Untitled
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : BODY ASSEMBLY - BRASS, GOLD PLATING (50 MIN THICK) CAP - BRASS, GOLD PLATING (50 MIN THICK) LOOSE CONTACT - BeCu, GOLD PLATING (50 MIN THICK) & ASSEMBLED CONTACT GASKET - SILICONE RUBBER
|
Original
|
M39012/56-4502
12-Aug-13
09-Jul-80
RG-400/U
142/U
|
PDF
|
PSM05
Abstract: No abstract text available
Text: SELECTIVE PLATING CHART CODE PLATING: SEE SELECTIVE PLATING CHART CONTACT AREA C-PRESS COMPLIANT SECTION & TAIL 192 .000030 .000050 MICROINCHES MIN. .000050 MIN GOLD OVER 0.00076 0.00127 NICKEL UNDERPLATE 0.00127 MIN. TIN-LEAD 195 .000030 .000050 MICROINCHES MIN.
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: NOTES: REV 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : OUTER & INNER FERRULE - COPPER, BRIGHT ACID TIN (200 MIN THICK) OUTER & INNER BODY - BeCu, GOLD PLATING (50 MIN THICK) CONTACT - BeCu, GOLD PLATING (50 MIN THICK) WASHER - PTFE INSULATOR
|
Original
|
1290-001P
08-Aug-13
14-Nov-91
AA2325
|
PDF
|
94HB led
Abstract: E107337
Text: MAXCONN BNC CONNECTORS MNF Series Right Angle, F-Connector PCB Mount Receptical Performance Specifications Materials and Finish Contact: Contact area 100–200 microinch tin/lead plating over 50 microinch nickle plating overall Ground Terminal: Tin plating over copper wire
|
Original
|
E107337
E145613
9400pF
32UNEF
94HB led
|
PDF
|
Untitled
Abstract: No abstract text available
Text: NOTES: 1. REVISIONS THIRD ANGLE PROJ. REV MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : OUTER & INNER FERRULE - COPPER, BRIGHT ACID TIN (200 MIN THICK) OUTER & INNER BODIES - BeCu, GOLD PLATING (50 MIN THICK) CONTACT - BeCu, GOLD PLATING (50 MIN THICK)
|
Original
|
ST5M1289
ST5M132
ST5M1290-001S
08-Aug-13
14-Nov-91
AA2325
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-220-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.200 999-11-220-10-000000
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-230-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.300 999-11-230-10-000000
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-112-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.200 999-11-112-10-000000
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-210-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-210-10-000000
|
Original
|
420-SEO,
UL94V-0
420-SEO
VRMS/150
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-210-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-210-10-000000
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-113-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.300 999-11-113-10-000000
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product Number: 999-11-110-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-110-10-000000
|
Original
|
|
PDF
|
g060
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER, WHITE BRONZE PLATING CONTACT -BERYLLIUM COPPER, GOLD PLATING INSULATORS - DELRIN k TEFLON FERRULE - COPPER, WHITE BRONZE PLATING 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM
|
OCR Scan
|
919-NM122P-51A
SIZ6AU-50
29-Ju
RG-178)
G\CNPD\919\NM
122P\51A-DSZ
g060
|
PDF
|
MCX6252
Abstract: 919-NM
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : PCB BODY - BERYLLIUM COPPER , GOLD PLATING BODY - BERYLLIUM COPPER , WHITE BRONZE PLATING (C O PPER-TIN -ZIN C ) CONTACT - BERYLLIUM COPPER , GOLD PLATING INSULATOR - TEFLON 2 . ELECTRICAL:
|
OCR Scan
|
919-NM
119J-51A
MCX6252B1-004-3GT30G-50
\DWG\CNPD\919\NM
119J\51ASZ
19J-51A
MCX6252
|
PDF
|
|
JM4001
