47026
Abstract: No abstract text available
Text: ESD High Temp Polymide Tape Used in applications masking PCB gold features for wave soldering and IR reflow ovens • Removal leaves little or no residue • Static charge generation during unwind and peel off stainless steel plate application is 5 volts @ 50% RH
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2002/95/EC
47026
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2n2 j 100
Abstract: nh33 marking 68N KL73
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking
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tech50
2n2 j 100
nh33
marking 68N
KL73
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IEC61010
Abstract: No abstract text available
Text: Notes 1. Fits probes with 4mm Contact Tip 2. IEC61010 Ratings: 500V CAT I, 5A 3. Materials: Body - Polymide Nylon Tip - Brass, Nickel Plated 4. Internal Resistance: <5 milliohms 5. Temperature: -20 BC ~ +80 BC
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IEC61010
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TD590
Abstract: TD400 CP800Ti TD-460 TD400 horn TD460N
Text: CP800/Ti -Pro- HIGH FREQUENCY COMPRESSION DRIVER The CP 800/Ti is a high performance compression driver capable of high acoustic output over a wide frequency range. It features an integral pure titanium dome and surround, a precision lightweight voice coil made from flat aluminium wire, wound on high temperature polymide former and
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CP800/Ti
800/Ti
CP850/Nd,
TD590
TD400
CP800Ti
TD-460
TD400 horn
TD460N
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Untitled
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking
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E4991A
HP4291B
D-25578
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n68 j 250
Abstract: TE56N OF 22 nH INDUCTOR TP-2N2 Inductor 0.5 nH TE10N
Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE
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HP4291B
D-25578
n68 j 250
TE56N
OF 22 nH INDUCTOR
TP-2N2
Inductor 0.5 nH
TE10N
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windmill design
Abstract: F6589
Text: ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE F6589 FEATURES ● Ultra Thin Type: 2.5 mm Max. • Detection at closed distance from samples ● Flexible Lead Out (polymide film) • Easy system design with a flexible wiring • Low outguessing for high vacuum operation
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F6589
TMCPF0083
S-164-40
TMCP1011E03
windmill design
F6589
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Untitled
Abstract: No abstract text available
Text: SHEET 1 OF 1 1.25 [.049 in] 7.40 [.291 in] 4.90 [.193 in] .76 [.030 in] 1.42 [.056 in] ISOMETRIC 3.77 [.148 in] PC LAYOUT 2 4 1 3 6.70 [.264 in] CIRCUIT LAYOUT .05 [.002 in] REMOVABLE POLYMIDE TAPE SEAL FOR SOLDER FLUX 4.50 NOTE: [.177 in] 1. ALL DIMENSIONS IN MM [INCH]
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24VDC
100mW
500VDC
300VAC
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MARKING H9
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking
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D-25578
MARKING H9
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Untitled
Abstract: No abstract text available
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking
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E4991A
HP4291B
D-25578
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marking TB
Abstract: 8 tb 08 Marking code H6 TE 56 -ATC
Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE
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PDF
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E4991A
HP4291B
D-25578
marking TB
8 tb 08
Marking code H6
TE 56 -ATC
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Untitled
Abstract: No abstract text available
Text: Notes 1. Rated: 1000V CAT III P2; 20A, 50 milliohms complies with IEC61010 2. Materials: Body - Polymide Nylon Tip - Stainless Steel Jack - Brass 3. Internal Resistance: <5 milliohms 4. Operating Temperature: -20 BC ~ +80BC 5. Reinforced or double insulation
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IEC61010
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dupont kapton rohs
Abstract: "tape storage"
Text: ESD High Temp Polymide Tape Used in applications masking PCB gold features for wave soldering and IR reflow ovens • Removal leaves little or no residue • Static charge generation during unwind and peel off stainless steel plate application is 5 volts @ 50% RH
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2002/95/EC
dupont kapton rohs
"tape storage"
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0N6S
Abstract: tb10ns
Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking
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04039N
E4991A
HP4291B
D-25578
0N6S
tb10ns
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Untitled
Abstract: No abstract text available
Text: REVISION AK QTH-XXX-XX-X-D-XXX OPTION -LC: LOCKING CLIPS USE LC-08-TM-01 -A: ALIGNMENT PINS (USE QTH-30-XX-D-XX-A FOR -01 & -02) (FOR -03 THRU -10 SEE TABLE 4) -K: POLYMIDE FILM (USE K-500-300) (AVAILABLE ON -01 THRU -04, -09 & -10 ONLY) (SEE FIG. 2, SHEET 2)
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LC-08-TM-01)
QTH-30-XX-D-XX-A
K-500-300)
QTH-30-XX-D-XX-X-GP)
QTH-30-01-D-XX-A-RT1
T-1R36-01-F)
T-1R36-01-F
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Untitled
Abstract: No abstract text available
Text: TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR PUBLICATION ALL COPYRIGHT RIGHTS LOC FT RESERVED. BY TYCO ELECTRONICS CORPORATION. D IST REVISIONS LTR 01 DE SC RIPTIO N REVISED PER E C 0 - 0 6 - 2 4 1 7 6 DATE DWN APVD 1 0 /1 8 /0 6 SS CR MATERIAL: HOUSING: POLYMIDE 6 U L 9 4 V - 2 .
