sc-70 package pcb layout
Abstract: sc70-3 PCB PAD AN813 mosfet 3pin SC70-6 320 SC70-6 12 mosfet 3pin
Text: AN813 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern and Thermal Peformance INTRODUCTION BASIC PAD PATTERNS This technical note discusses pin-outs, package outlines, pad patterns, evaluation board layout, and thermal performance
|
Original
|
PDF
|
AN813
SC-70
SC70-3
SC70-6
12-Dec-03
sc-70 package pcb layout
sc70-3 PCB PAD
AN813
mosfet 3pin
320 SC70-6
12 mosfet 3pin
|
Untitled
Abstract: No abstract text available
Text: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAIR 3 x 3 0.450 0.650 0.018 (0.026) 0.450 (0.018) 1.036 2.450 (0.096) 0.084 (0.003) (0.041) 0.209 (0.008) 0.306 (0.012) 0.562 (0.022) (0.063) 1.611 0.390 (0.015) 1.200 (0.047) Recommended PAD for PowerPAIR 3 x 3
|
Original
|
PDF
|
25-May-11
|
so8 pcb pattern
Abstract: 1206-8 chipfet layout vishay so-8 pin dimensions
Text: AND8237/D Low VCE sat BJT in 1206A ChipFETt Package Recommended Pad Pattern and Thermal Performance http://onsemi.com APPLICATION NOTE INTRODUCTION Basic Pad Patterns The basic pad layout with dimensions is shown in Figure 2. This is sufficient for low VCE(sat) BJT applications,
|
Original
|
PDF
|
AND8237/D
so8 pcb pattern
1206-8 chipfet layout
vishay so-8 pin dimensions
|
QFN 5X5
Abstract: "thermal via" qfn land pattern
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
PDF
|
com/data/tb/TB389
dwg/plastic/P4171
QFN 5X5
"thermal via"
qfn land pattern
|
QFN 5x5
Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
PDF
|
com/data/tb/TB389
dwg/plastic/P4171
QFN 5x5
qfn stencil
"exposed pad" PCB via
"thermal via"
solder mask
P4171
X-RAY INSPECTION
via diameter pitch
40-QFN
QFN "exposed die"
|
SO8L
Abstract: 63818 PowerPAK SO-8L 1291
Text: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAK SO-8L SINGLE 5.000 0.197 0.510 (0.020) 2.310 (0.091) 4.061 (0.160) 0.595 (0.023) 6.250 (0.246) 8.250 (0.325) 3.630 (0.143) 0.610 (0.024) 0.410 (0.016) 2.715 (0.107) 0.860
|
Original
|
PDF
|
07-Feb-12
SO8L
63818
PowerPAK SO-8L
1291
|
Untitled
Abstract: No abstract text available
Text: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAK SO-8L DUAL 6.7500 0.266 5.1300 (0.202) 0.4100 (0.016) 0, 0 1.7300 (0.068) 0.5000 (0.020) 1.9800 (0.078) 0.9150 (0.036) 0.5850 (0.023) 0.7200 (0.028) 2.1100 (0.083) 3.0750
|
Original
|
PDF
|
07-Feb-12
|
MHz6025
Abstract: 280110c
Text: MICROPROCESSOR CRYSTALS AT 4.88 mm LEAD SPACING, LOW PROFILE 4-PAD ABSM 5 FEATURES: • Excellent all-purpose surface-mount crystal. • Four pad land pattern compatible with common ceramic package. APPLICATIONS: • Modems, communications and density equipment
|
Original
|
PDF
|
MHz6025
579Fun30
280110c
|
Untitled
Abstract: No abstract text available
Text: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PADS FOR MINI QFN 8L 1.70 0.80 1.70 0.60 x6 0.125 typ. 0.25 x2 0.50 0.40 0.25 x6 Suggested Minimum Pad Dimensions in mm Document Number: 66555 Revision: 05-Mar-10 www.vishay.com 1
|
Original
|
PDF
|
05-Mar-10
|
SMD resistors
Abstract: vishay 1206 SMD resistors SMD resistors 1206 vishay 0603 SMD resistors
Text: Recommended Solder Pad Dimensions Vishay Beyschlag Surface Mount Resistors PATTERN STYLES FOR SMD RESISTORS limits for solder resistance 0.1 occupied area X Y G Z Dimensions in mm RECOMMENDED SOLDER PAD DIMENSIONS FOR FIXED LINEAR SMD RESISTORS WAVE SOLDERING
|
Original
|
PDF
|
02-Apr-04
ff3aresist207
SMD resistors
vishay 1206 SMD resistors
SMD resistors 1206
vishay 0603 SMD resistors
