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    PCB FOOTPRINT CQFP 100 Search Results

    PCB FOOTPRINT CQFP 100 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    L77TWB5W5SEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L77TWA3W3SMP2V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Socket, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWP3W3PEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (40A) Contacts Only, Pin/Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWB5W5PMP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWA3W3PMP2V4F Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=9.52mm (0.375in), 4-40 Front Screwlock, With Bracket Without Boardlock Visit Amphenol Communications Solutions

    PCB FOOTPRINT CQFP 100 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Mo82

    Abstract: No abstract text available
    Text: ADVANCED w INTERCONNECTIONS CQFP/PQFP Adapters English inch and Metric (mm) Pitch 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 • Tel. 401-823-5200 • FAX 401-823-8723 Adapters for Jedec # MO-69, MO-82, MO -86.025" & .050" and EIAJ 0.5mm, 0.65mm, 0.8mm & 1.0mm Gull Wing Style Leaded Packages


    OCR Scan     		MO-69, MO-82, 540ADAA 3322-44S7 3322-52S4 3323-64S7 3322-52S3 Mo82 PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100 PDF

    Untitled

    Abstract: No abstract text available
    Text: ADVANCED , QFP Socket/Adapter System INTERCONNECTIONS Patents issued and/or pending. 5 Energy Way. P.O. Box 1019, West Warwick, Rl 02893 . Tel. 401 -823-5200 • FAX 401-823-8723 QFP Socket/Adapter System Gold,'Gold Interconnection Features: • Allows interface of QFP to SMD


    OCR Scan     		all45204 PDF

    rm7965

    Abstract: RM79xx Family User Manual telcordia GR-63-CORE MIPS RM7965 RM7900 RM79xx
    Text: Standard Products MIP 7965 64-Bit Superscaler Microprocessor June 18, 2007 www.aeroflex.com/Avionics FEATURES ❑ Upscreened PMC-Sierra RM7965 ❑ Military and Industrial Grades Available ❑ CPU core with MIPS64 compatible Instruction Set Architecture that features:


    Original     		64-Bit RM7965 MIPS64TM 16-KB, 256-KB, 64-entry SCD7965 RM79xx Family User Manual telcordia GR-63-CORE MIPS RM7965 RM7900 RM79xx PDF

    telcordia GR-63-CORE

    Abstract: RM79xx Family User Manual RM7965 RM79xx PCB footprint cqfp 132 RM7065C RM7900 PMC-2030581 PCB footprint cqfp 208 MIPS7965-668B1
    Text: Standard Products MIP 7965 64-Bit Superscaler Microprocessor March 23, 2007 www.aeroflex.com/Avionics FEATURES ❑ Upscreened PMC-Sierra RM7965 ❑ Military and Industrial Grades Available ❑ CPU core with MIPS64 compatible Instruction Set Architecture that features:


    Original     		64-Bit RM7965 MIPS64TM 16-KB, 256-KB, 64-entry SCD7965 telcordia GR-63-CORE RM79xx Family User Manual RM79xx PCB footprint cqfp 132 RM7065C RM7900 PMC-2030581 PCB footprint cqfp 208 MIPS7965-668B1 PDF

    RTAX2000

    Abstract: mb 8739 Xilinx VIRTEX-5 xc5vlx50 UT63M143 M38510/55501 5962R99B0106V4C vhdl code manchester encoder UT229FCMV4 h009 SPECIFICATION LEON3FT
    Text: A passion for performance. Aeroflex Colorado Springs Aeroflex Gaisler Aeroflex Plainview Product Short Form Microelectronic Solutions July 2009 HiRel from Aeroflex Colorado Springs UT69151 SµMMIT E • UT69151 SµMMIT™ LXE ■ UT69151 SµMMIT™ DXE


    Original     		UT691 RTAX2000 mb 8739 Xilinx VIRTEX-5 xc5vlx50 UT63M143 M38510/55501 5962R99B0106V4C vhdl code manchester encoder UT229FCMV4 h009 SPECIFICATION LEON3FT PDF

    AMBA APB UART

    Abstract: dlc10 UT699 352-CQFP state machine for ahb to apb bridge AMBA AHB memory controller UT699 memory map UT699 cpci driver ahb fsm SDRAM edac
    Text: UT699 32-bit Fault-Tolerant LEON 3FT/SPARCTM V8 Processor Aeroflex Colorado Springs 800-645-8862 www.aeroflex.com/LEON August 2009 UT699 LEON 3FT Description T Operates from 3.3V for I/O and 2.5V for core T Multifunctional memory controller supports PROM, SRAM, SDRAM, and I/O


