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    PLASTIC PIN GRID ARRAY UBM Search Results

    PLASTIC PIN GRID ARRAY UBM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TRS10E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS6E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 6 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS3E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 3 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation

    PLASTIC PIN GRID ARRAY UBM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


    Original     		PDF

    Pb95Sn5

    Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
    Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377


    Original     		PDF DS2411: DS2415: DS2417: DS2432: DS2433: DS2502: DS2760: DS2761: DS2762: DS9503: Pb95Sn5 pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37

    LM120 model SPICE

    Abstract: crystal Oscillator AGC MOTOROLA ECL DS26C32 SO space qualified synthesizer mil national semiconductor cmos databook LP2953* spice 0.35 micron amps MODEL PARAMETERS SPICE CLC409 CLC520
    Text: VOLUME NO. 12 1997 Wireless Secure Communications M ilitary tactical and satellite networks and radios are tasked with handling ever greater amounts of data and voice traffic – often over existing channels. As advanced modulation techniques, coding, compression, and encryption techniques are developed,


    Original     		PDF LM120 LM136 LM137 LM140 LM185 LM2940 LM2941 LM2990 LM2991 LM3940 LM120 model SPICE crystal Oscillator AGC MOTOROLA ECL DS26C32 SO space qualified synthesizer mil national semiconductor cmos databook LP2953* spice 0.35 micron amps MODEL PARAMETERS SPICE CLC409 CLC520

    pcb warpage in ipc standard

    Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
    Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.


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    WLCSP stencil design

    Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
    Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages


    Original     		PDF SBVA017 300mm MO-211 WLCSP stencil design ja 16201 WLCSP smt Texas wcsp wcsp reliability A104B IPC-7525 JESD22 S2062

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    JESD51-9

    Abstract: Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC
    Text: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com MicroCSP Wafer Level Chip Scale Package by John Jackson and Alan O’Donnell • GENERAL DESCRIPTION


    Original     		PDF AN-617 EIA-481-C, AN03272-0-6/07 JESD51-9 Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC

    Untitled

    Abstract: No abstract text available
    Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE


    Original     		PDF AN-617 AN03272-0-5/12

    Board Level

    Abstract: AMPHENOL HE 508 amphenol HiLinX ute 93-424
    Text: Board Level Interconnect products Amphenol 2 "NQIFOPMt#PBSE-FWFM Interconnect products Table of Contents About Amphenol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4


    Original     		PDF DOC-000090-ANG Board Level AMPHENOL HE 508 amphenol HiLinX ute 93-424

    Untitled

    Abstract: No abstract text available
    Text: 64Mb, 3V, Multiple I/O Serial Flash Memory Features Micron Serial NOR Flash Memory 3V, Multiple I/O, 4KB Sector Erase N25Q064A Features • • • • • • • • • • • • Write protection – Software write protection applicable to every 64KB sector via volatile lock bit


    Original     		PDF N25Q064A BA17h) 09005aef845665f4

    B744A

    Abstract: Bluetooth IC GFSK PCF2600 PCF26002 BT 816 transistor philips rf manual UAA3558 PCF26100 PCF26100ET
    Text: INTEGRATED CIRCUITS DATA SHEET PCF26100 Bluetooth Adapter IC Preliminary specification File under Integrated Circuits, IC17 2001 Jun 19 Philips Semiconductors Preliminary specification Bluetooth Adapter IC PCF26100 CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION


    Original     		PDF PCF26100 PCF26100 403506/01/pp28 B744A Bluetooth IC GFSK PCF2600 PCF26002 BT 816 transistor philips rf manual UAA3558 PCF26100ET

    Untitled

    Abstract: No abstract text available
    Text: 64Mb, 3V, Multiple I/O Serial Flash Memory Features Micron Serial NOR Flash Memory 3V, Multiple I/O, 4KB Sector Erase N25Q064A Features • • • • • • • • • • • • Write protection – Software write protection applicable to every 64KB sector via volatile lock bit


    Original     		PDF N25Q064A BA17h) 09005aef845665f4

    ic 555 timer 10 minute

    Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
    Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin

    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		PDF AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition

    Untitled

    Abstract: No abstract text available
    Text: 64Mb, 1.8V, Multiple I/O Serial Flash Memory Features Micron Serial NOR Flash Memory 1.8V, Multiple I/O, 4KB Sector Erase N25Q064A Features • • • • • • • • • • • • • Write protection – Software write protection applicable to every


