ka band high power fet amplifier schematic
Abstract: No abstract text available
Text: 0.25-µm mmW pHEMT 2MI Process Data Sheet 4.6 µm PLATING CAP TOP PLATE 2000 Å NITRIDE 0.75 µm FIRST METAL TaN RESISTOR T-GATE ACTIVE REGION OHMIC METAL EXCEPT VIA SEMI-INSULATING GaAs SUBSTRATE VIA UNDER CAP 0.25-µm 2MI Process Cross Section General Description
|
Original
|
|
PDF
|
microphone connector
Abstract: No abstract text available
Text: 0.47 0.86 3/8-32 UNEF-2B THREAD 0.33 0.42 0.187 MAX CABLE NOTES: 0.31 1. MATERIALS: SCREW - STEEL, NICKEL PLATED HOUSING - BRASS, NICKEL PLATED SPRING - STEEL, NICKEL PLATED WASHER - PHENOLIC EYELET - BRASS, TIN PLATED COUPLING RING - NICKEL PLATED 2. ALL DIMENSIONS REFERENCE UNLESS OTHERWISE SPECIFIED.
|
Original
|
5501FX
502-5501FX
microphone connector
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Specifications: 1. Color: Black 2. Insulator: Polyacetal 3. Jack Body: Brass, nickel plated 4. Nut: Brass, nickel plated 5. Voltage: 500V 6. Current: 36A max. 7. Temperature: -20°C to +80°C Mounting Hole Tolerances Unless Otherwise Specified Fractions ± 1/32
|
Original
|
|
PDF
|
9940
Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
Text: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current
|
Original
|
J-STD-020
AEC-Q200
MAL215099.
9991trademarks
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
9940
mal215099xxxe3
MAL215099
99101E3
99804E3
150631-2
99103E3
99515E3
99603E3
MAL215
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Ceramic Plate Series CP10,254,06 Wired in Series Innovative Technology for a Connected World Thermoelectric Modules The Ceramic Plate CP Series of Thermoelectric Modules (TEMs) is considered ‘the standard’ in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available
|
Original
|
|
PDF
|
MIL-C-15328
Abstract: D2401
Text: Pomona Model 2401 Size A Aluminum Box With Cover BNC TEE F-F-M MATERIALS: Connector: BNC M and BNC (F) Body: Tarnish Resistant Plating, Center Contact: Female - Gold Plated Beryllium Copper, Male – Gold Plated Brass Solder Turret Terminal Screws: Steel
|
Original
|
MIL-C-15328
1100-H14
\Release\DataSheets\FlukeDataSheet\d2401
D2401
|
PDF
|
RG-142 cable
Abstract: No abstract text available
Text: SMA 50 Ohm - Reverse Thread Straight Crimp Type Bulkhead Jack Solder or Crimp Captivated Contact CABLE TYPE RG-316/U, 188, 174, 161 LMR-100, HPF-100, RF-100 GOLD PLATED 142-5303-401 INCHES MILLIMETERS CUSTOMER DRAWINGS AVAILABLE UPON REQUEST NICKEL PLATED
|
Original
|
RG-316/U,
LMR-100,
HPF-100,
RF-100
LMR-100
WW-T-799
QQ-B-613,
MIL-G-45204
QQ-N-290
QQ-B-626
RG-142 cable
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 50 Ohm SMB PC Mount Straight Jack Receptacle INCHES MILLIMETERS CUSTOMER DRAWINGS AVAILABLE UPON REQUEST Mounting hole layout "A" GOLD PLATED NICKEL PLATED .155 (3.94) 131-3701-201 131-3701-206 Emerson Network Power Connectivity Solutions 299 Johnson Avenue SW, Waseca, MN 56093 • 800 -247- 8256 • +1 (507) 833-8822 • www.EmersonConnectivity.com
|
Original
|
RG-178
QQ-N-290
QQ-B-626
QQ-B-750,
MIL-G-45204
QQ-N-290.
