PACKAGE TRAY Search Results

PACKAGE TRAY Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

PACKAGE TRAY Price and Stock

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TE Connectivity 830M1-0050-TRAY-PACKAGED 830M1-0050 Triaxial 50g Tray 25pcs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	830M1-0050-TRAY-PACKAGED					1 - 10 - 100 $188.35 1000 $125.09 10000 $125.09	Buy Now
TE Connectivity 830M1-0100-TRAY-PACKAGED 830M1-0100 Triaxial 100g Tray 25pcs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	830M1-0100-TRAY-PACKAGED					1 - 10 - 100 $121.43 1000 $121.43 10000 $121.43	Buy Now
TE Connectivity 830M1-0025-TRAY-PACKAGED 830M1-0025 Triaxial 25g Tray 25pcs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	830M1-0025-TRAY-PACKAGED					1 - 10 - 100 $126.94 1000 $126.94 10000 $126.94	Buy Now
TE Connectivity 830M1-2000-TRAY-PACKAGED 830M1-2000 Triaxial 2Kg Tray 25pcs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	830M1-2000-TRAY-PACKAGED					1 - 10 - 100 $121.43 1000 $121.43 10000 $121.43	Buy Now
TE Connectivity 830M1-0500-TRAY-PACKAGED 830M1-0500 Triaxial 500g Tray 25pcs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	830M1-0500-TRAY-PACKAGED					1 - 10 - 100 $126.94 1000 $126.94 10000 $126.94	Buy Now

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PACKAGE TRAY Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
7261 markem Abstract: Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white Text: HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm inch WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK	Original	14-Lead 18-Lead 150degC TPC460 2-June-2010 7261 markem Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white	PDF
SMD MARKING CODE 071 A01 Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods	Original	LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo	PDF
hssop Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES	Original		PDF
SMD BOOK Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK Text: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD	Original	P-DIP-40 20B40 P-LCC-28-1 P-LCC-44-1 P-LCC-68 P-LCC-84-2 P-MQFP-44-2 P-MQFP-44-4 P-MQFP-80 P-MQFP-100-2 SMD BOOK smd 842 SMD Packages TQFP Package 44 lead P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK	PDF
oki qfp tray Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE	Original		PDF
10C2 Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension	Original	12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G	PDF
transistor b 1238 Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original		PDF
28F160 Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original		PDF
EFTEC-64 Abstract: OPQ0014 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014	PDF
Ablebond 8380 Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that	Original	CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping	PDF
324pc Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881 Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension	Original	240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881	PDF
M02142 Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash Text: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods	Original	DB81-10004-2E M02142 CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash	PDF
FET SOT-89 Abstract: 74 Series Logic ICs xc62a sot89 fet XC62C fet sot89 XC61B XB15A407 XP151A21A2MR XC62D Text: Status of Obsolescence No. Product Status Product Series Classification Package 1 Discontinued Product XB15A105 Diode PIN Small Glass Package 2 Discontinued Product XB15A204 Diode(PIN) Small Glass Package 3 Discontinued Product XB15A301 Diode(PIN) Small Glass Package	Original	XB15A105 XB15A204 XB15A301 XB15A303 XB15A308 XB15A402 XB15A407 XB15A709 XC213tep XC9235 FET SOT-89 74 Series Logic ICs xc62a sot89 fet XC62C fet sot89 XC61B XB15A407 XP151A21A2MR XC62D	PDF
csp process flow diagram Abstract: jedec Package Shipping Trays Text: 2.0 µBGA* PACKAGE/PRODUCT PROCESS FLOW Wafer Fabrication Fab 2.1 Overview The µBGA package cross-sectional diagram is illustrated below Figure 3 and displays the various materials used to manufacture the package. This section outlines the µBGA package	Original		PDF

