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APG ELECTRONICS PK-407 SERIES 100 LATCH ASSEMBLY KIT
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PK407 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
CSG225 Abstract: No abstract text available Text: 100% Material Declaration Data Sheet CSG225 for Spartan -6 FPGAs PK407 v1.1 April 9, 2012 Average Weight: 0.3830 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00	Original	PDF	CSG225 PK407
pj42 Abstract: c2120 transistor PJ 899 SM-B1313-TA PW410 B0707 PC-B1717-8A PF421 c2120 PR-40707-UG Text: Section 9. EP Cores EP7 DIMENSIONS A B 2B C inches mm .362 ± .008 .146 ± .002 .292 ± .004 .250 ± .006 9.2 ± .20 3.7 ± .05 7.4 ± .10 6.35 ± .15 inches D 2D E F K mm .098 min. .196 min. .283 min. .134 max. .067 ± .004 2.5 min. 5.0 min. 7.2 min. 3.4 max.	Original	PDF	H/1000T) PC-B2120-TA -C2120-16 B-C2120-16 pj42 c2120 transistor PJ 899 SM-B1313-TA PW410 B0707 PC-B1717-8A PF421 c2120 PR-40707-UG

Catalog Datasheet

MFG & Type

PDF

Document Tags

CSG225

Abstract: No abstract text available
Text: 100% Material Declaration Data Sheet CSG225 for Spartan -6 FPGAs PK407 v1.1 April 9, 2012 Average Weight: 0.3830 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00

Original

PDF

CSG225 PK407

pj42

Abstract: c2120 transistor PJ 899 SM-B1313-TA PW410 B0707 PC-B1717-8A PF421 c2120 PR-40707-UG
Text: Section 9. EP Cores EP7 DIMENSIONS A B 2B C inches mm .362 ± .008 .146 ± .002 .292 ± .004 .250 ± .006 9.2 ± .20 3.7 ± .05 7.4 ± .10 6.35 ± .15 inches D 2D E F K mm .098 min. .196 min. .283 min. .134 max. .067 ± .004 2.5 min. 5.0 min. 7.2 min. 3.4 max.