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Untitled
Abstract: No abstract text available
Text: TH IS DRAW ING IS U N P U B L IS H E D . COPYRIGHT BY TYCO R ELEAS ED ELECTRONICS CORPORATION. FOR ALL PUBLIC ATION RIG HTS LOC - RESERVED . FT DIS T R E V IS IO N S D E S C R IP T IO N LTR A RELEASED DATE DWN APVD 02APR02 EZ DB NOTES 1 MATERIAL HOUSING - POLYMIDE 6 U L 9 4 V - 2
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02APR02
TSB200012DSHT
11DSHT
TSB20001ODSHT
TSB200009DSHT
TSB200008DSHT
TSB20000796755-6
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED BY TYCO ELECTRONICS CORPORATION. 2 FOR PUBLICATION LOC ALL RIGHTS RESERVED. FT DIST R E V IS IO N S LTR 01 D DESCRIPTION REVISED PER EC 0-06-17641 DATE DWN APVD 7 /2 4 /0 6 SS OR MATERIAL: HOUSING: POLYMIDE 6 U L 9 4 V - 2 .
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EC0-06-17641
UL94V-2.
TSB150009DS
TSB150008DS
TSB150007DS
TSB150006DS
TSB150005DS
TSB150004DS
TSB150003DS
TSB150002DS
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24VDC SWITCH
Abstract: No abstract text available
Text: SHEET 7 OF 1 3 .5 0 [•1 3 8 ] I ON 9 -9 0 +8;§o [ . 390 +8.-888] 2 3 4 5 6 7 8 T _ 2 1 ,6 8 +§;§§ _ <j — — EXPLODED VIEW [•854+8:§§§] 0 O .9 7 ± o .5O [0.O38±O.O2O] X Pos. 1 D e n o te s Pin No. 1) RECOMMEND P.C.B. LAYO U T PEELABLE POLYMIDE
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24VDC.
100mA
50VDC.
500VDC
100mA
KAS1108RT
/J11081
24VDC SWITCH
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. FT DIST R E V IS IO N S LTR DATE DWN APVD 3 /1 4 /0 5 SS CR DESCRIPTION REVISED PER 0 G 3 B -1 0 2 0 -0 4 MATERIAL: HOUSING: POLYMIDE 6 U L 9 4 V -2 .
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TSB10
TSB100011
TSB100001
31MAR2000
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - LOC ALL RIGHTS RESERVED. FT REVISIONS DIST LTR A1 DESCRIPTION DATE / 10 6 / 0 5 REVISED PER E C O - 0 5 - 1 0 5 9 7 DWN APVD SS CR NOTES: HOUSING MATERIAL: POLYMIDE TYPE 6 /6
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ECQ-05-10597
B51C4U11T
B51C4U10T
B51C4U09T
B51C4U08T
B51C4U07T
B51C4U06T
B51C4U05T
B51C4U04T
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TSB10001
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. FT DIST REVISIONS LTR DATE DWN APVD 3 /21 /0 5 SS CR DESCRIPTION REVISED PER 0G 3B - 10 2 0 - 0 4 MATERIAL: HOUSING: POLYMIDE 6 U L94V-2.
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0G3B-1020-04
UL94V-2.
TSB1127
TSB100011DS
TSB10001
TSB100009DS
TSB100008DS
TSB100007DS
TSB100006DS
TSB100005DS
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Untitled
Abstract: No abstract text available
Text: SHEET 1 OF 7 3 .5 0 [•138] j ON 0.00 [.390+8;888] 2 3 4 1 1 so + 0 -2 0 I I -3 ^ 0.00 r EXPLODED VIEW A < S A + 0 -0 0 8 l |_ -4 Ü 4 0 .0 0 0 J 0O .9 7 ± o .5O [0.O38±O.O2O] X Pos. 1 D en o te s Pin No. 1 RECOMMEND P.C.B. LAYO U T PEELABLE POLYMIDE TAPE SEAL
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24VDC.
100mA
50VDC.
500VDC
100mA
KAS1104RT
/J11041
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24VDC SWITCH
Abstract: No abstract text available
Text: SH EET 7 OF 1 5.08 ’[.200] 2.54 [.100] TYP. 9-90+8;§o I I [.390+8.-888] I EXPLODED VIEW • 2 C 4 + 0 .0 0 8 0.000 0O .9 7 ± o .5O [0.O38±O.O2O] X Pos. 1 D eno tes Pin No. 1 RECO M M END P.C.B. LA Y O U T JJJ 2 m, 4 6 PEELABLE POLYMIDE TAPE SEAL 6.00
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24VDC.
100mA
50VDC.
500VDC
KAS1103RT
24VDC SWITCH
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