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    PACKAGING COMPONENTS Search Results

    PACKAGING COMPONENTS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGING COMPONENTS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    mems

    Abstract: mems pacemaker MEMS ic silicon mems microphone glass frit bolometer mems microphone structure MEMS IC Introduction to accelerometers bolometer sensor
    Text: MEMS and Microsystem Packaging NMI at INNOS June 2005 CONFIDENTIAL Introduction ƒ Background to MEMS and Microsystem Packaging ƒ Types of Packaging – “Zero level” packaging – Primary packaging – Secondary packaging [Page 1] CONFIDENTIAL Silicon IC Systems


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    973057-2

    Abstract: datasheet fr 107 carton box
    Text: 1. GENERAL 1.1 PURPOSE This packaging specification covers the packaging material, packaging method & packaging quantities for E3.2 Bushless Header Assy. 1.2 SCOPE This specification is applicable to the packaging of Bushless Header Assy. part number: 1814733-1


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    PHILIPS 2222 370 capacitors

    Abstract: MSA650 philips axial ceramic capacitor philips mono-kap philips ceramic leaded capacitors PHILIPS capacitors philips components mono-kap mono-kap Philips capacitor axial Mono-Axial
    Text: Philips Components Leaded ceramic multilayer capacitors General data PACKAGING The monolithic ceramic capacitors are supplied in bulk packaging, taped on reel, or in ammopack; see Tables 1 and 3. Mono-axialTM capacitors Table 1 Packaging quantities and box dimensions


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    PDF 15-digit 15-digit PHILIPS 2222 370 capacitors MSA650 philips axial ceramic capacitor philips mono-kap philips ceramic leaded capacitors PHILIPS capacitors philips components mono-kap mono-kap Philips capacitor axial Mono-Axial

    smd code marking 56 sot23-6

    Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
    Text: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,


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    PDF PI3USB412 PI74STX1GU04A PI3USBA03 PI74STX2G04 PI3USBA201 PI74STX2G14 PI5A121 PI74STX2G4245 PI5A122 smd code marking 56 sot23-6 marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5

    Untitled

    Abstract: No abstract text available
    Text: RESISTIVE COMPONENTS PACKAGING OPTIONS Our packaging system ensures that our product reaches your facility in factory fresh condition. Please contact our sales department for options on your specific device type. • Tray Packaging Rigid vinyl film vacuum formed specifically for each device style


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    Schaffner 781

    Abstract: Diodes smd e5 "Toggle Switch" C 245 B Schaffner catalog SMD e5 EIA481A TG36WS80050 IEA-RS448-2 apem -2 e6
    Text: DESIGNED EXCLUSIVELY FOR SURFACE MOUNTING SMT TG Series switches incorporate many desireable features that include: ● E E4 Tape & reel packaging This type of packaging is recommended for: ● economy ● suitability for automated placement ● handling of large quantities of components per packaging unit


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    EIA-481-3

    Abstract: EIA-481-2 MIC2557BM 56mm carrier tape Carrier tape for TO263 package 16MM TAPE PACKAGE
    Text: Packaging for Automatic Handling Micrel Packaging for Automatic Handling Tape & Reel and Ammo Pack General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO-92 device


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    PDF OT-23 OT-23-5 OT-223 O-263 EIA-481-3 EIA-481-2 MIC2557BM 56mm carrier tape Carrier tape for TO263 package 16MM TAPE PACKAGE

    sm58a

    Abstract: DO215AA EIA 481-C RGP10E DO-221
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


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    PDF DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 08-Aug-12 sm58a DO215AA EIA 481-C RGP10E DO-221

    Untitled

    Abstract: No abstract text available
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PREFERRED PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


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    PDF DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 02-Mar-15

    peel force

    Abstract: Siemens matsua
    Text: Taping Lead spacing 2,5 mm 4 1 Lead spacing 5,0 mm 4) 234 1) ± 1 mm / 20 hole spaces 2) Measured at top of component body 3) Peel force ≥ 5 N 4) Taping in accordance with IEC 286-2 10 Siemens Matsushita Components Packaging Ammo packaging Reel packaging


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    packaging

    Abstract: No abstract text available
    Text: Packaging and Order Information www.vishay.com Vishay Semiconductors Packaging and Order Information PACKAGING SURVEY RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the dry bag has been opened to prevent moisture absorption. TABLE 1 - PACKAGING OPTIONS OF


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    PDF TEKS5400S TEKT5400S TSKS5400S BP104 BPW34 BP104S BPW34S BP104S 02-Mar-15 packaging

    do-204

    Abstract: T1 Packaging vishay
    Text: Packaging Information Vishay High Power Products Packaging Information SUMMARY CASE TYPE PACKAGING MODE PACKAGING DESCRIPTION PER T/R/B QUANTITY MOQ TO-220 Tube Anti-static plastic tubes 50 1000 TO-220FP Tube Anti-static plastic tubes 50 1000 TO-218 Tube Anti-static plastic tubes


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    PDF O-220 O-220FP O-218 O-247 05-Mar-10 DO-41 DO-201 DO-204 do-204 T1 Packaging vishay