MIL-C-39012
|
PDF
|
water termination of high voltage
Abstract: No abstract text available
Text: FEATURES PROFESSIONAL LED INDICATORS Ø 8.1mm Mounting 502 SERIES Nickel plated brass housing PACK QUANTITY = 10 PIECES Sealed to IP67 Water clear lens for good on/off contrast ratio Internally potted for use in high vibration applications Internal reverse protection diode fitted as standard in all
|
Original
|
|
PDF
|
5SLA 3600E170300
Abstract: 5SYA2039 3600E170300
Text: Data Sheet, Doc. No. 5SYA 1416-03 06-2012 5SLA 3600E170300 HiPak Single DIODE Module VRRM = 1700 V IF = 3600 A Ultra low-loss, rugged SPT+ diode Smooth switching SPT+ diode for good EMC AlSiC base-plate for high power cycling capability AlN substrate for low thermal resistance
|
Original
|
3600E170300
C9113
CH-5600
5SLA 3600E170300
5SYA2039
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Product catalog | Terminals | Tension clamp technology | Accessories | End and partition plates | Modular feed-through terminals | ZAP/TW 2 General ordering data Order No. Part designation Version EAN Qty 1608770000 ZAP/TW 2 DB Modular terminal, accessories, end plate and
|
Original
|
EC000886
|
PDF
|
HP04
Abstract: No abstract text available
Text: HP-16 HP-12 HP-08 HP-06 HP-04 SPC Type No. 1" 3/4" 1/2" 3/8" 1/4" Hole Size SPECIFICATIONS: 1. Material: Steel 2. Finish: Nickel Plated SPC SPC TECHNOLOGY
|
Original
|
HP-04
HP-06
HP-08
HP-12
HP-16
HP04
|
PDF
|
BU-25C
Abstract: Mueller Electric Company
Text: Part Number: BU-25/BU-25C Description: Automotive Clip 4106 • • • • • • • • Automotive clip Teeth mesh on three sides of jaw Can be attached by crimp or screw connection Material: BU-25 - zinc-plated steel BU-25C - solid copper Rating: o 40 Amps – BU-25
|
Original
|
BU-25/BU-25C
BU-25
BU-25C
BU-26
Mueller Electric Company
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION LOC DIST REVISIONS GP 00 ALL RIGHTS RESERVED. BY TYCO ELECTRONIC5 CORPORATION. LTR B A HOUSING: CONTACT: D A NICKEL GOLD F I L LE D PHOSPHOR PLATE: PLATE: DATE REVISED PER EC 0 5 1 2 - 0 4 6 7 - 0 5
|
OCR Scan
|
14N0V99
14-N0V99
14-N0V99
MAR2000
|
PDF
|
|
|
JC code
Abstract: No abstract text available
Text: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT D 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. FT R E V IS IO N S DIST MATERIAL: HOUSING: THERMOPLASTIC, UL94V-0, BLACK. TERMINALS: COPPER ALLOY, TIN PLATED. SCREWS: 6 - 3 2 STEEL, ZINC PU\TED AND CHROMATED.
|
OCR Scan
|
UL94V-0,
407--XX
31MAR2000
JC code
|
PDF
|
TID136
Abstract: TID139 N6040
Text: TYPES TID135, TID136, TID139 THRU TID144 SILICON DIODE ARRAYS B U L L E T IN N O . D L -S 7 3 11 7 0 7, A P R IL 1 9 7 2 - R E V IS E D M A R C H 1973 L O G IC A N D C O R E -D R IV E R D IO D E A R R A Y S For Application With Magnetic Cores • Plated-Wire Memories
|
OCR Scan
|
TID135,
TID136,
TID139
TID144
TID136
N6040
|
PDF
|
1734290-2
Abstract: No abstract text available
Text: D DIM D+0.36 c 7.00 0.20 16.30 RECOMMENDED PCB LAYOUT • B - NOTES: 1. MATERIAL: HOUSING : THERMOPLASTIC HIGH TEMP., UL94V-0, COLOR: BLACK CONTACT : BRASS, THICKNESS=0.25mm. SHELL : PHOSPHOR BRONZE, THECKNESS=0.40m m. 2. FINISH : CONTACT : 3 0 u ” MIN. GOLD PLATED ON CONTACT AREA,
|
OCR Scan
|
UL94V-0,
23--DEC--
25DEC
1734290-2
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 3.0mm Pitch, Plug Assembly 8 Position, Material and Finish : Housing — Thermoplastic UL94V-0 rated, black Contact — Copper Alloy, Nickel-plated all over, tin-lead plated on soldering area Housing
|
OCR Scan
|
UL94V-0
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT D 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. FT R E V IS IO N S DIST MATERIALS: HOUSING: POLYAMIDE, BLACK, UL94V-0. TERMINALS: COPPER ALLOY, TIN PLATE. SCREWS: ZINC PLATED, STEEL WITH CLEAR CHROMATE.
