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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance	Original	PDF	PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance

Original

PDF

PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW