Text: Preliminary Data Sheet + March 1997 microelectronics ~ ~ group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features Description • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,
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26LS31
26LS3107914384
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Untitled
Abstract: No abstract text available
Text: Data Sheet July 1998 group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNG A, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption, and significantly lower levels of EMI
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26LS31
BPNPA16E-TR
BPNPA16G
16-pin,
BPNPA16G-TR
BPNPA16P
BPPGA16E
BPPGA16E-TR
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DG1A
Abstract: No abstract text available
Text: Data Sheet November 1997 m icro e le ctro n ics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNG A, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,
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26LS31
26LS32
26LS31,
DS98-039HSI
DS97-452HSI)
DG1A
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