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    PCB V1.2 Search Results

    PCB V1.2 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ZLEDPCB2 Renesas Electronics Corporation LED Test PCBs Visit Renesas Electronics Corporation
    RPI96B3TJ12P1LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    8609153004LF Amphenol Communications Solutions DIN PCB ACCESSORIES Visit Amphenol Communications Solutions
    ZLEDPCB10 Renesas Electronics Corporation LED Test PCB - 12x 0.5W Visit Renesas Electronics Corporation
    ZLEDPCB1B Renesas Electronics Corporation LED Test PCB - 3W Visit Renesas Electronics Corporation
    SF Impression Pixel

    PCB V1.2 Price and Stock

    Phoenix Contact ST 2 5-PCBV/12-G-5 2

    ST-COMBI receptacle - plug-in direction vertical to the PCB - pitch: 5.2 mm - no. of positions: 12
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Master Electronics ST 2 5-PCBV/12-G-5 2
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    • 100 $14.64
    • 1000 $14.64
    • 10000 $14.64
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    PCB V1.2 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    diode in58

    Abstract: OMRON POWER RELAY MP2 DMT 98 ATEX G 001 honeywell dcs manual Yokogawa Transducer ABB inverter motor fault code pdt 908
    Text: Interface Technology and Switching Devices 2013 / 2014 7 PCB connection technology and electronics housing • PCB terminal blocks and plug-in connectors • Electronics housing Connection technology for field devices • Plug-in connectors • Cables and connectors


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    unitB-FLK50/0 VIP-CAB-FLK50/0 VIP-CAB-FLK50/FR/OE/0 diode in58 OMRON POWER RELAY MP2 DMT 98 ATEX G 001 honeywell dcs manual Yokogawa Transducer ABB inverter motor fault code pdt 908 PDF

    lt1085 linear

    Abstract: linear handbook LT1085-5 MOTOROLA linear handbook C51012-1 EP1S60 LT1573 MS-034 BGA956 Lt1649
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix devices. This section contains the required PCB layout guidelines and package specifications. This section contains the following chapters:


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    EL7551C EL7564C EL7556BC EL7562C EL7563C lt1085 linear linear handbook LT1085-5 MOTOROLA linear handbook C51012-1 EP1S60 LT1573 MS-034 BGA956 Lt1649 PDF

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


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    altera cyclone 3

    Abstract: C52006-1 EP1C12 table 15
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter:


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    EP1C12 EP1C20 altera cyclone 3 C52006-1 EP1C12 table 15 PDF

    DIODE 22B4

    Abstract: BA4602 ba41-00316a AR5212 MAP17-232 Q506 nvidia 7100 AR5211 27b1 diode geforce4
    Text: X10 DRAW Model Name PBA Name PCB Code Dev. Step Revision APPROVAL AQUILA MAIN BA92-01774A BA41-#####A SR 1.0 CHECK : : : : : CPU :P4-BANIAS Chip Set :MCH-M ODEM Remarks :TEMP AQUILA 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams


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    BA92-01774A BA41-# 400MHZ 512MBYTE 66MHZ MAP31 68ohm 3000mA 012ohm DIODE 22B4 BA4602 ba41-00316a AR5212 MAP17-232 Q506 nvidia 7100 AR5211 27b1 diode geforce4 PDF

    AR5212

    Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516
    Text: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)


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    ISL6225VCC AR5212 ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516 PDF

    bc417 bluetooth module

    Abstract: South Bridge ALI M1535 asus BC595 M1632M-U BC549 CBE bc352 blue tooth module foxconn M1632M bc182 cps lag
    Text: MAGPIE Project Code : 91.45H01.001 PCB P/N : 48.45H01.0SE PCB : 00203-SE CPU CPU CORE REGULATOR Max1710 P C B LAYER COPPERMINE 700/750 MHZ BGA2 L1:COMPONENT TV Page:4 Page:17 L2:GND L3:SIGNAL CLK L4:VCC L5:SIGNAL(CLK) Page:5 HOST BUS ICS9248-61/130 100MHz


