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    PCB THERMAL DESIGN GUIDE TRACE THETA Search Results

    PCB THERMAL DESIGN GUIDE TRACE THETA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    PCB THERMAL DESIGN GUIDE TRACE THETA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    HY82563EB

    Abstract: AS-25.000-20-SMD-TR AP-497 82563EB BEL 100N TRANSISTOR TYPE METAL TRANSISTOR ANSI X3.263-1995 tests 82571 citizen calculator intel AP-497 BEL 100N TRANSISTOR
    Text: 82563EB/82564EB LAN on Motherboard Design Guide Application Note May 2007 317104-001 Revision 2.6 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF 82563EB/82564EB HY82563EB AS-25.000-20-SMD-TR AP-497 82563EB BEL 100N TRANSISTOR TYPE METAL TRANSISTOR ANSI X3.263-1995 tests 82571 citizen calculator intel AP-497 BEL 100N TRANSISTOR

    SAC1205

    Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
    Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)


    Original     		PDF AN3846 SAC1205 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    WLCSP stencil design

    Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
    Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages


    Original     		PDF SBVA017 300mm MO-211 WLCSP stencil design ja 16201 WLCSP smt Texas wcsp wcsp reliability A104B IPC-7525 JESD22 S2062

    LMZ1200x

    Abstract: Vishay quality iso certificate LMZ14203DEMO
    Text: LMZ14203 3A SIMPLE SWITCHER Power Module with 42V Maximum Input Voltage Easy to use 7 pin package Performance Benefits • Operates at high ambient temperature with no thermal derating ■ High efficiency reduces system heat generation ■ Low radiated emissions EMI complies with EN55022


    Original     		PDF LMZ14203 EN55022 EN61000 4-Mar-2010] ISO/TS16949 LMZ1200x Vishay quality iso certificate LMZ14203DEMO

    ISFET

    Abstract: ISL8200M switch mode power supply pcb thermal Design guide trace theta layout AN1544 ISL8200MEVAL2PHZ ISL8200MIRZ TB347 TB363 U201
    Text: ISL8200M Features The ISL8200M is a simple and easy to use high power, current-sharing DC\DC power module for Datacom\Telecom\FPGA power hungry applications. All that is needed is the ISL8200M, a few passive components and one VOUT setting resistor to have a


    Original     		PDF ISL8200M ISL8200M ISL8200M, operati62 FN6727 ISFET switch mode power supply pcb thermal Design guide trace theta layout AN1544 ISL8200MEVAL2PHZ ISL8200MIRZ TB347 TB363 U201

    Untitled

    Abstract: No abstract text available
    Text: LMZ12008 www.ti.com SNVS716D – MARCH 2011 – REVISED AUGUST 2012 LMZ12008 8A SIMPLE SWITCHER Power Module with 20V Maximum Input Voltage Check for Samples: LMZ12008 FEATURES • 1 • • • • 2 • • • • Integrated shielded inductor Simple PCB layout


    Original     		PDF LMZ12008 SNVS716D LMZ12008 350kHz) LMZ22010/08/06, LMZ12010/06, LMZ23610/08/0ti

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    AD183x

    Abstract: No abstract text available
    Text: a SHARC Processor ADSP-21363 Preliminary Technical Data SUMMARY On-chip memory—3M bit of on-chip SRAM and a dedicated 4M bit of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family The ADSP-21363 is available with a 333 MHz core instruction


    Original     		PDF 32-bit/40-bit ADSP-21363 32-bit floating-point/32-bit fixed-point/40-bit ADSP-21363 JESD51-9. JESD51-5. PR05196-0-5/05 AD183x

    Hdsl-3600

    Abstract: smd transistor 3310 33171 HSDL-3310 3310 DIODE 3310 DIODE DATASHEET 3310
    Text: Agilent HSDL-3310 IrDA Data Compliant 1.152 Mb/s Infrared Transceiver Data Sheet Functional Description The HSDL-3310 is a small form factor infrared IR transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR


    Original     		PDF HSDL-3310 HSDL-3310 825-Class 5988-0129EN Hdsl-3600 smd transistor 3310 33171 3310 DIODE 3310 DIODE DATASHEET 3310

    6265C hrtz

    Abstract: 6265C ISL6265C ISL6265CHRTZ-T ISL6265CHRTZ i 6265C NORTHBRIDGE* reflow TB347 TB363 FLY mobile MOTHERBOARD CIRCUIT diagram
    Text: ISL6265C Features The ISL6265C is a multi-output controller with embedded gate drivers. A single-phase controller powers the Northbridge VDDNB portion of the CPU. The two remaining controller channels can be configured for two-phase or individual single-phase outputs. For


    Original     		PDF ISL6265C ISL6265C 5m-1994. FN6976 6265C hrtz 6265C ISL6265CHRTZ-T ISL6265CHRTZ i 6265C NORTHBRIDGE* reflow TB347 TB363 FLY mobile MOTHERBOARD CIRCUIT diagram

    transistor w2d

    Abstract: transistor W1A 78 R-PDSO-G16 Package transistor w1d f 7914 b texas transistor w2a wirebond die flag lead frame CPU 414-2 Processor Module DATASHEET OF 8 pin DIP IC 741 transmitter tube 807
    Text: HighĆPerformance FIFO Memories European Edition Designer’s Handbook 1995 Advanced System Logic Printed in U.S.A. 0195 – CP SCAA024 Designer’s Handbook HighĆPerformance FIFO Memories European Edition 1995 HighĆPerformance FIFO Memories European Edition