    Original     		UT699 32-bit -40oC 105oC) 352-pin 484-pin IEEE754 GR-CPCI-UT699 AMBA APB UART dlc10 352-CQFP state machine for ahb to apb bridge AMBA AHB memory controller UT699 memory map UT699 cpci driver ahb fsm SDRAM edac PDF

    5962-9677001QXA

    Abstract: TSB12C01AMWN TSB12C01AMWNB
    Text: Fact Sheet M i l i t a r y S e m i c o n d u c t o r P r o d u c t s TSB12C01AMWNB / 5962-9677001QXA SGYV015, October 1996 IEEE 1394-1995 HIGH SPEED SERIAL BUS LINK LAYER CONTROLLER HIGHLIGHTS The TSB12C01AM is an IEEE 1394-1995 compliant high-speed serial-bus link-layer controller that


    Original     		TSB12C01AMWNB 5962-9677001QXA SGYV015, TSB12C01AM 32-bit TSB12C01AM TSB14C01M TSB21LV03M 5962-9677001QXA TSB12C01AMWN PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 PDF

    RTAX2000

    Abstract: UT16AD80P m38510/55501 UT63M143 MIP7965-750B1 5962-8869203 vhdl code manchester encoder UT54LVDM055LV SMD custom precision rESISTOR network h009 SPECIFICATION
    Text: A passion for performance. Aeroflex Colorado Springs Aeroflex Gaisler Aeroflex Plainview Product Short Form Microelectronic Solutions October 2010 HiRel from Aeroflex Colorado Springs UT69151 SµMMIT DXE • UT69151 SµMMIT™ XTE ■ UT69151 SµMMIT™ RTE


    Original     		UT691 RTAX2000 UT16AD80P m38510/55501 UT63M143 MIP7965-750B1 5962-8869203 vhdl code manchester encoder UT54LVDM055LV SMD custom precision rESISTOR network h009 SPECIFICATION PDF

    Untitled

    Abstract: No abstract text available
    Text: User Guide 037 ISL71841SEHEV1Z Evaluation Board User Guide Description Key Features The ISL71841SEH is a radiation hardened, 32-channel high ESD protected multiplexer that is fabricated using Intersil’s proprietary P6SOI Silicon On Insulator process technology to


    Original     		ISL71841SEHEV1Z ISL71841SEH 32-channel 379ns 500ns/DIV 425ns 200ns/DIV UG037 PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN PDF

    GR712RC

    Abstract: UT700 melf ZENER diode COLOR CODE 5962R102 smd zener diode color code UT8QNF8M HDMI verilog BCH RTAX2000 UT54ACS164245 "HARMONIC DRIVE"
    Text: A passion for performance. Aeroflex Microelectronic Solutions Digital, Analog, Power, RFMW, Motion…Solutions for HiRel Applications Product Short Form December 2012 Aeroflex Microelectronic Solutions Product Short Form Aeroflex Microelectronic Solutions is comprised of ten divisions – Colorado Springs, Gaisler, Motion


    Original     		PDF

    1718l

    Abstract: LEAP-U1 17-18L 74160 pin description Xilinx XC2000 74160 function table 74160 pin layout xilinx 1736a advantages of proteus software 1765d
    Text: XCELL Issue 21 Second Quarter 1996 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS R PRODUCTINFORMATION The Programmable Logic CompanySM VHDL Made Easy! Introducing Foundation Series Software Inside This Issue: GENERAL Fawcett: PLDs, Pins, PCBs part 2 .2


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    CQ352-FPGA

    Abstract: RTAX1000s-cq RTAX4000S RTAX2000 RTAX2000S-CQ352 FPGA Application Note schematic 324 CDB 455 C34 rtax4000 AP3433
    Text: v4.0 RTAX-S RadTolerant FPGAs Designed for Space • • • • • • • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeV-cm2/mg – SEU Rate < 10-10 Errors/Bit-Day in Worst-Case


    Original     		TM1019 CQ352-FPGA RTAX1000s-cq RTAX4000S RTAX2000 RTAX2000S-CQ352 FPGA Application Note schematic 324 CDB 455 C34 rtax4000 AP3433 PDF

    RTAX2000

    Abstract: rtax4000 CDB 455 C34 IO358 DIODE SMD V05 128X3
    Text: v5.1 RTAX-S/SL RadTolerant FPGAs Radiation Performance Leading-Edge Performance • • • • • • • • • • SEU-Hardened Registers Eliminate the Need for TripleModule Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeV-cm2/mg


    Original     		TM1019 RTAX2000 rtax4000 CDB 455 C34 IO358 DIODE SMD V05 128X3 PDF