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    PAD LAYOUTS Search Results

    PAD LAYOUTS Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions

    PAD LAYOUTS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Soldering Process

    Abstract: DO213-AB
    Text: Pad Layouts/Soldering Process www.vishay.com Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER DFS BRIDGE MBS BRIDGE 0.047 1.20 MIN. MBLS BRIDGE


    Original     		PDF DO-214AC DO-214BA O-263 DO-214AA DO-214AB J-STD-020D. 12-Sep-13 Soldering Process DO213-AB

    "General Semiconductor" DO-214AC

    Abstract: MicroSMP Pad Layout TL 413 DO-213AA DO-220AA GL34
    Text: Pad Layouts/Soldering Process Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER MBS BRIDGE DFS BRIDGE 0.023 MIN. 0.58 MIN. 0.047 MIN. (1.20 MIN.)


    Original     		PDF DO-218 O-263 24-Apr-07 "General Semiconductor" DO-214AC MicroSMP Pad Layout TL 413 DO-213AA DO-220AA GL34

    MM912G634DV1AE

    Abstract: 51413 15x10-6 125c59 Operational transconductance amplifier 54-031 S12CPMU
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 10.0, 1/2013 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 MM912G634 MM912H634 HCS12 16-Bit MM912G634DV1AE 51413 15x10-6 125c59 Operational transconductance amplifier 54-031 S12CPMU

    CTR31 PCB Controller

    Abstract: MM912G634 fet ifr 634 MM912G634CV1AE TSG 3255 TC0800 54113 uns tread MM912 D flip flop
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 5.0, 9/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 48-PIN MM912G634 MM912H634 HCS12 16-Bit CTR31 PCB Controller MM912G634 fet ifr 634 MM912G634CV1AE TSG 3255 TC0800 54113 uns tread MM912 D flip flop

    bc 494 b f.m transmitter

    Abstract: SCR SS 3328 CTR31 PCB Controller 51-6332 Tl 5153 dp1203 N203 57210 54123 application as pulse generator TSG 3255
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 MM912G634 MM912H634 HCS12 16-Bit bc 494 b f.m transmitter SCR SS 3328 CTR31 PCB Controller 51-6332 Tl 5153 dp1203 N203 57210 54123 application as pulse generator TSG 3255

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 9.0, 12/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 48-PIN MM912G634 MM912H634 HCS12 16-Bit

    dual coil latching relay

    Abstract: hall sensor 41 hall 44132 rain light sensor ctr31 D2D DIODE B2k marking 3 PIN hall effect sensor n 177 4205 mosfet TSG 3255
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 4.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 MM912G634 MM912H634 HCS12 16-Bit dual coil latching relay hall sensor 41 hall 44132 rain light sensor ctr31 D2D DIODE B2k marking 3 PIN hall effect sensor n 177 4205 mosfet TSG 3255

    dual coil latching relay

    Abstract: MOSFET K 4202 mosfet 4914 LIN conformance fet ifr 634 TSG 3255
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 3.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 MM912G634 MM912H634 HCS12 16-Bit dual coil latching relay MOSFET K 4202 mosfet 4914 LIN conformance fet ifr 634 TSG 3255

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 48-PIN MM912G634 MM912H634 HCS12 16-Bit

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 8.0, 11/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are


    Original     		PDF 634D1 48-PIN MM912G634 MM912H634 HCS12 16-Bit

    Untitled

    Abstract: No abstract text available
    Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7


    Original     		PDF THS6032 SLOS233E 400-mA 65-MHz 100-MHz

    Untitled

    Abstract: No abstract text available
    Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7


    Original     		PDF THS6032 SLOS233E 400-mA 65-MHz 100-MHz

    pal 003

    Abstract: No abstract text available
    Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7


    Original     		PDF THS6032 SLOS233E 400-mA 65-MHz 100-MHz pal 003

    Untitled

    Abstract: No abstract text available
    Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7


    Original     		PDF THS6032 SLOS233E 400-mA 65-MHz 100-MHz

    Untitled

    Abstract: No abstract text available
    Text: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7


    Original     		PDF THS6032 SLOS233E 400-mA 65-MHz 100-MHz

    epcos 16v 157

    Abstract: B45196 EPCOS B45196 EPCOS B45196-E 107 16V epcos B45190E1336M209 B45196-H B45197-A B45198-H B45198-R
    Text: Specification Tantalum Chip Capacitor; MnO2 B45190E1336M209 Content 1. Electrical parameter 2. Shipping, storage and production environment 3. Ordering code structure 4. Specification in brief 5. Dimensional drawing 6. Marking 7. Recommended solder pad layouts


    Original     		PDF B45190E1336M209 epcos 16v 157 B45196 EPCOS B45196 EPCOS B45196-E 107 16V epcos B45190E1336M209 B45196-H B45197-A B45198-H B45198-R

    AA112A

    Abstract: IPC-7351A
    Text: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10


    Original     		PDF AP02002) AP02001) IPC-7351A) DFN0402â DFN0603â DFN0606â IPC-7351A, AA112A IPC-7351A

    Untitled

    Abstract: No abstract text available
    Text: SM Crystal GSX-7A Specifications Product Parameters GSX 7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS


    Original     		PDF 100ppm

    16.0MHZ

    Abstract: 22.1184 22.118400
    Text: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS


    Original     		PDF 100ppm 16.0MHZ 22.1184 22.118400

    Untitled

    Abstract: No abstract text available
    Text: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS


    Original     		PDF 100ppm

    16.0MHz GSX

    Abstract: 7,3728 7.3728 GSX-852
    Text: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ࡯ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm


    Original     		PDF GSX-852 30ppm 50ppm 100ppm 20ppm 100ppm) GSX-852/551EF 16.0MHz GSX 7,3728 7.3728 GSX-852

    7.3728

    Abstract: GSX-852 400D 16.0MHz
    Text: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ࡯ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm


    Original     		PDF GSX-852 30ppm 50ppm 100ppm 20ppm 100ppm) GSX-852/551EF 7.3728 GSX-852 400D 16.0MHz

    Untitled

    Abstract: No abstract text available
    Text: CERAM IC MICROWAVE FILTERS SAW FILTERS & RESONATORS DIMENSIONS & SUGGESTED PAD LAYOUTS SC33PACKAGE Terminals : Input : Output O th e rs: Ground mnffata /kM&nter t* SC33 LOW PROFILE Terminals $ Land Pattern 4 -1 .5 ± 0.15 1 .5 ± 0 .1 5 Sugge ste d Pad Layout


    OCR Scan     		PDF SC33PACKAGE SL45B CG01-H SU511

    524 suppressor

    Abstract: No abstract text available
    Text: CONTENTS POWER SEMICONDUCTOR DIVISION PRODUCT CATALOG 12 Edition GENERAL INFORMATION PACKAGING, ASSEMBLY RECOMMENDATIONS, Introduction .1 AND PAD LAYOUTS . 495


    OCR Scan     		PDF 12TMEdition 524 suppressor