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Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Amphenol Communications Solutions
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
10131934-906ULF
Amphenol Communications Solutions
Minitek®, Board to Board, Receptacle, Through Mount, Single row, 6 Positions, 2mm (0.079inch), Vertical.
10065490-638LF
Amphenol Communications Solutions
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 38 Positions, 2.00mm (0.079in) Pitch.