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    PLCC SOCKET 84 PLCC 3M Search Results

    PLCC SOCKET 84 PLCC 3M Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62SK-000 High-Density D-Subminiature (HD62 Female D-Sub) Connector, 62-Position Socket Contacts, Solder-Cup Terminals Datasheet

    PLCC SOCKET 84 PLCC 3M Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TS-2148-B

    Abstract: plcc socket 84 PLCC 3m PLCC SOCKET 3M
    Text: 3M Chip Carrier Sockets Low Profile, Four-Row, Through Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow


    Original     		PDF MO-047 MO-052 TS-2148-B RIA-2217B-E plcc socket 84 PLCC 3m PLCC SOCKET 3M

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		PDF XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01

    TS-2147-B

    Abstract: No abstract text available
    Text: 3M Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment


    Original     		PDF MO-047 MO-052 TS-2147-B RIA-2217B-E

    PLCC-32-SMT-TT

    Abstract: PLCC-44-SMTL-TT PLCC-52SMT P-LCC-44 PLCC-68SMT
    Text: 3M Chip Carrier Socket PLCC Series Low Profile, 4-Row, Surfacemount d S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with IR reflow and wave soldering S Open frame allows visual inspection of solder


    Original     		PDF E68080 PLCC-32-SMT-TT PLCC-44-SMTL-TT PLCC-52SMT P-LCC-44 PLCC-68SMT

    plcc socket 28 PLCC 3m

    Abstract: PLCC-44-SMT-TT PLCC-20-SMT-TT PLCC-32-SMT-TT PLCC-44-SMTL-TT plcc socket 84 PLCC 3m PLCC-28-SMT-TT PLCC-84-SMT-TT PLCC-52-SMT-TT PLCC-68-SMT-TT
    Text: 3M Chip Carrier Socket PLCC Series Low Profile, 4-Row, Surface Mount S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with IR reflow and wave soldering S Open frame allows visual inspection of solder


    Original     		PDF TS-1069-01 plcc socket 28 PLCC 3m PLCC-44-SMT-TT PLCC-20-SMT-TT PLCC-32-SMT-TT PLCC-44-SMTL-TT plcc socket 84 PLCC 3m PLCC-28-SMT-TT PLCC-84-SMT-TT PLCC-52-SMT-TT PLCC-68-SMT-TT

    Yamaichi IC51-0804-808

    Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
    Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


    Original     		PDF

    LCS-68

    Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
    Text: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


    Original     		PDF

    LCS-68

    Abstract: 821575-1 LCS-84 1-382320-7 821574-1
    Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


    Original     		PDF

    Yamaichi IC51-0444-1568

    Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
    Text: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production


    Original     		PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    2712 24PIN

    Abstract: 1123 FEMALE SOCKET 923345-02 20 pin plcc ic base 617-1070 922318 617-4309 923847-BK-B
    Text: 3M Test Clips, Solderless Breadboards and Jumper Wires SOIC* Test Clips Probe-It Clips Now normally hard-to-access SOICs can be connected to test probes quickly and easily without the risk of shorting out chips or damaging other board components. SOIC test clips are available in different pin sizes to accommodate a wide range of


    Original     		PDF 40-pin 48-pin 64-pin 2712 24PIN 1123 FEMALE SOCKET 923345-02 20 pin plcc ic base 617-1070 922318 617-4309 923847-BK-B

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    ansley 609-2641

    Abstract: M1710 609-0627 transistor SMD p04 171-10G M2331 3-1437061-9 609-1007 Augat 824-AG11D smd p08
    Text: PREFERRED PARTS CATALOGUE Click on appropriate product images for more info Y ANSLE ALCOSWITCH TR IAD AT G AU P R E F E R R E D P A R T S ◗ ANSLEY IDC SOCKETS 609 FEMALE SOCKET CONNECTOR Ansley® Female Socket Connector 0.76 µm Gold Plated Contacts 2.54mm x 2.54mm Centres


    Original     		PDF M178F-0500 M1110-P04 M1710-P09 M1710-P14 M2310-P24 M2310-P37 M1110-S04 M1710-S09 M1710-S14 M2310-S24 ansley 609-2641 M1710 609-0627 transistor SMD p04 171-10G M2331 3-1437061-9 609-1007 Augat 824-AG11D smd p08

    923884-20-I

    Abstract: EDGE22 922490-16-R solder strip 922594-16-R 922490-24-I 927739-20 923881-40-R EXTRACTOR TOOLS 33970
    Text: 3M Breadboards & Test Clips • A large choice of test clips including product for DIP ICs, Shrink DIPs, SOICs, PLCCs, and LCCs • Specialized clips for testing corroded or conformai coated devices • Cable assemblies for connecting to test instrumentation


