624-25AB
Abstract: IN625
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 21mm BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Adhesive Options
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624-25AB
624-35AB
624-45AB
624-60AB
624-25AB
IN625
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BGA 64 PACKAGE thermal resistance
Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Text: Thermal Management Solutions for BGAs PENGUIN COOLERS: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight
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624-25AB
624-35AB
624-45AB
624-60AB
BGA 64 PACKAGE thermal resistance
BGA PACKAGE thermal resistance
624-25AB
612-Series
643-35AP
655-53AB
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PDF
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 625 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. Sq. 625-25AB .984 25 625-35AB .984 (25) 625-45AB .984 (25) 625-60AB .984 (25) Material: Aluminum, Black Anodized Fin Height
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Original
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625-25AB
625-35AB
625-45AB
625-60AB
625-25-T4
625-45-T4
625-60-T4
1-866-9-OHMITE
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PDF
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Weight lbs. (grams) 624-25AB 624-35AB 624-45AB 624-60AB .827 (21)
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Original
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624-25AB
624-35AB
624-45AB
624-60AB
624-25-T4
624-35-T4
624-45-T4
624-60-T4
1-866-9-OHMITE
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PDF
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637-10ABEP
Abstract: 677-15ABEP 677-20ABEP 657-10ABEPN 657-10ABEP 657-20ABEPSC do-5 package MATERIAL 667-15ABESP weight TO66 66720
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Without Pin Plain Pin 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABEP Material: Aluminum, Black Anodized.
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O-220
O-218
634-10AB
634-10ABEP
634-15AB
634-15ABEP
634-20AB
634-20ABEP
O-218
637-10ABEP
677-15ABEP
677-20ABEP
657-10ABEPN
657-10ABEP
657-20ABEPSC
do-5 package MATERIAL
667-15ABESP
weight TO66
66720
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PDF
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680-125220
Abstract: 603K 637-10ABP 637-15ABP 680-5K 657-10ABPSC 627-15ABP 635-75B2
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP ̆ 634-10AB 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.
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Original
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634-10ABP
634-10AB
634-15ABP
634-15AB
634-20ABP
634-20AB
O-220
O-218
O-218
680-125220
603K
637-10ABP
637-15ABP
680-5K
657-10ABPSC
627-15ABP
635-75B2
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PDF
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thermal management
Abstract: MF251 SF4217 CPF2525
Text: How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To achieve a desired device temperature,
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Untitled
Abstract: No abstract text available
Text: Advanced Thermal Solutions, Inc. How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To
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aEPF4217
CPF4217
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PDF
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637-15ABP
Abstract: TO-220 footprint 637-20ABP 15AB 637-10ABP 634-15ABP 634-10AB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10AB 634-10ABP ̆ 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.