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    Max1710 45H01 00203-SE ICS9248-61/130 100MHz M1632M-U 33MHz LAN/802 bc417 bluetooth module South Bridge ALI M1535 asus BC595 M1632M-U BC549 CBE bc352 blue tooth module foxconn M1632M bc182 cps lag PDF

    fet B20 p03

    Abstract: BC536 BC543 FW82807A BC555 BC599 bc554 lg r40 MOTHERBOARD CIRCUIT diagram oz711 BC565
    Text: PCB LAYER Redstart L1: Signal 1 L2: GND Mobile CPU CLK GEN. ICS 950806 Tualatin PAGE:03 L3: Signal 2 Project code: 91.42S01.001 PCB P/N: 48.42S01.01A REVISION: 01207-1A L4: POWER L5: Signal 3 L6: GND L7: Signal 4 PAGE:4~5 CRT HOST BUS SO-DIMM*2 MEM BUS VCH


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    42S01 1207-1A MAX1632A CH7011 OZT05J02-B4-U 100KR3 TSAHCT32 2N7002 fet B20 p03 BC536 BC543 FW82807A BC555 BC599 bc554 lg r40 MOTHERBOARD CIRCUIT diagram oz711 BC565 PDF

    block diagram bluetooth headphone

    Abstract: block diagram bluetooth 2,0 5101bs Wireless Bluetooth V2.0 Transceiver Module RS232 bluetooth transmitter receiver parallel chip STA2416 assignment on bluetooth t9 bluetooth block diagram bluetooth headset Bluetooth Module adc
    Text: STA2416 Bluetooth technology baseband transceiver with integrated Flash memory Features ! Bluetooth® specification V1.1, V1.2 compliant ! Software compatible with STLC2416 ! 2-layer class-4 PCB compatible – Point-to-point, point-to-multi-point up to 7


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    STA2416 STLC2416 LFBGA120 10x10x1 64-KByte block diagram bluetooth headphone block diagram bluetooth 2,0 5101bs Wireless Bluetooth V2.0 Transceiver Module RS232 bluetooth transmitter receiver parallel chip STA2416 assignment on bluetooth t9 bluetooth block diagram bluetooth headset Bluetooth Module adc PDF

    STLC2500

    Abstract: STA2416 STLC2150 STLC2416 optical mouse usb motorola STLC2500 deep sleep STA529 "Over the Air"
    Text: STA2416 Bluetooth technology baseband transceiver with integrated Flash memory Features ! Bluetooth® specification V1.1, V1.2 compliant ! Software compatible with STLC2416 ! 2-layer class-4 PCB compatible – Point-to-point, point-to-multi-point up to 7


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    STA2416 STLC2416 LFBGA120 10x10x1 64-KByte STLC2500 STA2416 STLC2150 STLC2416 optical mouse usb motorola STLC2500 deep sleep STA529 "Over the Air" PDF

    ST1536

    Abstract: st433 st258 asl1000 st431 SL1010 ST1526 ST1302 tx st433 ST1556
    Text: Fujitsu Microelectronics Europe User Guide FMEMCU-UG-910010-24 FR FAMILY EVALUATION BOARD SK-91460-MAIN V1.2 USER GUIDE This manual refers to PCB version V1.2 SK-91460-MAIN v1.2 Revision History Revision History Date 15.06.2005 22.06.2005 06.07.2005 18.07.2005


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    FMEMCU-UG-910010-24 SK-91460-MAIN ST371 UG-910010-24 32bit) ST1536 st433 st258 asl1000 st431 SL1010 ST1526 ST1302 tx st433 ST1556 PDF

    BW 6122

    Abstract: No abstract text available
    Text: STA2416 Bluetooth Baseband with integrated flash Target Specification Features • Bluetooth™ specification compliance: V1.1 and V1.2 ■ SW compatible with STLC2416 ■ 2 layer class 4 PCB compatible – Point-to-point, point-to-multi-point up to 7


