PLATING Search Results

PLATING Result Highlights (5)

Part	Manufacturer	Description	Download
CN-ACPRREDAA0	Amphenol Cables on Demand	RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell	Datasheet
75967-113	Amphenol Communications Solutions	CTW MALE PIN, PLATED
10058831-110LF	Amphenol Communications Solutions	Connector PF version, 0.76 um Gold plating
10058835-1000LF	Amphenol Communications Solutions	Surface Mount version, 0.76 um Gold plating
10118678-412001LF	Amphenol Communications Solutions	BERGSTIK II .100 STACKING, DR, TIN PLATING

PLATING Price and Stock

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Microchip Technology Inc RFDS-PROCESS_CHG_PLATING PROCESS CHG - PLATING, Projected EOL: 2044-08-15
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	RFDS-PROCESS_CHG_PLATING			28 Weeks		1 - 10 - 100 - 1000 - 10000 -	Buy Now
ITT Interconnect Solutions PLATE,RETAINING,INSULATOR- PLATE, RETAINING, INSULATOR KNG2 / 227-1295-000 / Rack & Panel*
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	PLATE,RETAINING,INSULATOR-		304			1 - 10 $9.73 100 $7.55 1000 $6.72 10000 $6.49	Buy Now
ITT Interconnect Solutions PLATE,-RETAINING
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	PLATE,-RETAINING					1 - 10 $63.91 100 $58.46 1000 $58.46 10000 $58.46	Buy Now
ITT Interconnect Solutions PLATE,-COVER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	PLATE,-COVER					1 - 10 - 100 - 1000 - 10000 $3.36	Buy Now
ITT Interconnect Solutions PLATE,RETAININGINSULATORBK
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	PLATE,RETAININGINSULATORBK					1 - 10 $46.95 100 $33.32 1000 $33.32 10000 $33.32	Buy Now

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PLATING Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
Plating Standardization		Altera	CUSTOMER ADVISORY ADV0502 Serial Configuration Device Plating Standardization		Original	PDF