Abstract: J 5027 636-3427 636-1027 transistor c9018 JM40
Text: PHYSICAL PROPERTIES N S U L A T 1O N GLASS MATERIAL REINFORCED RATED 9 4 V - 0; PHASE PROCESS THERMOPLASTIC INFRARED AND VAPOR COMPATIBLE BLACK COLOR CONTACT MATERIAL CONTACT PLATING PHOSPHOR 5 BRONZE MICROINCHES PLATING IN T IN -LEA D THE GOLD PLATING TERMINATION
|
OCR Scan
|
22-APR-96
JM4001
J 5027
636-3427
636-1027
transistor c9018
JM40
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 10 PLATING 6 7 4 9 0 -9 2 2 0 GOLD FLASH 6 7 4 9 0 -9 2 2 1 30 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 2 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 0 GOLD FLASH 6 7 4 9 0 -9 2 3 1 3 0 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 4 0
|
OCR Scan
|
5MMX15
SD-67490-002
|
PDF
|
U3-16
Abstract: No abstract text available
Text: / REVISIONS 919-NM104P-51A NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY AND CAP - BERYLLIUM COPPER , WHITE BRONZE PLATING (COPPER-TIN-ZINC) CONTACT -BERYLLIUM COPPER , GOLD PLATING INSULATORS - DELRIN & TEFLON FERRULE - COPPER , WHITE BRONZE PLATING (COPPER-TIN-ZINC)
|
OCR Scan
|
919-NM104P-51A
Oa-Aug-05
88A/U
316/U]
\DWG\CNPD\919\NM104P\51ASZ
U3-16
|
PDF
|
919-NM101P-51S
Abstract: No abstract text available
Text: REVISIONS 919—NM101P—51S NOTES: 1 . MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER , WHITE BRONZE PLATING (COPPER -T IN -Z IN C ) CONTACT - BERYLLIUM COPPER , GOLD PLATING INSULATOR - TEFLON FERRULE - COPPER , WHITE BRONZE PLATING (COPPER -TIN -Z IN C )
|
OCR Scan
|
919--NM101P--51S
MCX1121A
919-NM101P-51S
|
PDF
|
Untitled
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : HOUSING - BRASS, GOLD PLATING BODY - BERYLLIUM COPPER, GOLD PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 6 GHz C. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, MIN.
|
OCR Scan
|
CHANGED\RD--DM89011401B
1040601R3
CX1181A1
1181AAA45GE5F
919--120P--
\DWG\MCX\1181A1\085-50\3GT30GSZ-C
|
PDF
|
Untitled
Abstract: No abstract text available
Text: | NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - STAINLESS STEEL, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING LOCK WASHER,HEX NUT - BRASS, GOLD PLATING INSULATOR - PTFE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 1 2 . 4 GHz
|
OCR Scan
|
116251AASA1FV5F
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ECN REV 4032 4368 5742 - A B ELFH ASSEM B LY PART NU M B ER IN G SC H EM E ELFH G 1 1G = = = = BLACK, TIN PLATING GREEN, TIN PLATING BLACK, SELECTIVE GOLD PLATING GREEN, SELECTIVE GOLD PLATING STYLE 0 - HORIZONTAL 7 - VERTICAL CONTACT SPACING = .200"-
|
OCR Scan
|
E83421
-J----08-22
LR69703
ELFH08200
|
PDF
|
Untitled
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - PTFE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, MIN. 3. MECHANICAL:
|
OCR Scan
|
15-Feb-07
01-Mar-071
01-Mar-07
\DWG\SMA\1251A2\004\50\NT50G-5SZ
SMA1251A2-004-NT50G-50
111251AAAA4NE5F
|
PDF
|
Untitled
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER, WHITE BRONZE PLATING (COPPER-TIN-ZINC) CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - TELFON FERRULE - SEAMLESS COPPER, WHITE BRONZE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM
|
OCR Scan
|
903-NM291P-51A
-291Pâ
07-Sep-06'
\DWG\CNPD\903\NM291P\51-BSZ
RG-196/U
|
PDF
|
48675
Abstract: 8241F
Text: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE, NATURAL 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC - 4 GHz C. DIELECTRIC WITHSTANDING VOLTAGE:
|
OCR Scan
|
8241F,
Jul--11
\DWG\CNPD\31
\00-AFSZ
48675
8241F
|
PDF
|