|
SMD resistors
Abstract: vishay 1206 SMD resistors vishay 0805 SMD resistors vishay 0603 SMD resistors vishay-beyschlag mma surface mount resistors BEYSCHLAG z 40 resistor mcs 0402 vishay 02MAR05
Text: Recommended Solder Pad Dimensions Vishay Beyschlag Surface Mount Resistors PATTERN STYLES FOR SMD RESISTORS limits for solder resistance 0.1 occupied area X Y G Z Dimensions in mm RECOMMENDED SOLDER PAD DIMENSIONS FOR FIXED LINEAR SMD RESISTORS WAVE SOLDERING
|
Original
|
PDF
|
02-Mar-05
SMD resistors
vishay 1206 SMD resistors
vishay 0805 SMD resistors
vishay 0603 SMD resistors
vishay-beyschlag mma
surface mount resistors
BEYSCHLAG
z 40 resistor
mcs 0402 vishay
02MAR05
|
Untitled
Abstract: No abstract text available
Text: PAD Pattern Vishay Siliconix RECOMMENDED MINIMUM PAD FOR PowerPAIR 6 x 5 7.080 0.279 2.720 (0.107) 8.080 (0.318) 5.820 (0.229) 0.407 (0.016) 0.567 (0.022) 1.960 (0.077) (0,0) 2.185 (0.086) 2.153 (0.085) 3.260 Pin 1 (0.128) 0.616 (0.024) 3.920 (0.154) 0.970
|
Original
|
PDF
|
13-Jan-11
|
PAD Pattern
Abstract: TSSOP-16
Text: PAD Pattern www.vishay.com Vishay Siliconix RECOMMENDED MINIMUM PAD FOR TSSOP-16 0.193 4.90 0.171 0.014 0.026 0.012 (0.35) (0.65) (0.30) (4.35) (7.15) 0.281 0.055 (1.40) Recommended Minimum Pads Dimensions in inches (mm) Revision: 02-Sep-11 1 Document Number: 63550
|
Original
|
PDF
|
TSSOP-16
02-Sep-11
PAD Pattern
TSSOP-16
|
handle
Abstract: P134 P156 T107
Text: CATALOG 126 backup:CATALOG 126.qxd 8/10/2009 9:58 AM Page 76 PCB Accessories ELECTRONICS & TECHNOLOGY, INC. A FINE TECHNOLOGY GROUP Tools & Handles Pad Cutters, Insertion Tools Shank Type A13 type Hand Insertion Tools for Push-In Terminals Pad Cutters: Vector Pad Cutters
|
Original
|
PDF
|
A13-1
P133A
K36107/C
T107/10
P116C
P138C
P138A
P116C
P138C
handle
P134
P156
T107
|
|
|
FR4 SUBSTRATE SHEET
Abstract: 0343
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
|
OCR Scan
|
PDF
|
|
DS1822X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
|
OCR Scan
|
PDF
|
DS1822X
DS1822X
|
0660H
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD
|
OCR Scan
|
PDF
|
175-O
41-A9502-000
IE/06/1999
DS9502X
DS9502X
0660H
|
Untitled
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. U N D ER FILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. NUMBER LAND PAD CONNECTIONS AND CENTER COORDINATES
|
OCR Scan
|
PDF
|
DS1820X
DS1820X
|
underfill
Abstract: DS2415X D085-002 FR4 substrate
Text: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
|
OCR Scan
|
PDF
|
DS2415X
DS2415X
underfill
D085-002
FR4 substrate
|
DS2430AX
Abstract: FR4 substrate 0537
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
|
OCR Scan
|
PDF
|
DS2430AX
IS2430AX
022GE
DS2430AX
FR4 substrate
0537
|
FR4 SUBSTRATE SHEET
Abstract: DS75X 3ao2
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X
|
OCR Scan
|
PDF
|
DS75X
DS75X
FR4 SUBSTRATE SHEET
3ao2
|
DS56X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
|
OCR Scan
|
PDF
|
DS56X
DS56X
|
underfill
Abstract: DS2417X FR4 substrate ds2417
Text: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS
|
OCR Scan
|
PDF
|
DS2417X
DS2417X
underfill
FR4 substrate
ds2417
|
sot89 3X
Abstract: No abstract text available
Text: PAD LAYOUT DETAILS SOT23 SOT223 4.6 1 • I: 2.0 2.3 1.5 min 3x 6.8 - 0 .9 5 ~ 1 .9 -1 SOT23 pattern. Minimum Pad Size (dimensions in mm) S O T 2 2 3 p attern M in im u m Pad Sizes (d im e n s io n s in m m ) SOT89 r 2.4 4.0 1.5 -1 ,2 - ~ - 1 .C r 3.2 ^ 1 12 " ~
|
OCR Scan
|
PDF
|
OT223
sot89 3X
|