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    STA2416 STLC2416 STA2416 BW 6122 PDF

    ericsson 6102

    Abstract: GPIO14 STA2416 STLC2416 BW 6122
    Text: STA2416 Bluetooth Baseband with integrated flash Target Specification Features • Bluetooth™ specification compliance: V1.1 and V1.2 ■ SW compatible with STLC2416 ■ 2 layer class 4 PCB compatible – Point-to-point, point-to-multi-point up to 7


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    STA2416 STLC2416 ericsson 6102 GPIO14 STA2416 STLC2416 BW 6122 PDF

    XAPP689

    Abstract: XAPP623 FF1152 XC2V6000
    Text: Application Note: FPGAs R Managing Ground Bounce in Large FPGAs Author: Tony Duong XAPP689 v1.2 October 30, 2007 Summary Ground bounce must be controlled to ensure proper operation of high-performance FPGA devices. Particular attention must be applied to minimizing board-level inductance during PCB


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    XAPP689 XAPP689 XAPP623 FF1152 XC2V6000 PDF

    recommended layout CSG324

    Abstract: Spartan-6 PCB design guide Spartan-6 LX45 Spartan-6 FPGA LX9 SPARTAN 6 UG393 spartan 6 LX150t ROSENBERGER UG393 Xilinx Spartan-6 LX9 spartan6 LX9
    Text: Spartan-6 FPGA PCB Design and Pin Planning Guide UG393 v1.2 July 15, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG393 recommended layout CSG324 Spartan-6 PCB design guide Spartan-6 LX45 Spartan-6 FPGA LX9 SPARTAN 6 UG393 spartan 6 LX150t ROSENBERGER UG393 Xilinx Spartan-6 LX9 spartan6 LX9 PDF

    EP2C8F256 package

    Abstract: S-2501-1 EP2C20F256 bga 896 TSMC 90nm sram
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    FR4 epoxy dielectric constant 4.2

    Abstract: FR4 epoxy dielectric constant 4.4 permittivity FR 4 PCB JTAG series termination resistors FR4 substrate with dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.4 permittivity FR 4 permittivity FR 4 Printed circuit board FR4 dielectric constant and loss tangent at 2.4 G FR4 epoxy dielectric constant 4.4 copper half oz
    Text: 11. High-Speed Board Layout Guidelines SII52012-1.4 Introduction Printed circuit board PCB layout becomes more complex as device pin density and system frequency increase. A successful high-speed board must effectively integrate devices and other elements while avoiding


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    SII52012-1 FR4 epoxy dielectric constant 4.2 FR4 epoxy dielectric constant 4.4 permittivity FR 4 PCB JTAG series termination resistors FR4 substrate with dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.4 permittivity FR 4 permittivity FR 4 Printed circuit board FR4 dielectric constant and loss tangent at 2.4 G FR4 epoxy dielectric constant 4.4 copper half oz PDF

    bga 896

    Abstract: TSMC 90nm sram EP2C50F484 APU 2471
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    Untitled

    Abstract: No abstract text available
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    SW 2596

    Abstract: EP2C35F672 HP 3070 series 3 Manual circuit integers p 2503 n EP2C20 484-pin package APU 2471 cyclone II EP2C20F256 K 3053 TRANSISTOR SSTL-18
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP2C5F256

    Abstract: CII51001-3 EP2C15A EP2C20 EP2C35 EP2C50 EP2C8F256 EP2C70F672 TSMC 90nm sram
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP2C35F672

    Abstract: EP2C20F256 Sw 2604 tms 3617 4017 pins configuration 753 53 2525 401 CMOS 4017 series cyclone II FIR filter matlaB simulink design matlab programs for impulse noise removal
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP2C35F672

    Abstract: 26075 EP2C20F256 TMS 3617 PQFP16 ic 4017 pin configuration 2864 rom 3844 b so 8 EP2C5 EP2C15A
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    vhdl code for phase shift

    Abstract: AGX52013-1
    Text: 13. IEEE 1149.1 JTAG Boundary-Scan Testing for Arria GX Devices AGX52013-1.2 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in


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    AGX52013-1 1980s, vhdl code for phase shift PDF