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    PCB BOARD 0.035MM Search Results

    PCB BOARD 0.035MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MYC0409-NA-EVM Murata Manufacturing Co Ltd 72W, Charge Pump Module, non-isolated DC/DC Converter, Evaluation board Visit Murata Manufacturing Co Ltd
    SCR410T-K03-PCB Murata Manufacturing Co Ltd 1-Axis Gyro Sensor on Evaluation Board Visit Murata Manufacturing Co Ltd
    SCC433T-K03-PCB Murata Manufacturing Co Ltd 2-Axis Gyro, 3-axis Accelerometer combination sensor on Evaluation Board Visit Murata Manufacturing Co Ltd
    LBUA5QJ2AB-828EVB Murata Manufacturing Co Ltd QORVO UWB MODULE EVALUATION KIT Visit Murata Manufacturing Co Ltd
    SSCCOMMBOARDV4P1C Renesas Electronics Corporation SSC Communication Board Visit Renesas Electronics Corporation

    PCB BOARD 0.035MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transmission lines Twisted Pair spice model

    Abstract: APP4168 AN4168
    Text: Maxim > App Notes > AUTOMATIC TEST EQUIPMENT ATE HIGH-SPEED INTERCONNECT Keywords: transmission line, line impedance, high-speed signal, lossless, lossy, transmission path, source impedance, load, printed circuit board, PCB, micro-strip, coaxial, twisted pair, TDR, Time Domain Reflectometry


    Original     		PDF com/an4168 AN4168, APP4168, Appnote4168, transmission lines Twisted Pair spice model APP4168 AN4168

    Pb95Sn5

    Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
    Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377


    Original     		PDF DS2411: DS2415: DS2417: DS2432: DS2433: DS2502: DS2760: DS2761: DS2762: DS9503: Pb95Sn5 pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37

    JEP140

    Abstract: JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7
    Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device


    Original     		PDF TB379 JEP140 JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7

    JESD51-9

    Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
    Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device


    Original     		PDF TB379 JESD51-9 JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A331JB12_ 0805, C0G, 330pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2A331JB12_ 330pF, 100Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H820FB01_ 1111, C0G, 82pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM22M5C2H820FB01_ 500Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E9R0BB12_ 0603, C0G, 9pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E9R0BB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2ER30CB12_ 0603, C0G, 0.3pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2ER30CB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E8R2BB12_ 0603, C0G, 8.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E8R2BB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E120FB12_ 0603, C0G, 12pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E120FB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E330FB12_ 0603, C0G, 33pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E330FB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E6R8BB12_ 0603, C0G, 6.8pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E6R8BB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A201JB12_ 0805, C0G, 200pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2A201JB12_ 200pF, 100Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E820GB12_ 0603, C0G, 82pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E820GB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E560GB12_ 0603, C0G, 56pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E560GB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E121JB12_ 0805, C0G, 120pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2E121JB12_ 120pF, 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H680FB01_ 1111, C0G, 68pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM22M5C2H680FB01_ 500Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H180FB01_ 1111, C0G, 18pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM22M5C2H180FB01_ 500Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151JB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2E151JB12_ 150pF, 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2HR75BB01_ 1111, C0G, 0.75pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM22M5C2HR75BB01_ 500Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E7R0BB12_ 0603, C0G, 7pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E7R0BB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E2R0WB12_ 0805, C0G, 2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2E2R0WB12_ 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151GB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM2195C2E151GB12_ 150pF, 250Vdc) JEMCNC-0012L

    Untitled

    Abstract: No abstract text available
    Text: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E1R2WB12_ 0603, C0G, 1.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency


    Original     		PDF GQM1875C2E1R2WB12_ 250Vdc) JEMCNC-0012L