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    PBGA 256 REFLOW PROFILE Search Results

    PBGA 256 REFLOW PROFILE Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    AM79C970AVC-G Rochester Electronics LLC Rochester Manufactured 79C970, Ethernet Controller, 144 LQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy

    PBGA 256 REFLOW PROFILE Datasheets Context Search

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    KE-G1250

    Abstract: KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800
    Text: Pericom Semiconductor Corp. • 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 10-04 Means of Distinguishing Changed Devices: Date Issued: September 10, 2010 Product Mark Product(s) Affected: PI7C8150x (see affected part number list)


    Original     		PDF PI7C8150x KE-G1250 PD-2016 MS-034B/AAF-1 256-Pin, KE-G1250 mold compound KEG1250LKDS PI7C8150BNDIE-33 JESD22-A-113-E JESD22-A113E PI7C8150BND reflow profile PBGA 256 reflow profile PI7C8150BNDE QA-1800

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd
    Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    BGA PROFILING

    Abstract: MPC852T 62Sn-36Pb-2Ag 4/5/32R2024/25/62Sn-36Pb-2Ag
    Text: Motorola PowerQUICC MPC852T Pb-Free Packaging Information Motorola Semiconductor Motorola SPS, NCSD - Q1 2003 – Rev. 1 - Page 1 Motorola General Business Information MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other


    Original     		PDF MPC852T 23x23 16x16 BGA PROFILING 62Sn-36Pb-2Ag 4/5/32R2024/25/62Sn-36Pb-2Ag

    TSMC 0.35um

    Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
    Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:


    Original     		PDF

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    transistor nec 8772

    Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005


    Original     		PDF AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    IBM25PPC750CX

    Abstract: PowerPC-750CX PBGA 256 reflow profile dh28 code DH10 IBM25PPC750
    Text: PowerPC 750CX RISC Microprocessor Datasheet Version 1.2 June 20, 2001 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this document. Trademarks The following are trademarks of International Business Machines Corporation in the United States, or


    Original     		PDF 750CX IBM25PPC750CX PowerPC-750CX PBGA 256 reflow profile dh28 code DH10 IBM25PPC750

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    IBM25PPC750CX

    Abstract: 750CX
    Text: PowerPC 750CX RISC Microprocessor Datasheet Version 1.1 November 13, 2000 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this document. Trademarks


    Original     		PDF 750CX IBM25PPC750CX

    IBM25PPC750CXEJP

    Abstract: IBM25PPC750CX PPC750 600MHz RISCwatch ibm25ppc750cxe 8x9x
    Text:  PowerPC 750CXe RISC Microprocessor Datasheet Version: 1.3 For DD3.1 Only Preliminary February 12, 2002  Copyright and Disclaimer  Copyright International Business Machines Corporation 1991-2002 All Rights Reserved Printed in the United States of America 02/02


    Original     		PDF 750CXe IBM25PPC750CXEJP IBM25PPC750CX PPC750 600MHz RISCwatch ibm25ppc750cxe 8x9x

    750CX

    Abstract: No abstract text available
    Text: PowerPC 750CX RISC Microprocessor Datasheet Version 1.0 Thursday, June 01, 2000 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this document. Trademarks


    Original     		PDF 750CX

    IBM25PPC750CXE

    Abstract: IBM25PPC750 DH10 PPC750 IBM25PPC750CXEJP RISCwatch DH11
    Text:  PowerPC 750CXe RISC Microprocessor Datasheet Version: 1.1 For DD3.1 Only Preliminary December 03, 2001  Copyright and Disclaimer  Copyright International Business Machines Corporation 1991-2001 All Rights Reserved Printed in the United States of America 12/01


    Original     		PDF 750CXe IBM25PPC750CXE IBM25PPC750 DH10 PPC750 IBM25PPC750CXEJP RISCwatch DH11

    PPC750 600MHz

    Abstract: PowerPC-750CX PowerPC-750CXe ibm25ppc750cxe DH10 PPC750 IBM25PPC750 IBM PPC750 dh23
    Text: R Y PowerPC 750CXe RISC Microprocessor Datasheet February, 2001 PR EL IM IN A Version 1.0 for DD2.4 only IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this document.


    Original     		PDF 750CXe PPC750 600MHz PowerPC-750CX PowerPC-750CXe ibm25ppc750cxe DH10 PPC750 IBM25PPC750 IBM PPC750 dh23

    IBM25PPC750CX

    Abstract: DH10 PPC750 transistor w16 IBM25PPC750
    Text: PowerPC® 750CXr RISC Microprocessor Data Sheet Version: 1.2 For DD4.0 Only February 28, 2005 ® Copyright International Business Machines Corporation 1991, 2005 All Rights Reserved Printed in the United States of America 2/28/05 The following are trademarks of International Business Machines Corporation in the United States, or other countries, or


    Original     		PDF 750CXr IBM25PPC750CX DH10 PPC750 transistor w16 IBM25PPC750

    DL20 SENSOR

    Abstract: IBM25PPC750CXEJP DH10 PPC750 RISCwatch
    Text:  PowerPC 750CXe RISC Microprocessor Data Sheet Version: 1.4 For DD3.1 Only Preliminary January 28, 2003   Copyright International Business Machines Corporation 1991-2003 All Rights Reserved Printed in the United States of America 1/28/03 The following are trademarks of International Business Machines Corporation in the United States, or other countries, or


    Original     		PDF 750CXe DL20 SENSOR IBM25PPC750CXEJP DH10 PPC750 RISCwatch

    PPC750CXe

    Abstract: PowerPC 750 IBM25ppc750L IBM25PPC750CXE A2719G IBM powerpc 750L PPC750CX
    Text: PowerPC® 750CXe RISC Microprocessor Data Sheet Version: 1.5 For DD3.1 Only Preliminary April 8, 2004 ® Copyright International Business Machines Corporation 1991-2004 All Rights Reserved Printed in the United States of America 4/8/04 The following are trademarks of International Business Machines Corporation in the United States, or other countries, or


    Original     		PDF 750CXe PPC750CXe PowerPC 750 IBM25ppc750L IBM25PPC750CXE A2719G IBM powerpc 750L PPC750CX

    Semicon volume 1

    Abstract: microcontroller based cell phone detector PROJECT sgs 601 gas sensor
    Text: EPSON CMOS LSIs Product Catalog 2013 Microcontrollers 4-bit / 16-bit / 32-bit Gate Arrays / Embedded Arrays / Standard Cells 2010 2010 CMOS LSIs Product Catalog ASICs CMOS LSIs Product Catalog 2013 ASSPs Application Specific Standard Products 2013 http://www.epson.jp/device/semicon_e/


    Original     		PDF 16-bit 32-bit moS16949: Semicon volume 1 microcontroller based cell phone detector PROJECT sgs 601 gas sensor

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    metcal apr 5000

    Abstract: NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework
    Text: Advance Package Rework Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, as the industry has evolved, our rework and repair tools have


    Original     		PDF APR-5000 BRO-APR-US-05 metcal apr 5000 NZA-555-555-CGA APR-5000 APR-5000-XLS APR-5000-XL reflow temperature bga laptop NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA LGA rework