kester Sn62Pb36Ag02
Abstract: Sn63pB37 temp profile
Text: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting
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Sn63Pb37
10rpm
21Sep09
kester Sn62Pb36Ag02
Sn63pB37 temp profile
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Untitled
Abstract: No abstract text available
Text: Design Recommendation Application notes To guarantee the best soldering result in the reflow process the required paste volume and paste filling level must be optimized for the paste printing process. To ensure an optimum soldering result, we recommend a calculation of paste volume as
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IPC-A610B.
LIT0226
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DM4030LD
Abstract: diemat thermal conductivity
Text: DM4030LD Data Sheet DM4030LD THERMOPLASTIC ADHESIVE PASTE PRODUCT DATA SHEET I. DESCRIPTION The DM4030LD is a silver-loaded thermoplastic paste designed specifically for wet paste attach of large devices, heat sinks, and/or substrates. DM4030LD provides a low stress, resilient bond for large-area, highly-mismatched materials. Due to a patented polymer/
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DM4030LD
DM4030LD
sheets/DM4030LD
diemat
thermal conductivity
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215C
Abstract: solder paste
Text: Recommended Re-Flow Profile for SO8 Package Recommended solder paste is industry standard 60/40 Pb/Sn with built in ‘no clean’ flux. 215°C 179°C solder paste flows 140 – 160 secs 60 – 80 secs
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Untitled
Abstract: No abstract text available
Text: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for
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c 6090
Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Text: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste
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60-90from
IPC-A-610)
c 6090
IPC-A-610
k type thermocouple
Thermocouple Type K oven
65psi
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C 6090
Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Text: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)
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Untitled
Abstract: No abstract text available
Text: Dat asheet Design Recommendation Application notes PCB Components To guarantee the best soldering result in the reflow processes the required paste volume and paste filling level must be optimized for the paste printing process. P C B p i n h e a d e r s f o r t h e S M T p ro c e s s
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LIT0308
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GR-78-CORE
Abstract: No abstract text available
Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and
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WS200â
June-2009
GR-78-CORE
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Kester 197
Abstract: No abstract text available
Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder
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Sn63Pb37,
10Sep04
Kester 197
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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MLF3216C150K
Abstract: MLF1608K-100K MLF3216E-6R8K MLF1608D-R18K MLF3216A-3R9 MLF2012E120K MLF1608D-R68K MLF3216A1R0K MLF3216DR15K MLF3216DR27K
Text: Page: 1 Thursday, May 22, 1997 4b3b.html MLF SERIES Shielded Inductor TDK's MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor's multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure.
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H/100
20CURRENT
20PROJECTS/TDK/
20Web
20Site
20Revisions/htdocs/
MLF3216C150K
MLF1608K-100K
MLF3216E-6R8K
MLF1608D-R18K
MLF3216A-3R9
MLF2012E120K
MLF1608D-R68K
MLF3216A1R0K
MLF3216DR15K
MLF3216DR27K
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Soldering guidelines pin in paste
Abstract: TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch
Text: COMMUNICATIONS, DATA, CONSUMER DIVISION TM QUICKIE Cable-to-board Connectors for Pin-in-Paste Processes Quickie Cable-to-board Connectors for Pin-in-Paste Processes Description Quickie™ is FCI’s brand for cable-to-board connectors in 2.54mm pitch. The Quickie™ product range
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2002/95/IEC
E66906
LR46923
BUS-12-055
TA-893
TA-894
TA-842
Soldering guidelines pin in paste
TA-893
connectors
Shrouded Header, 8 Pin, 2mm fci
minitek
idc shrouded header
pin in paste
BUS-12-055
LR46923
right angle 14 pin pcb connector 2mm pitch
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Soldering guidelines pin in paste
Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
Text: Products for solder-to-board applications MINITEK Headers for Pin-in-Paste Processes MINITEK™ Pin-in-Paste DESCRIPTION Minitek is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. The Minitek product range includes PCB Card Connectors,
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CDC-MINIPIP-02/07-E
Soldering guidelines pin in paste
TA-895
idc shrouded header
minitek
pin in paste
LR46923
right angle 5 pin pcb connector
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
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GR-78-CORE
Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased
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MP200
ANSI/J-STD-004
GR-78-CORE
J-STD-005
multicore solder paste
GR78-CORE
GR-78-CORE PCB
solder powder
J-STD-004 paste
J-STD-004 MSDS
bellcore GR-78
MCF800
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smc diode
Abstract: No abstract text available
Text: SOLDER STENCIL GUIDELINES pattern of the opening in the stencil for the drain pad is not critical as long as it allows approximately 50% of the pad to be covered with paste. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads.
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SC-59,
SC-70/SOT-323,
OD-123,
OT-23,
OT-143,
OT-223,
SO-14,
SO-16,
smc diode
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Untitled
Abstract: No abstract text available
Text: Automotive and Anti-Sulfuration Chip Resistor 0603 Description The resistors are constructed in a high grade ceramic body aluminium oxide . Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the
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Q-200
element14
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all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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stencil tension
Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning
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AN-1112
stencil tension
IPC-SM-785
PT100 bridge
AN-1112
GENERAL SEMICONDUCTOR MARKING UM
Solder paste stencil life
WLCSP stencil design
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rj45 JACK ultra low profile
Abstract: 43202-8919 1803
Text: Modular Jack FEATURES AND SPECIFICATIONS Features and Benefits • Ultra low profile ■ Enhanced panel grounding tabs on shielding RJ-45 configuration ■ Enclosed top ■ Surface Mount Compatible materials ■ Pin through paste solderability ■ 100% tested for hi-pot and continuity
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RJ-45
PSX-43202
E107635
LR19980
rj45 JACK ultra low profile
43202-8919
1803
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