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    PLASTIC PACKAGE MOISTURE INDUCED CRACKING Search Results

    PLASTIC PACKAGE MOISTURE INDUCED CRACKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PLASTIC PACKAGE MOISTURE INDUCED CRACKING Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    PLASTIC PACKAGE MOISTURE INDUCED CRACKING National Semiconductor Plastic Package Moisture-Induced Cracking Original PDF

    PLASTIC PACKAGE MOISTURE INDUCED CRACKING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MIL-D-3464 type 1

    Abstract: MIL-D-3464 MIL-D-3464 type 1 and 2 MILD-3464 MIL-D3464 Furnace
    Text: Plastic Package Moisture-Induced Cracking Introduction With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where


    Original     		PDF

    JEDEC J-STD-033b

    Abstract: MIL-D-3464 type 1 MIL-D-3464 MIL-D-3464 type 1 and 2 J-STD-033B MIL-B-81705 MILD-3464 LEAD FRAME SURFACE MOUNT QFP JEDEC tray MIL-D-3464 type 2
    Text: Plastic Package Moisture-Induced Cracking Introduction Problem Summary With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where


    Original     		PDF CSP-9-111S2) CSP-9-111S2. JEDEC J-STD-033b MIL-D-3464 type 1 MIL-D-3464 MIL-D-3464 type 1 and 2 J-STD-033B MIL-B-81705 MILD-3464 LEAD FRAME SURFACE MOUNT QFP JEDEC tray MIL-D-3464 type 2

    kc 2462

    Abstract: ED36 symposium ED-36 gunn diode datasheet Betel d 1878 transistors A102
    Text: ADI Reliability Handbook Table XII. 1200 ؎500 ppm 38 @ 90% C.I. ELFR FIT Rate No Failures Occurred in Other Stress Tests Conducted, e.g., HAST, T/C, etc. The ppm figure obtained in Table XII was at the time of qualification and based on a limited sample size. Recent figures based on statistically valid sample sizes indicate that the ELFR is running at less


    Original     		PDF

    CQ208

    Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
    Text: HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP. The TQFP package has a nominal thickness of only


    Original     		PDF PF144 CF160 PQ208 CQ208 PB256 CQ208 CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84

    CERAMIC QUAD FLATPACK CQFP 14 pin

    Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
    Text: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.


    Original     		PDF CF160 PQ208 CQ208 PB256 CERAMIC QUAD FLATPACK CQFP 14 pin CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208

    G004

    Abstract: ipc-sm-786A MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-786 research and development procedure in electronics industry P-21373
    Text: MOISTURE CONTROL MEASURES for Epoxy Encapsulated Surface Mount Magnetic Components Extending Pulse’s Commitment to a Quality Partnership 1996, Pulse Engineering, Inc. G004 EXECUTIVE SUMMARY The Situation Over the past decade, the transition from through-hole to SMT production techniques has revealed quality


    Original     		PDF

    ipc-sm-786A

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 J-STD-020 ipc-sm-786A

    200B

    Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 200B AN598 DK-2750 RG41 popcorn defect analysis to-220

    tm 1628 smd

    Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 DS00599B-page tm 1628 smd AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN

    Untitled

    Abstract: No abstract text available
    Text: TECHNICAL INFORMATION ASSEMBLY INDUCED DEFECTS by John Maxwell AVX Corporation Abstract: Surface mount technology holds many benefits but there is no room for sloppy practices; SMT assemblies need the control that semiconductor processing uses. Extreme care must be taken at


    Original     		PDF S-AIND00M900-R

    G017

    Abstract: als244c hipotted IPC-TP-787 perkin cte table E5007 IPC-SM-786 PE-68051 PE-69037
    Text: OPTIMIZING SOLDER JOINT RELIABILITY for Surface Mount Magnetic Components Pulse’s Mechanical Design for Thermal Expansion and Optimal Lead Compliance Deliver Empirically-Measurable Solder Joint Reliability 1998, Pulse Engineering, Inc. G017.A © 1998, Pulse Engineering, Inc.


    Original     		PDF

    water jet cutting machine circuit

    Abstract: No abstract text available
    Text: TECHNICAL INFORMATION ASSEMBLY INDUCED DEFECTS by John Maxwell AVX Corporation Abstract: Surface mount technology holds many benefits but there is no room for sloppy practices; SMT assemblies need the control that semiconductor processing uses. Extreme care must be taken at


    Original     		PDF com1496 S-AIND00M900-R water jet cutting machine circuit

    AN1260

    Abstract: A112 A113
    Text: MOTOROLA Order this document by AN1260/D SEMICONDUCTOR TECHNICAL DATA AN1260 Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown INTRODUCTION This information provides Motorola customers with the


    Original     		PDF AN1260/D AN1260 AN1260/D* AN1260 A112 A113

    Moisture Sensitivity Levels MICROCHIP PIC Package

    Abstract: 78610 delamination leadframe barber excursion AN598
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 Moisture Sensitivity Levels MICROCHIP PIC Package 78610 delamination leadframe barber excursion AN598

    1n4733 smd

    Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 DS00599B-page 1n4733 smd moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on

    g28 SOT23

    Abstract: weston 461 st 95160 9418 transistor TO-92 9742 9943 so-8 9418 transistor 9806 9928 f56 dd pack m
    Text: CONTENTS October 2000 OPERATING LIFE TEST SUMMARY . 2 HAST . 3 AUTOCLAVE TEST . 4


    Original     		PDF S-191 g28 SOT23 weston 461 st 95160 9418 transistor TO-92 9742 9943 so-8 9418 transistor 9806 9928 f56 dd pack m

    AN2639

    Abstract: top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance
    Text: AN2639 Application note Soldering recommendations and package information for Lead-free ECOPACK microcontrollers Introduction STMicroelectronics microcontrollers support various types of Lead-free ECOPACK® package to meet customer requirements. The mounting technologies are Surface mount technology SMT , and Through hole


    Original     		PDF AN2639 AN2639 top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    AD8488

    Abstract: No abstract text available
    Text: Reliability Handbook UG-311 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reliability Handbook INTRODUCTION Analog Devices, Inc., would like to thank its customers for making Analog Devices a leading supplier of high quality LSI, VLSI, and ULSI


    Original     		PDF UG-311 UG10137-0-11/14 AD8488

    JESD-26

    Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
    Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing


    Original     		PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    Untitled

    Abstract: No abstract text available
    Text: TECHNICAL NOTES Reliability Electrostatic Discharge ESD CP Clare devices are electrostatic discharge (ESD) sensitive and it is necessary to take specific precautions in order to ensure protection from damage that may be induced by ESD. We follow all precautions identified in


    OCR Scan     		PDF at125 1255C 1-800-CPCLARE