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    PITCH 0.4 256P Search Results

    PITCH 0.4 256P Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    MG80960MC-25 Rochester Electronics LLC RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    A82380-25 Rochester Electronics LLC Multifunction Peripheral, CHMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    A82380-20 Rochester Electronics LLC Multifunction Peripheral, CHMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy

    PITCH 0.4 256P Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


    Original     		PDF 240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


    Original     		PDF 240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


    Original     		PDF 32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    ACTEL proASIC PLUS APA450

    Abstract: Actel APA075 OB33L PQ208A APA075 APA1000 APA150 APA300 APA450 APA600
    Text: Automotive Supplement PLUS Automotive-Grade ProASIC Features and Benefits • • • High Capacity • • • • • • • • • 0.22µ 4LM Flash-based CMOS Process Live at Power-Up, Single-Chip Solution No Configuration Device Required Retains Programmed Design during


    Original     		PDF 32-Bit ACTEL proASIC PLUS APA450 Actel APA075 OB33L PQ208A APA075 APA1000 APA150 APA300 APA450 APA600

    28x28

    Abstract: MMV3
    Text: 256-PIN PLASTIC QFP FINE PITCH (28x28) A B 192 193 129 128 detail of lead end S C D Q 256 1 R 65 64 F G H I J M P K S N S NOTE Each lead centerline is located within 0.09 mm of its true position (T.P.) at maximum material condition. L M ITEM MILLIMETERS


    Original     		PDF 256-PIN 28x28) S256GD-40-LMV 28x28 MMV3

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    AB244A

    Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
    Text: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002


    Original     		PDF CMOS-10HD A16400EJ4V0DM00 A16400EJ4V0DM IR50-203-3-37 IR50-207-3-37 AB244A R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    EPC16U88

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


    Original     		PDF

    54SX72

    Abstract: A54SX32APQ FBGA-484 A54SX16A THERMAL Fuse m20 tf 115 c PAR64 REQ64 A54SX08A A54SX16 A54SX32A
    Text: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin


    Original     		PDF

    S12237-02P

    Abstract: No abstract text available
    Text: NEWS 01 2013 ELECTRON TUBE PRODUCTS PAGE 21 From Macro to Micro OPTO-SEMICONDUCTOR PRODUCTS Photo ICs for MOST 150 Optical Link PAGE 16 ELECTRON TUBE PRODUCTS Compact 2 W Xenon Flash Lamp Modules PAGE 25 SYSTEMS PRODUCTS Digital Camera ORCA-Flash4.0 PAGE 36


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Advanced v1.6  Axcelerator Family FPGAs Le adi n g- E dg e P e rfo r ma nc e • • • • 350+ MHz System Performance 500+ MHZ Internal Performance High-Performance Embedded FIFOs 700Mb/s LVDS Capable I/Os S pe ci fi c at i on s • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF 700Mb/s 295kbits

    Untitled

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


    Original     		PDF

    schematic diagram UPS 600 Power tree

    Abstract: schematic diagram ups 600 actel silicon sculptor APA075 APA1000 APA150 APA300 APA450 APA600 APA750 JESD22
    Text: v3 .4 PLUS ProASIC TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process


    Original     		PDF 198kbits schematic diagram UPS 600 Power tree schematic diagram ups 600 actel silicon sculptor APA075 APA1000 APA150 APA300 APA450 APA600 APA750 JESD22

    OB33LN

    Abstract: ProASICPLUS Flash Family FPGAs v3.3
    Text: v3.3 ProASICPLUS TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process


    Original     		PDF APA075, APA150, APA300 OB33LN ProASICPLUS Flash Family FPGAs v3.3

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit Operating Temperature Range -40˚C to +85˚C Capacitance Tolerance Rated Voltage • Induction Heaters


    Original     		PDF -200ppm/ 100ppm/ 300/billion

    induction heater

    Abstract: induction heater circuit 406p M6 transistor SMPS 30
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit • Induction Heaters • High frequency • High current Operating Temperature Range


    Original     		PDF 100VDC induction heater induction heater circuit 406p M6 transistor SMPS 30

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit • Induction Heaters • High frequency • High current Operating Temperature Range


    Original     		PDF 100VDC

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • • Induction Heaters • High frequency • High current Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit Operating Temperature Range


    Original     		PDF 100VDC C25uF

    QN132

    Abstract: No abstract text available
    Text: Advanced v0.7 IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Advanced I/O • • • • Low Power • • • • • • 1.2 V or 1.5 V Core Voltage for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode


    Original     		PDF 130-nm, 128exers AGL250 QN132