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    PACKAGE WEIGHT Search Results

    PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    1653G

    Abstract: No abstract text available
    Text: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR


    Original     		PDF

    tensolite

    Abstract: No abstract text available
    Text: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].


    Original     		231CCSF tensolite PDF

    tensolite

    Abstract: 231CCSF tensolite price 231CC
    Text: v01.0310 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE


    Original     		231CCSF C-10B C-10B tensolite tensolite price 231CC PDF

    tensolite

    Abstract: No abstract text available
    Text: v01.0310 C-5 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-5 Package Outline Drawing Typical Package Weight Package 17.7 gms Spacer 2.6 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. MOUNTING SPACER: NICKEL PLATED ALUMINUM


    Original     		PDF

    tensolite

    Abstract: tensolite price
    Text: v01.0310 C-9 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-9 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]


    Original     		231CCSF tensolite tensolite price PDF

    tensolite

    Abstract: tensolite* connec 5ccs
    Text: v01.0310 C-6 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-6 Package Outline Drawing Typical Package Weight Package 17.4 gms Spacer 3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN


    Original     		PDF

    tensolite

    Abstract: 231CCSF
    Text: v00.0406 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER


    Original     		231CCSF C-10B tensolite PDF

    100 PIN "PGA" ALTERA DIMENSION

    Abstract: No abstract text available
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


    Original     		PDF

    altera ep610

    Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


    Original     		PDF

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package 2 D PAK Package Weight mg 1700 Product Group Type No. SB820D –SB8200D SB820DC –SB8200DC SB1020D –SB10200D SB1020DC –SB10200DC SB1620D –SB16200D SB1620DC –SB16200DC


    Original     		SB820D SB8200D SB820DC SB8200DC SB1020D SB10200D SB1020DC SB10200DC SB1620D SB16200D PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    BC 1098

    Abstract: EPM7384 ALTERA 68 PLCC t187
    Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187 PDF

    diode switching

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOT-363 Package Weight mg 6 Product Group Type No. RB731XN SD103ATW BAT54ADW / CDW / SDW BAT54BRW, BAT54TW BAS16TW, BAV70DW, BAV99BRW, BAV756DW BAW56DW, BAW567DW, MMBD4148TW


    Original     		OT-363 RB731XN SD103ATW BAT54ADW BAT54BRW, BAT54TW BAS16TW, BAV70DW, BAV99BRW, BAV756DW diode switching PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-PW Package Weight mg 18000 Product Group Type No. KBPC1000PW – KBPC1012PW KBPC1500PW – KBPC1512PW KBPC2500PW – KBPC2512PW KBPC3500PW – KBPC3512PW KBPC4000PW – KBPC4012PW


    Original     		KBPC1000PW KBPC1012PW KBPC1500PW KBPC1512PW KBPC2500PW KBPC2512PW KBPC3500PW KBPC3512PW KBPC4000PW KBPC4012PW PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-S Package Weight mg 21000 Product Group Type No. GBPC1000S – GBPC1016S KBPC1000S – KBPC1012S GBPC1500S – GBPC1516S KBPC1500S – KBPC1512S GBPC2500S – GBPC2516S


    Original     		GBPC1000S GBPC1016S KBPC1000S KBPC1012S GBPC1500S GBPC1516S KBPC1500S KBPC1512S GBPC2500S GBPC2516S PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ITO-220 Package Weight mg 1900 Product Group Type No. SB620FCT – SB6100FCT SB820FCT – SB8200FCT SB1020FCT – SB10200FCT SB1620FCT – SB16200FCT SB2020FCT – SB20200FCT


    Original     		ITO-220 SB620FCT SB6100FCT SB820FCT SB8200FCT SB1020FCT SB10200FCT SB1620FCT SB16200FCT SB2020FCT PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBPC-W Package Weight mg 18000 Product Group Type No. GBPC1000W – GBPC1016W GBPC1500W – GBPC1516W GBPC2500W – GBPC2516W GBPC3500W – GBPC3516W GBPC4000W – GBPC4016W


    Original     		GBPC1000W GBPC1016W GBPC1500W GBPC1516W GBPC2500W GBPC2516W GBPC3500W GBPC3516W GBPC4000W GBPC4016W PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-W Package Weight mg 28000 Product Group Type No. KBPC1000W – KBPC1012W KBPC1500W – KBPC1512W KBPC2500W – KBPC2512W KBPC3500W – KBPC3512W KBPC4000W – KBPC4012W


    Original     		KBPC1000W KBPC1012W KBPC1500W KBPC1512W KBPC2500W KBPC2512W KBPC3500W KBPC3512W KBPC4000W KBPC4012W PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-P Package Weight mg 21000 Product Group Type No. KBPC1000P – KBPC1012P KBPC1500P – KBPC1512P KBPC2500P – KBPC2512P KBPC3500P – KBPC3512P KBPC4000P – KBPC4012P


    Original     		KBPC1000P KBPC1012P KBPC1500P KBPC1512P KBPC2500P KBPC2512P KBPC3500P KBPC3512P KBPC4000P KBPC4012P PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MiniMELF Package Weight mg 30 Product Group Type No. LL4148 GLZ Series ZMM5221B – ZMM5266B ZMM55C2V4 – ZMM55C75 Component Die Doped Silicon* Dumet Wire Ferrous Alloy


    Original     		LL4148 ZMM5221B ZMM5266B ZMM55C2V4 ZMM55C75 300mA 43centration 2011/65/EU. PDF

    weight

    Abstract: PLCC weight
    Text: Package Outlines - Integrated Circuits Dimensions in mm 68-Pin PLCC Package Weight approx. 4.8 g 61 W rnjiJTi 10 -e 26 JUUUUUULTT 27 -2 5 * I 44-Pin PLCC Package Weight approx. 2.5 g 80-Pin QFP Plastic Package Weight approx. 1.61 g - 2 3 x 0 .8 = 18.4- 65 EE


    OCR Scan     		68-Pin 44-Pin 80-Pin 16-Pin 14-Pin O-116 OT-89A O-92UA O-202 weight PLCC weight PDF