PLATING Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ka band high power fet amplifier schematic Abstract: No abstract text available Text: 0.25-µm mmW pHEMT 2MI Process Data Sheet 4.6 µm PLATING CAP TOP PLATE 2000 Å NITRIDE 0.75 µm FIRST METAL TaN RESISTOR T-GATE ACTIVE REGION OHMIC METAL EXCEPT VIA SEMI-INSULATING GaAs SUBSTRATE VIA UNDER CAP 0.25-µm 2MI Process Cross Section General Description	Original		PDF
Untitled Abstract: No abstract text available Text: CSD19535KCS www.ti.com SLPS484 – JANUARY 2014 CSD19535KCS, 100 V N-Channel NexFET Power MOSFET Check for Samples: CSD19535KCS FEATURES 1 • • • • • • • 2 Ultra-Low Qg and Qgd Low Thermal Resistance Avalanche Rated Pb-Free Terminal Plating	Original	CSD19535KCS SLPS484 CSD19535KCS, O-220	PDF
PR 302 Abstract: D3601-1 A384 Text: Pomona Model 3601 Die Cast Aluminum Box Painted, Size “D” MATERIALS: Screws: 4 each #4-40 x 6.35 1/4” Phillips pan head pr MS 35206-213 with blue zinc plating. Cover: 1.60 (.063) thick aluminum Alloy 1100-H14 Finish: Clear anodized per MIL-A-8625,	Original	1100-H14 MIL-A-8625, DOD-P-15328. \Release\DataSheets\FlukeDataSheet\d3601 PR 302 D3601-1 A384	PDF
M0139-01 Abstract: M0137-02 P0093-01 Text: CSD16410Q5A www.ti.com SLPS205A – AUGUST 2009 – REVISED MAY 2010 N-Channel NexFET Power MOSFETs Check for Samples: CSD16410Q5A FEATURES 1 • • • • • • • 2 Ultra Low Qg and Qgd Low Thermal Resistance Avalanche Rated Pb Free Terminal Plating	Original	CSD16410Q5A SLPS205A M0139-01 M0137-02 P0093-01	PDF
Untitled Abstract: No abstract text available Text: Product Number: 855-22-006-30-001101 Description: Interconnect Header Spring-Loaded Header Vertical Mount Double Row Surface Mount Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins Mill-Max Part Number	Original	C36000) C/885 2002/95Annex	PDF
smd diode marking 271 Abstract: SIPMOS N-channel Small-Signal-Transistor Text: BSP89 Rev. 2.1 SIPMOS Ò Small-Signal-Transistor Feature Product Summary • N-Channel VDS RDS on · Enhancement mode ID · Logic Level 240 V 6 W 0.35 A PG-SOT223 · dv/dt rated • Pb-free lead plating; RoHS compliant 4.5V rated lead plating; RoHS compliant	Original	BSP89 PG-SOT223 VPS05163 L6327: smd diode marking 271 SIPMOS N-channel Small-Signal-Transistor	PDF
MIL-C-15328 Abstract: D2401 Text: Pomona Model 2401 Size A Aluminum Box With Cover BNC TEE F-F-M MATERIALS: Connector: BNC M and BNC (F) Body: Tarnish Resistant Plating, Center Contact: Female - Gold Plated Beryllium Copper, Male – Gold Plated Brass Solder Turret Terminal Screws: Steel	Original	MIL-C-15328 1100-H14 \Release\DataSheets\FlukeDataSheet\d2401 D2401	PDF
marking code 8A Abstract: marking WM EN6100-4 Text: LESHAN RADIO COMPANY, LTD. LGSMF05CT1G Thyristor Surge Protective Devices MECHANICAL CHARACTERISTICS Features z z z z z z z Molded JEDEC SOT-563 Package Weight 3 milligrams Availble in Lead-Free Nickel-Paladium-Gold Plating Solder Reflow Temperature: Nicker-Paladium-Gold	Original	LGSMF05CT1G OT-563 40kilovolts EIA-481. SESMF05C-T7 Suffix-T13 SESMF05C-T13. SESMF05C-P-T-7. Rev1-9/05 marking code 8A marking WM EN6100-4	PDF
Untitled Abstract: No abstract text available Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 6 5 4 3 2 RELEASED FOR PUBLICATION LOC 1 REVISIONS DIST ALL RIGHTS RESERVED. P L SIGNAL CONTACT TYP REF 10.80 LTR DESCRIPTION DATE DWN APVD 10 TYP D D 2.5 TYP 1.25 TYP M CONTACT AREA TYP REF GOLD PLATING THIS SIDE ONLY	Original		PDF
Untitled Abstract: No abstract text available Text: Product Number: 801-43-006-10-012000 Description: Interconnect Socket .100 Grid; Straight Socket Low Profile Single Row Through Hole Accepts .025-.037 .025 sq post Leads Plating Code: 43 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel Inner Contact Plating:	Original	C17200) 2002/95Annex CG933, CG-933 VRMS/150	PDF
1-163082-0 Abstract: 1-163081-1 108-10042 Text: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 3 1 2011 LOC REVISIONS DIST B ALL RIGHTS RESERVED. - COPYRIGHT 2011 2 - P LTR DESCRIPTION AY DATE ECR-12-010700 DWN MJG 11/06/12 APVD JB 31.5 SPRING PIN BODY SEE TABLE D B 9 D A PLATING ZONES ZONE 3	Original	ECR-12-010700 EIA/ECA-364-100T A200779 1-163082-0 1-163081-1 108-10042	PDF
Untitled Abstract: No abstract text available Text: F-212 MEC1–130–02–L–D–EM2 MEC1–120–02–F–D–EM2 1,00mm .03937" MEC1–120–02–L–D–RA1–SL MEC1-RA, MEC1-EM SERIES RIGHT ANGLE/EDGE MOUNT SOCKETS Mates with: (1,60mm) .062" card MEC1 1 CARD SLOT POSITIONS PER ROW PLATING OPTION D	Original	F-212	PDF
W1206R Abstract: PCF-W1206LF W0805LF PCF04 PCF0402 JIS-C-5202-5 Text: Precision Thin Film Nichrome Chip Resistor PCF Series IRC Advanced Film Division Solder or Matte tin Plating • TCR to ±5 ppm/°C • Tolerances to ±0.01% • Wide ohmic range 1 to 2.0M Glass • Available in seven industry standard sizes • Both RoHS compliant Pb-free terminations and Sn/Pb terminations	Original	W1206LF, W2010LF, W2512LF 100ppm/ 50ppm/ 25ppm/ 10ppm/ W1206R PCF-W1206LF W0805LF PCF04 PCF0402 JIS-C-5202-5	PDF
Untitled Abstract: No abstract text available Text: SMD-FST Non resettable fuses www.schurter.com/pg01_2 Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating IEC 60127-2 • 250 VAC · Time-Lag T Description - Directly solderable on printed circuit boards - L = Low Breaking Capacity - For rated current 1 A to 16 A, SMD-SPT is recommended	Original	com/pg01 250VAC E41599 11Plastic 22Blister	PDF