    TRANSISTOR BC 534

    Abstract: No abstract text available
    Text: THROUGH-HOLE PACKAGING REELS, TUBES, AMMO PACKS & TAPING SPECIFICATIONS MINIMUM PACKAGING QUANTITY MINIMUM PACKAGING QUANTITY Available Packaging Device Type 5KP 5W 5KW A-405 DF-M DO-15 D0-201 DO-201AD DO-35 DO-41 E-LINE GBJ GBPC/W GBU KBJ KBP KBPC/W MB/W


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    PDF DO-15 D0-201 DO-201AD DO-35 DO-41 O220AB/AC, ITO-220AB, ITO-220S, O220F AP02008 TRANSISTOR BC 534

    NCM20

    Abstract: NCM50
    Text: www.niccomp.com | Technical Support: tpmg@niccomp.com Leaded Components – Lead Spacing Guide RADIAL LEADED ALUMINUM ELECTROLYTIC CAPACITOR - PACKAGING Packaging Options Case Size 4X7 Qty Per Bag 200 BULK MOQ 12,000 Carton Quantity 48,000 TAPE & BOX TB


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    PDF 10X12 10X16 NCM15 NCM20: NCM21, NCM30 NCM40: NCM50: NCM20 NCM50

    NEC stacked MCP 1999

    Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
    Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a


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    rc circuits

    Abstract: No abstract text available
    Text: INDUCTIVE COMPONENTS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers July, 2008 Model 79F - Elimination of Packaging in Bags Effective immediately, Model 79F will be only offered with packaging of 2000 pieces per ammopack box. We are no longer able to offer the 1000 pieces per bag packaging option. For your


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    PDF 41-41-768C 79FR68M-RC 79FR82M-RC 79F100K-TR-RC 79F101K-TR-RC 79F120K-TR-RC 79F121K-TR-RC 79F150K-TR-RC 79F151K-TR-RC 79F180K-TR-RC rc circuits

    74F686AP-3%-TR-RC

    Abstract: No abstract text available
    Text: INDUCTIVE COMPONENTS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers July, 2008 Model 79F - Elimination of Packaging in Bags Effective immediately, Model 79F will be only offered with packaging of 2000 pieces per ammopack box. We are no longer able to offer the 1000 pieces per bag packaging option. For your


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    PDF IC0843 79F100K-RC 79F101K-RC 79F120K-RC 79F121K-RC 79FR68M-RC 79FR82M-RC 79F100K-TR-RC 79F101K-TR-RC 79F120K-TR-RC 74F686AP-3%-TR-RC

    Untitled

    Abstract: No abstract text available
    Text: Programmable LVDS Oscillator CARDINAL COMPONENTS Applications * LVDS Output * Fast Delivery * Industry Standard Packaging Part Numbering Example: CHL Z - A5 BP - 222.5792 TS BP CHL Z A5 SERIES CHL PACKAGING OPTIONS Blank = Bulk Z = Tape and Reel OPERATING TEMP.


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    PDF 12kHz 20MHz 10kHz: C-090414-11

    circuit of smart hearing aid

    Abstract: digital hearing aids digital pacemaker hearing aid chip Modelling pacemaker A449 A466
    Text: FA C T F I L E ZARLINK ADVANCED PACKAGING MEDICAL Expertise in micro-packing—smaller, faster, more reliable Zarlink’s Advanced Packaging division delivers a competitive advantage for its customers by miniaturising electronic components to create smaller,


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    Untitled

    Abstract: No abstract text available
    Text: - a t _ îl|C O Electronics _ . , Packaging Specification 107-90020 10/07/01 Rev. O Packaging Specification Sub D housing 1. SCOPE : TRAY PACKAGING FOR SUB D HOUSING WITH TYCO LABEL 2. USED PACKAGING PHANTOM NUMBERS AND QUANTITIES Packaging Phantom Number


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    PDF F42048V7201C F42048V7126C

    Untitled

    Abstract: No abstract text available
    Text: GENERAL INFORMATION LEAD TAPING AND PACKAGING LEAD TAPING AND PACKAGING OF AXIAL COMPONENTS FOR AUTOMATIC AND ROBOT INSERTION MACHINES Packaging detail T echnical term s: IEC 60286-1 A vaila ble reel 355 mm only. Reel Description Symbol Dimensions mm Component diameter


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    PDF 0355mm 0500mm

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS SYM ZONE AMPHENOL PART NUMBER CONFIGURATION: U65 - X XX - X X 7 XXX c Z.L. IS A CAD DRAWING. DO NOT MANUALLY REVISE. PACKAGING/SPECIAL NO DIGIT = TRAY PACKAGING NO REAR COVER C = TRAY PACKAGING WITH REAR COVER SHIPPED LOOSE T = TAPE & REEL PACKAGING


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    PDF APR15/10

    Untitled

    Abstract: No abstract text available
    Text: PARADIGM Module Packaging Advanced Packaging Advances in packaging techniques permit a wide variety of solutions to board space problems. M odules are comprised of individual semiconductor devises with other support devises, such as decoders and capacitors


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    PDF 100-mil

    -40SS

    Abstract: philips tantalum Capacitors Philips LL capacitor axial 40SS philips philips tantalum
    Text: Tape and Reel Packaging l _l Tantalum Capacitors Philips Components offers lead tape and reel packaging for axial leaded tantalum capacitors. Standard tape and reeling is per EIA specification RS-296, optional configurations for specific applications are available.


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    PDF RS-296, CSR13 CSR21 CSR23 CSR33 -40SS philips tantalum Capacitors Philips LL capacitor axial 40SS philips philips tantalum