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Original
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634-10AB
634-10ABP
634-15ABP
634-15AB
634-20ABP
634-20AB
O-220
O-218
O-218
637-15ABP
TO-220 footprint
637-20ABP
15AB
637-10ABP
634-15ABP
634-10AB
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PDF
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Untitled
Abstract: No abstract text available
Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABEP 634-10AB 634-15ABEP 634-15AB 634-20ABEP 634-20AB Material: Aluminum, Black Anodized. Height Above PC Board
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Original
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634-10ABEP
634-10AB
634-15ABEP
634-15AB
634-20ABEP
634-20AB
O-220
O-218
634-20ABP)
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PDF
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80486DX
Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM29030 17 x 17 PGA Standard P/N Base Dimensions in. mm Height in. (mm) Heat Sink
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80486DX,
AM29030
662-15AG
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
80486DX2TM,
AM486TMDX2,
80486DX
AMD 80486DX
AM486TMdx4
helium gas sensor module
80486DX2
AM29030
AM486
heat sink
Heat Sinks
80486DX intel
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PDF
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Untitled
Abstract: No abstract text available
Text: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 628 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs Base Dimensions in. mm Dimensions “A” in. (mm) Typical Applications Heat Sink Finish Weight lbs. (grams) 628-20AB 1.750 (44.5) x 1.700 (43.2)
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628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
1-866-9-OHMITE
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PDF
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61995AB124D1
Abstract: No abstract text available
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm
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609-50AB
609-100AB
609-50AB)
609-100AB)
61995AB124D1
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PDF
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3-040405U
Abstract: No abstract text available
Text: 0.40” X 0.40” U TYPE MODERATE PIN CONFIGURATION Moderately Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 800 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics •
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3-040402U
3-040403U
3-040405U
3-040406U
3-040407U
3-040408U
3-040405U
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PDF
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Untitled
Abstract: No abstract text available
Text: 0.27” X 0.27” U TYPE MODERATE PIN CONFIGURATION Moderately Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 800 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics •
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3-020202U
3-020205U
3-020206U
3-020207U
3-020208U
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PDF
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D1065
Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
Text: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)
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D10650-40
100-Lead
D10650-40
D10850-40
i960KATM,
Cx486SLC,
D10850-40
486DX2
D20850-40
D1065
CX486slc
D20850-40
Cyrix CX486slc
486DX2
DIMENSIONS pqfp 100
D10650
heat sink
D1085
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PDF
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Untitled
Abstract: No abstract text available
Text: S O L U T IO N S Datasheet Omnidirectional Pin Fin Heat Sink for BGAs 625 SERIES Standard P/N Fin Height “ A” in. mm Base Dimensions in . Sq. .984 .984 .984 .984 625-25AB 625-35AB 625-45AB 625-60AB (25) (25) (25) (25) 0.250 (6.4) 0.350 (8.9) 0.450 (11.4)
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OCR Scan
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625-25AB
625-35AB
625-45AB
625-60AB
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PDF
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Untitled
Abstract: No abstract text available
Text: HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 658 SERIES Standard P/N Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Base Dimensions in. mm Dimension “A” in. (mm) 658-25AB 1.100 (27.9) sq 0.250 (6.4) 658-35AB 1.100 (27.9) sq 0.350 (8.9)
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658-25AB
658-35AB
658-45AB
658-60AB
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PDF
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Untitled
Abstract: No abstract text available
Text: HRW2502B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. Ordering Information Type No. Laser Mark
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OCR Scan
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HRW2502B-----------Silicon
HRW2502B
W2502B
O-220FM
10msec
HRW2502B
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PDF
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3-101004M
Abstract: No abstract text available
Text: 1.00” X 1.00” M TYPE SPARSE PIN CONFIGURATION Sparsely Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 200 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics • Forged from highly conductive pure aluminum
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3-101003M
00006M
3-101007M
3-101011M
3-101014M
3-101004M
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PDF
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Untitled
Abstract: No abstract text available
Text: 0.50” X 0.50” M TYPE SPARSE PIN CONFIGURATION Sparsely Configured Aluminum Pin Fin Heat Sinks • Designed for airspeed environments ranging from 0 to 200 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics • Forged from highly conductive pure aluminum
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Original
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0505M
3-050506M
3-050507M
3-050508M
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PDF
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W1002
Abstract: No abstract text available
Text: HRW1002B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. 1 2 3 Ordering Information Type No.
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OCR Scan
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HRW1002B-----------Silicon
HRW1002B
W1002B
O-220FM
W1002
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PDF
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1.3960
Abstract: 3-505025G
Text: 5.00” X 5.00” G TYPE FLARED PIN CONFIGURATION 6.5 MAX. Flared Aluminum Pin Fin Heat Sinks • • • • • • • • • 5.00 Designed for natural convection cooling Generate exceptional cooling power Forged from highly conductive aluminum Lapped to achieve exceptional base surface finish
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3-505015G
3-505017G
3-505019G
3-505021G
3-505023G
3-505025G
1.3960
3-505025G
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PDF
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