    Original     		PDF SCAA024 transistor w2d transistor W1A 78 R-PDSO-G16 Package transistor w1d f 7914 b texas transistor w2a wirebond die flag lead frame CPU 414-2 Processor Module DATASHEET OF 8 pin DIP IC 741 transmitter tube 807

    Untitled

    Abstract: No abstract text available
    Text: DP83865 DP83865 Gig PHYTER V 10/100/1000 Ethernet Physical Layer Literature Number: SNLS165B DP83865 Gig PHYTER V 10/100/1000 Ethernet Physical Layer General Description The DP83865 is a fully featured Physical Layer transceiver with integrated PMD sublayers to support 10BASE-T,


    Original     		PDF DP83865 DP83865 SNLS165B 10BASE-T, 100BASE-TX 1000BASE-T DP83861

    6265C hrtz

    Abstract: 6265C ISL6265IRTZ ISL6265HRTZ
    Text: Multi-Output Controller with Integrated MOSFET Drivers for AMD SVI Capable Mobile CPUs ISL6265C Features The ISL6265C is a multi-output controller with embedded gate drivers. A single-phase controller powers the Northbridge VDDNB portion of the CPU. The two remaining controller channels can be


    Original     		PDF ISL6265C ISL6265C 5m-1994. FN6976 6265C hrtz 6265C ISL6265IRTZ ISL6265HRTZ

    transistor w2d

    Abstract: LG monitor 14 inch wiring diagram picture tube transistor w1A 3000 Watt BTL Audio Amplifier R-PDSO-G56 Package PQFP 64 PM64 transmitter tube 807 R-PDSO-G16 Package transistor w2a laptop inverter SCHEMATIC TRANSISTOR
    Text: HighĆPerformance FIFO Memories Designer’s Handbook 1996 Advanced System Logic Products Printed in U.S.A. 0496 – CP SCAA012A Designer’s Handbook HighĆPerformance FIFO Memories 1996 HighĆPerformance FIFO Memories Designer’s Handbook 1996 Advanced System Logic Products


    Original     		PDF SCAA012A transistor w2d LG monitor 14 inch wiring diagram picture tube transistor w1A 3000 Watt BTL Audio Amplifier R-PDSO-G56 Package PQFP 64 PM64 transmitter tube 807 R-PDSO-G16 Package transistor w2a laptop inverter SCHEMATIC TRANSISTOR

    Untitled

    Abstract: No abstract text available
    Text: a SHARC Processor ADSP-21365/ADSP-21366 Preliminary Technical Data SUMMARY Single-Instruction Multiple-Data SIMD computational architecture On-chip memory—3M bit of on-chip SRAM and a dedicated 4M bit of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family


    Original     		PDF 32-bit/40-bit 32-bit ADSP-21365/ADSP-215 JESD51-5. ADSP-21365/ADSP-21366 PR04625-0-5/05

    Untitled

    Abstract: No abstract text available
    Text: a SHARC Processor ADSP-21362 Preliminary Technical Data SUMMARY High performance 32-bit/40-bit floating-point processor optimized for high performance automotive audio processing Single-Instruction Multiple-Data SIMD computational architecture On-chip memory—3M bit of on-chip SRAM


    Original     		PDF 32-bit/40-bit ADSP-21362 ADSP-21362 JESD51-9. JESD51-5. PR05594-0-5/05

    AD150

    Abstract: No abstract text available
    Text: a SHARC Processor ADSP-21364 Preliminary Technical Data SUMMARY On-chip memory—3M bit of on-chip SRAM and a dedicated 4M bit of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family The ADSP-21364 is available with a 333 MHz core instruction


    Original     		PDF 32-bit/40-bit ADSP-21364 32-bit floating-point/32-bit fixed-point/40-bit ADSP-21364 JESD51-9. JESD51-5. AD150

    dts master audio DL 1200

    Abstract: ADSP-21365 CP-1201 Dolby prologic IIx decoder
    Text: a SHARC Processor ADSP-21365/ADSP-21366 Preliminary Technical Data SUMMARY Single-Instruction Multiple-Data SIMD computational architecture On-chip memory—3M bit of on-chip SRAM and a dedicated 4M bit of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family


    Original     		PDF ADSP-21365/ADSP-21366 ADSP-21365/ADSP-21366 ADSP-21365 JESD51-9. JESD51-5. PR04625-0-2/05 dts master audio DL 1200 CP-1201 Dolby prologic IIx decoder

    Untitled

    Abstract: No abstract text available
    Text: Low Skew, 1-to-10, Differential-to-2.5V, 3.3V ICS853S111BI LVPECL/ECL Fanout Buffer DATA SHEET General Description Features The ICS853S111BI is a low skew, high performance 1-to-10 Differential-to-2.5V/ 3.3V LVPECL/ECL Fanout Buffer. The ICS853S111BI is characterized to operate from either a 2.5V or a


    Original     		PDF 1-to-10, ICS853S111BI 1-to-10