360-200 Abstract: 3000VRMS Text: THT COMMON MODE CHOKES - TWO PHASE 3000Vrms Isolation - PB01XX Series Height: 38.8mm Package 1 43.2mm (Package 2) Footprint: 35.6 x 15.6mm (Package 1) 45.7 x 21.6mm (Package 2) Current Range: up to 23.4Adc Dielectric strength: 3000Vrms (with 3.0mm creepage)	Original	3000Vrms PB01XX 3000Vrms 20kHz, PB0168 PB0172 PB0167 PB0166 PB0171 PB0165 360-200	PDF
EP4CE15 Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22	PDF
EP4CE6 package Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80	PDF
Untitled Abstract: No abstract text available Text: THT COMMON MODE CHOKES - TWO PHASE 3000Vrms Isolation - PB01XX Series Height: 38.8mm Package 1 43.2mm (Package 2) Footprint: 35.6 x 15.6mm (Package 1) 45.7 x 21.6mm (Package 2) Current Range: up to 23.4Adc Dielectric strength: 3000Vrms (with 3.0mm creepage)	Original	3000Vrms PB01XX 3000Vrms 20kHz, PB0168 PB0172 PB0167 PB0166 PB0171 PB0165	PDF
lqfp 64 Shipping Trays Abstract: DS310H Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging	Original		PDF
TSOP 32 thermal resistance Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION	Original		PDF
M3025 Abstract: No abstract text available Text: THT COMMON MODE CHOKES - TWO PHASE 3000Vrms Isolation - PB01XX Series ! W E N Height: 38.8mm Package 1 43.2mm (Package 2) Footprint: 35.6 x 15.6mm (Package 1) 45.7 x 21.6mm (Package 2) Current Range: up to 23.4Adc Dielectric strength: 3000 Vrms (with 3.0mm	Original	3000Vrms PB01XX PB0168 PB0172 PB0167 PB0166 PB0171 PB0165 PB0170 PB0169 M3025	PDF
P-MQFP-160-1 Abstract: No abstract text available Text: SIEM ENS PEB 20320 Package Outlines 8 Package Outlines P-MQFP-160-1 Plastic Metric Quad Flat Package i A ! A i I GPM05247 i i Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book "Package Information”. SMD = Surface Mounted Device	OCR Scan	P-MQFP-160-1 GPM05247 P-MQFP-160-1	PDF
Untitled Abstract: No abstract text available Text: SIEM EN S Package Outlines Package Outlines P-DIP-8-4 Plastic Dual In-line Package i n R i P I R EŒ TE TE ZT Û Û. e> P-DSO-8-1 (Plastic Dual Small Outline Package) ! I i I ° I I I Sorts of Packing Package outlines for tubes, trays etc. are contained in our	OCR Scan		PDF
Untitled Abstract: No abstract text available Text: SIEMENS 6 SD A 5642-6/X Package Outlines P-DSO-20-1 Plastic Dual Small Outline Package 1,27 0.85•to* a 41MÌ 20x 1) Does not Include plastic or metal protrusion of 0.15 max. per side 2) Does not Include damber protrusion to CL O Sorts of Packing Package outlines for tubes, trays etc. are contained in our	OCR Scan	5642-6/X P-DSO-20-1	PDF

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PACKAGE TRAY Search Results

PACKAGE TRAY Result Highlights (5)

PACKAGE TRAY Price and Stock

TE Connectivity 830M1-0050-TRAY-PACKAGED

TE Connectivity 830M1-0100-TRAY-PACKAGED

TE Connectivity 830M1-0025-TRAY-PACKAGED

TE Connectivity 830M1-2000-TRAY-PACKAGED

TE Connectivity 830M1-0500-TRAY-PACKAGED

PACKAGE TRAY Datasheets Context Search

7261 markem

SMD MARKING CODE 071 A01

hssop

SMD BOOK

oki qfp tray

10C2

transistor b 1238

28F160

EFTEC-64

Ablebond 8380

324pc

M02142

FET SOT-89

csp process flow diagram

360-200

EP4CE15

EP4CE6 package

Untitled

lqfp 64 Shipping Trays

TSOP 32 thermal resistance

M3025

P-MQFP-160-1

Untitled

Untitled