    OCR Scan     		PDF 923832-BK-B 923832-BU-B 923832-GN-B 923832-RD-B 923832-WT-B 923832-YL-B 923837-BK-B 923837-GN-B 923837-RD-B 923837-WT-B 923884-20-I EDGE22 922490-16-R solder strip 922594-16-R 922490-24-I 927739-20 923881-40-R EXTRACTOR TOOLS 33970

    plcc socket 84 PLCC 3m

    Abstract: TS723 PLCC SOCKET 3M
    Text: OEM Production PLCC Sockets | : : • Accepts JEDEC PLCCs in Registration M 0-047 AA-AH - Visual polarizing,; PLCC corner, pin “ 1" I.D. • Underside orientation to P.C. board plastic post feature option • Contacts have discrete egress from socket bottom,


    OCR Scan     		PDF TS-75 800-32B-0411 plcc socket 84 PLCC 3m TS723 PLCC SOCKET 3M

    592p

    Abstract: berg plcc 7d8l 2E-1D
    Text: A B C NOTE: 6 8 POSITION S O C K E T SHOWN NEW RELEASE ADDED BERG PART NUMBER TO TABLE CHANGED INSERTION & WITHDRAWAL FORCE VALUES & WEIGHTS ON ALL PLCC SIZES 576 2048 2096 10 /1 4 /9 2 6 /2 7 /9 5 8 /4 /9 5 PCB LAYOUT PLCC B. D E A SY 10/5/92 PLCC— [ ]P — T


    OCR Scan     		PDF

    D-41453

    Abstract: 284-7166-71-1157 252-7164-71-3857 52521 DK-2600 244-7163-71-3857 MO047 plcc socket 84 PLCC 3m
    Text: 3M If. -fc U-^Ur-L^I Production Sockets Through Hole PLCC Physical Features Electrical • Accept JEDEC MO047 A/B PLCC • Low profile top extract type • Soldertails on 2.54mm square grid • Closed bottom eliminates bridging and solder wicking • Moulded in bottom stand-offs for


    OCR Scan     		PDF MO047 throug00 CH-8803 D-41453 284-7166-71-1157 252-7164-71-3857 52521 DK-2600 244-7163-71-3857 plcc socket 84 PLCC 3m

    SKs smd 69

    Abstract: smd SKs Z KS78 HLS8 1.27mm pitch connector smd lcc 28 socket PGA 145 socket TEXTOOL PGA DECOUPLING CAPACITOR TEXTOOL
    Text: ADVANCED INTERCONNECTIONS. Table of Contents 5 Energy Way, P.O. Box 1019, West Warwick, R[ 02893 USA Tel. 8 0 0 -4 2 4 -9 8 5 0 /4 0 1 -8 2 3 -5 2 0 0 Fax 401-823-8723 Email advintcorp@ aol.com • Internet http://ww w .advintcorp.com DIP Section pages 8 - 39


    OCR Scan     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: plcc socket 28 PLCC 3m how to make an electronics components testing board T9236 IC test CERAMIC LEADLESS CHIP CARRIER LCC 52 socket
    Text: * Test Clips and Accessories How to ensure the reliability and perform ance o f your PC board com ponents without dam aging the assemblies? 3M In te g ra te d -C irc u it te s t clips provide th e solution. Useful in prototype and production testing, quality control inspection and


    OCR Scan     		PDF

    PLCC84P

    Abstract: PLCC-84-P-T-2 PLCC-84P-T-2
    Text: r STANDARD FCI PART NUMBER OLD BERG PART NUMBER PERFORMANCE DATA DIMENSIONS JEDEC PKG. NUMBER A B C D E F G H J INSERTION EXTRACTION FORCE FORCE 1/ +.004 I +.004 LBF. MAX. (LBF. MIN.) ^ -.0 0 8 L -.0 0 8 WEIGHT (OUNCES) P L C C - 2 0 P -T 6 9 3 9 4 -0 2 0


    OCR Scan     		PDF

    44 pin jlcc socket

    Abstract: QILE-84P-410T LCS-68 821575-1 84P-410T
    Text: Selecting Sockets for J-Lead Packages A pplication Brief 46 M arch 1995, ver. 5 Introduction Altera offers ceramic and plastic J-lead chip carrier packages JLCC and PLCC for many devices to reduce the "real estate" demands of a system. These small packages are generally intended for surface mounting.


    OCR Scan     		PDF

    plcc socket 84 PLCC 3m

    Abstract: No abstract text available
    Text: Large PLCC Sockets Lidded style socket assures consistent normal force on PLCC leads for m axim um electrical reliability Solid lid with fixed foot height controls deflection Compliant leads accom m odate package planarity variations A lignm ent ribs fit between J-leads to assure proper


    OCR Scan     		PDF TS-0432-01 -290A 2-0068-05743-000-011-00X 2-0084-05756-000-011-00X 2-0100-05940-050-011-00X 2-0068-05743-000-011-00X 2-0084-05756-000-011-00X TS-0432-01 plcc socket 84 PLCC 3m

    ic51-1604-845-4

    Abstract: socket Yamaichi ic51 IC51 - 1052 - 13 LCS-68 fpq-240
    Text: Selecting Sockets for Altera Devices A pplication Note 80 June 1996, ver. 1 Introduction Altera offers a number of surface-mount packages. Surface-mount assem bly places unique dem ands on the developm ent and manufacturing process by requiring different CA D sym bols for printed circuit board


    OCR Scan     		PDF