ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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outline of the heat slug for JEDEC
Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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A7647
Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package
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Matthey
Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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AP-577
Box5200,
Matthey
sanyodenki driver
Sanyo Denki cooler
AP-577
burndy
diode MARKING CODE 917
Evox Rifa
sanyo denki stepping
PEAK tray drawing
QUAD Video Processor 208 pin ap
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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tucker
Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
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AP-577
Box5200,
tucker
CPGA
AP-577
intel DOC
CPGA large cavity
ppga package
Robinson Nugent pga
QUAD Video Processor 208 pin ap
296-Pin
Socket1
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an2233a
Abstract: CYPRESS an2233a AN2233 555-timer mylar capacitor datasheet AN2277 proximity switch schematic PWM techniques schematic capacitive proximity sensor sliding glass door
Text: Application Note AN2233a Capacitive Switch Scan Author: Dennis Seguine Associated Project: No Associated Part Family: CY8C21x34 PSoC Designer Version: 4.2 Associated Application Notes: AN2277 Abstract This Application Note outlines theory and design techniques for implementing arrays of
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AN2233a
CY8C21x34
AN2277
CY8C21x34
CY8C21stem
an2233a
CYPRESS an2233a
AN2233
555-timer
mylar capacitor datasheet
AN2277
proximity switch schematic
PWM techniques
schematic capacitive proximity sensor
sliding glass door
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smd diode marking A3
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
SFC05-5
SFC05--5
smd diode marking A3
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88 lead cpga
Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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CH13WIP
88 lead cpga
JEDEC Matrix Tray outlines
cpu Shipping Trays
outline of the heat slug for JEDEC
ceramic pin grid array package wire bond
I 6506
PLASTIC PIN GRID ARRAY PACKAGING
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
SFC05-5
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tvs smd marking 20a
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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tvs smd marking 20a
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MO-211
Abstract: SFC05-5
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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SFC05-5
SFC05-5
5/50ns)
MO-211
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F45U
Abstract: MARKING CODE SMD IC CSP marking code
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features 300 Watts peak pulse power tp = 8/20µs Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
SFC05-4
5/50ns)
F45U
MARKING CODE SMD IC
CSP marking code
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Untitled
Abstract: No abstract text available
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features ! 300 Watts peak pulse power tp = 8/20µs ! Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
SFC05-4
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smd diode marking A3
Abstract: No abstract text available
Text: SFC05-4 CSP TVS Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features ! 300 Watts peak pulse power tp = 8/20µs ! Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
SFC05-4
smd diode marking A3
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Untitled
Abstract: No abstract text available
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features 300 Watts peak pulse power tp = 8/20µs Transient protection for data lines to The SFC05-4 is a quad flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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F45U
Abstract: MO-211 SFC05-4 marking A1
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features 300 Watts peak pulse power tp = 8/20µs Transient protection for data lines to The SFC05-4 is a quad flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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SFC05-4
SFC05-4
5/50ns)
F45U
MO-211
marking A1
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Turn-Key
Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Text: RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25
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75GHz
50-80grams
Turn-Key
Adapters
Sockets
Product Presentations
Giga-snaP™ BGA SMT Adapters
Receptacles
Prototyping Adapters
Surface Mount Package Emulation
Probing and Analysis Adapters
BGA Sockets
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Untitled
Abstract: No abstract text available
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features 300 Watts peak pulse power tp = 8/20µs Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
SFC05-4
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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