    Original     		PDF N25Q064A BB17h) 09005aef845665ea

    lm78l05

    Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611
    Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM78L05IBP AN-1112 LM78L05 zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611

    "M-ary orthogonal keying"

    Abstract: 24C08 code example "complementary code" "Complementary Code Keying"
    Text: ISL3873A TM Data Sheet June 2001 File Number 8015.1 Wireless LAN Integrated Medium Access Controller with Baseband Processor Features The Intersil ISL3873A Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor is part of the PRISM 2.4GHz radio


    Original     		PDF ISL3873A ISL3873A HFA3783) ISL3685) HFA3983) "M-ary orthogonal keying" 24C08 code example "complementary code" "Complementary Code Keying"

    DSSS transceiver chips correlator

    Abstract: "Complementary Code Keying" dsss demodulator HFA3783 HFA3983 ISL3685 ISL3873 ISL3873IK ISL3873IK96 rake complex
    Text: ISL3873 TM Data Sheet February 2001 File Number 4868.2 Wireless LAN Integrated Medium Access Controller with Baseband Processor New Features of the ISL3873 The Intersil ISL3873 Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor


    Original     		PDF ISL3873 ISL3873 HFA3783) ISL3685) HFA3983) DSSS transceiver chips correlator "Complementary Code Keying" dsss demodulator HFA3783 HFA3983 ISL3685 ISL3873IK ISL3873IK96 rake complex

    military relay

    Abstract: BGA-3000 AN-1112 LMC6035 LMC6035IBP LMC6035IBPX Lay out of 10 Bump Micro smd package CD laser pickup assembly
    Text: ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy


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    PRISM isl3873

    Abstract: 2.4Ghz RF Remote control transmitter receiver cir HFA3783 HFA3983 ISL3685 ISL3873 ISL3873IK ISL3873IK96 microsoft 2.4GHz transceiver DSSS transceiver
    Text: ISL3873 TM Data Sheet September 2000 File Number 4868.1 Wireless LAN Integrated Medium Access Controller with Baseband Processor New Features of the ISL3873 The Intersil ISL3873 Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor is


    Original     		PDF ISL3873 ISL3873 HFA3783) ISL3685) HFA3983) PRISM isl3873 2.4Ghz RF Remote control transmitter receiver cir HFA3783 HFA3983 ISL3685 ISL3873IK ISL3873IK96 microsoft 2.4GHz transceiver DSSS transceiver

    TB394

    Abstract: rake receiver baseband frequency correction equalizer pcf 7946 ISL3685 Residual automatic frequency control errors equalizer rake receiver DSSS transceiver 20dB processing gain HFA3783 rake complex ISL3873A ISL3873AIK
    Text: ISL3873A TM Data Sheet September 2001 File Number 8015.2 Wireless LAN Integrated Medium Access Controller with Baseband Processor Features The Intersil ISL3873A Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor is part of the PRISM 2.4GHz radio


    Original     		PDF ISL3873A ISL3873A HFA3783) ISL3685) HFA3983) CH-1009 TB394 rake receiver baseband frequency correction equalizer pcf 7946 ISL3685 Residual automatic frequency control errors equalizer rake receiver DSSS transceiver 20dB processing gain HFA3783 rake complex ISL3873AIK

    "Complementary Code Keying"

    Abstract: ISL3783 "complementary code"
    Text: ISL3873B TM Data Sheet P RE L I M I N A RY September 2001 File Number 8019.1 Wireless LAN Integrated Medium Access Controller with Baseband Processor Features The Intersil ISL3873B Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor


    Original     		PDF ISL3873B ISL3873B HFA3783) ISL3685) HFA3983) CH-1009 "Complementary Code Keying" ISL3783 "complementary code"

    DSSS transceiver 20dB processing gain

    Abstract: PN generator circuit dsss 24C08 code example 45DB011 ISL3873B DPSK DSSS IC 24c08 contain IC 24c08 data sheet pn sequence generator modulator DBPSK
    Text: ISL3873B Data Sheet P RE L I M I N A RY June 2002 FN8019.2 Wireless LAN Integrated Medium Access Controller with Baseband Processor Features The Intersil ISL3873B Wireless LAN Integrated Medium Access Controller with Integrated Baseband Processor is part of the PRISM® 2.4GHz radio


    Original     		PDF ISL3873B FN8019 ISL3873B HFA3783) ISL3685) HFA3983) DSSS transceiver 20dB processing gain PN generator circuit dsss 24C08 code example 45DB011 DPSK DSSS IC 24c08 contain IC 24c08 data sheet pn sequence generator modulator DBPSK