Untitled
Abstract: No abstract text available
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
52-PGM09018-30
68-PGM11032-30
84-PGM13042-30
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AMS-QQ-N-290
Abstract: 84 Pin PLCC Socket
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
52-PGM09018-30
68-PGM11032-30
84-PGM13042-30
84 Pin PLCC Socket
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XX-505-11
Abstract: No abstract text available
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
68-PGM11032-30
84-PGM13042-30
XX-505-11
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Untitled
Abstract: No abstract text available
Text: Series 505 PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adapter FEATURES • Convert surface mount PLCC packages to a PGA footprint • Pin polarization option also available • Consult factory for Panelized Form or for mounting of consigned chips GENERAL SPECIFICATIONS
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PDF
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C36000
ASTM-B16-00
B579-73
AMS-QQ-N-290
29-PGM06002-30
44-PGM08002-30
68-PGM11032-30
84-PGM13042-30
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Untitled
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
44-PQ505-X10
44-PGM08005-30
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Untitled
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
44-PQ505-X10
44-PGM08005-30
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Datasheet of IC 7432
Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type
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PGA pin count
Abstract: 4042AS Shrink Zig-Zag In-line Package
Text: 1. PACKAGE CLASSIFICATIONS 1-3. 1 Through-hole mounting type package Type Package Types DIP Pin Count Standard RS 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 Skinny RS 20, 22 Shrink SS 30, 42, 64 ZS 20, 24, 28, 40 ZIP 8 Package Symbol Plastic Through-hole Mounting Type
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30Package
PGA pin count
4042AS
Shrink Zig-Zag In-line Package
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44-pin plcc pcb mount footprint
Abstract: ASTM-B16-85 MIL-T-10727
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
29-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
44-pin plcc pcb mount footprint
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
29-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
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44-pin plcc pcb mount footprint
Abstract: 84 pin PGA pins assignment
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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C36000
ASTM-B16-00.
ASE-AMS-QQ-N-290.
29-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
44-pin plcc pcb mount footprint
84 pin PGA pins assignment
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44-pin plcc pcb mount footprint
Abstract: PGA Surface Mounting Type ASTM-B16-85
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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C36000
ASTM-B16-85.
MIL-P81728
QQ-N-290.
28-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
84-PGM13042-30
44-pin plcc pcb mount footprint
PGA Surface Mounting Type
ASTM-B16-85
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44-pin plcc pcb mount footprint
Abstract: footprint pga 84 ASTM-B16-85 MIL-T-10727
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: • Convert surface mount PLCC packages to a PGA footprint. • Optional open frame allows for more efficient utilization of board space and better cooling. • Pin polarization option also available.
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
Oper69,
29-PGM06002-30
44-PGM08002-30
52-PGA09018-30
68-PGM11032-30
44-pin plcc pcb mount footprint
footprint pga 84
ASTM-B16-85
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44-pin plcc pcb mount footprint
Abstract: No abstract text available
Text: Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices FEATURES: Convert surface mount PLCC packages to a PGA footprint. Optional open frame allows for more efficient Utilization of board space and better cooling. Pin polarization option also available.
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QQ-B-626.
MIL-T-10727
QQ-N-290.
44-pin plcc pcb mount footprint
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tsop 48 PIN type2
Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
Text: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.
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BGA and QFP Package mounting
Abstract: tab ic
Text: 1. PACKAGE CLASSIFICATIONS IC packages are classified as indicated below according to the shape, material, and mounting method. QFP 4-way Lead TQFP / LQFP Flat SOP SSOP Bidirectional Lead TSOP SHP Surface Mounting Type Chip Carrier Bidirectional Lead SOJ 4-way Lead
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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pc cooler fan
Abstract: intel 80486 k6-2 500 intel pentium mmx 80486 pentium mmx PENTIUM k6III pentium 200 mmx Pentium MMX MODULE
Text: Hola1 H A H Passive heatsinks for processors B art. no. Rth [K/W] suitable for processor type 6.1 4.5 DEC Alpha-AXP DEC Alpha-AXP ICK A 10 ICK A 20 C dim. [mm] A 10 20 D E art. no. Rth [K/W] suitable for processor type 8.1 Power PC ICK PPC 51 F fixing method:
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ASTM-B16-85
Abstract: MIL-T-10727
Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-100M65
96-100M65
-or96-100M65-P
100-PGM13071-30
ASTM-B16-85
MIL-T-10727
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Untitled
Abstract: No abstract text available
Text: POPS SERIES CONNECTORS 2.54m m .1 00 " Pitch, Sockets for Pin Grid Array Packages The POPS Series are sockets for 2.54mm (.100") center pin grid array-type LSIs. The Zero-Insertion-Force (ZIF) mechanism enables high density LSI mounting/dismounting by single lever
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Untitled
Abstract: No abstract text available
Text: j4 - p ^ -o 5 PCPS SERIES CONNECTORS 2.54mm .100" Pitch, Sockets for Pin Grid Array Packages The PCPS Series are sockets fo r 2.54mm (.100") center pin grid array-type LSIs. The Zero-lnsertion-Force (ZIF) mechanism enables high density LSI m ounting/dism ounting by single lever
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PCPS-288-003
PCPS-299S1
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ICKS 45
Abstract: MMX intel fc pga SLOT PGA 370
Text: Heatsinks for IC processor a rt. n o . page ^th [K/W ] dissipation m ounting method socket suitable fo r processor type conductive fo il/ cond. adhesive conductive fo il/ cond. adhesive universal universal universal universal loss IC K P G A 6 x 6 x 1 4 B 10
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Untitled
Abstract: No abstract text available
Text: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type
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uPD70216
Abstract: PD70208GF
Text: NEC /¿PD70208, 70208 A , 70216, 70216 (A) 18. RECOMMENDED SOLDERING CONDITIONS * This product should be soldered and mounted under the conditions recommended in the table below. For the details of recommended soldering conditions for the surface mounting type, refer to the information document
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uPD70208
uPD70216
IEI-1207)
PD70208GF-X-3B9
80-pin
PD70216GF-X-3B9
PD70208GF
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