Untitled Abstract: No abstract text available Text: CSD18504Q5A www.ti.com SLPS366 – JUNE 2012 40V N-Channel NexFET Power MOSFETs Check for Samples: CSD18504Q5A FEATURES 1 • • • • • • • • 2 PRODUCT SUMMARY Ultra Low Qg and Qgd Low Thermal Resistance Avalanche Rated Logic Level Pb Free Terminal Plating	Original	CSD18504Q5A SLPS366	PDF
BHD-C1-XX-RA-XX Abstract: No abstract text available Text: 1 2 3 4 5 6 7 SPECIFICATIONS Contact Material: Insulator Material: Contact Plating: Contact Resistance: Insulator Resistance: Current Rating: Withstanding: Operating Temp: A B Poles 12 14 16 18 20 24 26 28 30 32 34 36 40 42 44 46 48 50 60 64 Brass NY6T UL94V-0	Original	UL94V-0 1000M BHD-C1-XX-RA-XX	PDF
Untitled Abstract: No abstract text available Text: RQ3E130MN Nch 30V 13A Power MOSFET Datasheet lOutline VDSS 30V RDS on at 10V (Max.) 8.1mW RDS(on) at 4.5V (Max.) 11.6mW ID 13A PD 2.0W lFeatures HSMT8 lInner circuit 1) Low on - resistance. 3) Pb-free lead plating ; RoHS compliant (1) Source (2) Source (3) Source	Original	RQ3E130MN E130MN R1102A	PDF
Untitled Abstract: No abstract text available Text: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANDUIT CORP. d b NOTES: LCMB 25-10 25r/16f F CERTIFIED LISTED Wire Connector 1. Material: High conductivity seamless copper tube. 2. Plating: Parts are annealed and tin plated.	Original	25r/16f 2003/IEC 10-25mm 12J036BH/00 12J036BH-JC/00 12J036BH-JC	PDF
CFPC-050-AE3-XX-RB-XX Abstract: No abstract text available Text: 1 2 3 4 5 6 7 8 9 A A B SPECIFICATIONS Operating Voltage: Current Rating: Contact Resistance: Insulation Resistance: Housing: Lock: Solder: Terminal: Plating: Withstanding: Operating Temp: C B 100V AC Max. 0.5Amp Max. 30mΩ Max. 500MΩ Min. PA66 UL94V-0	Original	UL94V-0 CFPC-050-AE3-XX-RB-XX CFPC-050-AE3-XX-RB-XX	PDF
CTJ-8-08-H-BK-PX-XX Abstract: No abstract text available Text: 1 2 3 4 5 6 7 8 9 SPECIFICATIONS Housing material: PBT with glass fiber, UL94V-0 Contact material: Phosphor bronze 0.35mm Contact plating: Gold on contact area Tin on tails A A Conforms to FCC rules and regulations Part 68, Subpart F B B C C D D E E Series	Original	UL94V-0 CTJ-8-08-H-BK-PX-XX CTJ-8-08-H-BK-PX-XX	PDF
CTJ-8-08-3030-BK-PX-FS Abstract: No abstract text available Text: 1 2 3 4 5 6 7 8 9 A A SPECIFICATIONS Plastic Housing: Contacts: Plating: B Shield: Thermoplastic UL94V-0 .35mm Phosphor Bronze Gold over Nickel in contact Tin over Nickel in solder Brass w/ Nickel Plating B C C D D E E Series CTJ Modular phone jack F Position	Original	UL94V-0 CTJ-8-08-3030-BK-PX-FS CTJ-8-08-3030-BK-PX-FS	PDF
Untitled Abstract: No abstract text available Text: CO NOTES: 1 .MATERIAL: HOUSiNG : THERMOPLASTIC CONTACT : COPPER ALLOY. SHELL : COPPER ALLOY. CD O O + ü 15.2 0 1 4.50 2 .FINISH: CONTACT: GOLD PLATING SEE TABLE ON CONTACT AREA TIN-LEAD ON SOLDER TAILS. NICKEL UNDERPLATED OVER ALL SHELL: NICKEL PLATING OVER COPPER.	OCR Scan	36Kg/R	PDF
Untitled Abstract: No abstract text available Text: 7 T H IS DRAW ING COPYRIGHT IS U N P U B L IS H E D . - R E LEA S E D BY TYCO ELECTRONICS CORPORATION. ALL FOR 6 5 PU B LIC ATIO N RIG HTS R E S ER V ED . D SEE TABLE C 100 0 ,006(s) -e .040 + .003 DIA TYP RECOMMENDED HOLE SIZE BEEORE PLATING 0.O452 + .OO1O TYP	OCR Scan	10OCL,	PDF
Untitled Abstract: No abstract text available Text: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd \| - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry	OCR Scan	UFRG30120 Sn/15 Sn/37 UFRG301	PDF

PLATING Search Results

PLATING Result Highlights (5)

PLATING Price and Stock

Microchip Technology Inc RFDS-PROCESS_CHG_PLATING

ITT Interconnect Solutions PLATE,RETAINING,INSULATOR-

ITT Interconnect Solutions PLATE,-RETAINING

ITT Interconnect Solutions PLATE,-COVER

ITT Interconnect Solutions PLATE,RETAININGINSULATORBK

PLATING Datasheets (1)

PLATING Datasheets Context Search

ka band high power fet amplifier schematic

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PR 302

M0139-01

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smd diode marking 271

MIL-C-15328

marking code 8A

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1-163082-0

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W1206R

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BHD-C1-XX-RA-XX

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CFPC-050-AE3-XX-RB-XX

CTJ-8-08-H-BK-PX-XX

CTJ-8-08-3030-BK-PX-FS

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