|
OCR Scan
|
UL94V-0.
31MAR2000
|
PDF
|
OV 5693
Abstract: No abstract text available
Text: / j \ HOUSING & TINE PLATE - LIQUID CRYSTAL POLYMER LC P , UL 9 4 V —0 , BLACK. 2. CONNECTOR SOLDER TAILS WILL ACCOMMODATE PRINTED CIRCUIT BOARD THICKNESS OF 0 .8 TO 1.6 [.0 3 1 TO .0 6 3 ], ^ G, J, H INDICATE NUMBER OF POSITION MARKED ON ASSEMBLY. ALSO SEE TABLE.
|
OCR Scan
|
|
PDF
|
Y14SM
Abstract: No abstract text available
Text: 5 P £ C lF iC V .T iO N 5 : MATERIALS: CASE: HIGH TEMPERATURE POLYESTER. ACTUATOR BUTTON: POLYAMIDE. COLOR: SEE CHART BELOW. MOVING CONTACT: CCPPER ALLOY, GOLD PLATE. FIXED CONTACT/TERMINAL: CCPPER ALLOY. TIM/LEAO PLATC. TERMINAL SEAL: EPOXY. r~ —'——
|
OCR Scan
|
|
PDF
|
440360-1
Abstract: C-440360
Text: 35 48.00 01.40 @0.80X601 6.55 0.60 ALL CONTACTS & LATCH PEGS. fill m +0.25 T +0-25 7.95 -0.125 55.95-0.125 NOTE : 1. MATERIAL HOUSING : HIGH TEMPARETURE THERMOPLASTIC, UL 94V-0, BLACK COLOR CONTACT : COPPER ALLOY LATCH : STEEL 2. FINISH CONTACT : 0.25um MIN. GOLD PLATED ON CONTACT,
|
OCR Scan
|
80X601
05-AUG-2002
C-440360
440360-1
C-440360
|
PDF
|
TID126
Abstract: TID121 TID129 TID126 application
Text: TYPES TID2IA THRU TID26A, TID29A, TID30A, TID121 THRU TID126, TID129 THRU TID134 SILICON DIOOE ARRAYS B U L L E T IN N O . D L -S 7 0 1 1 3 2 5 , M A R C H 1 9 7 0 C O R E -D R IV E R D IO D E A R R A Y S For Application With Magnetic Cores • Plated-Wire Memories
|
OCR Scan
|
TID26A,
TID29A,
TID30A,
TID121
TID126,
TID129
TID134
TID126
TID126 application
|
PDF
|
tcs1f
Abstract: No abstract text available
Text: SYSTEMS INTERFACE CIRCUITS TYPES SN55244, SN75244 A-C-COUPLED FOUR-CHANNEL SENSE AMPLIFIERS B U L L E T I N N O . D L -S 7 3 1 2 0 6 0 , S E P T E M B E R 1 9 7 3 IDEAL FOR PLATED-WIRE, TH IN-FILM , AND OTHER HIGH-SPEED LOW-LEVEL SENSING APPLICATIONS • Input Threshold Level . . . 0.7 mV Typical
|
OCR Scan
|
SN55244,
SN75244
SN55244
tcs1f
|
PDF
|
