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    PACKAGE POWER DISSIPATION Search Results

    PACKAGE POWER DISSIPATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    THS6182RHFR Texas Instruments Low Power Dissipation ADSL Line Driver 24-VQFN -40 to 85 Visit Texas Instruments Buy
    THS6182RHFT Texas Instruments Low Power Dissipation ADSL Line Driver 24-VQFN -40 to 85 Visit Texas Instruments Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE POWER DISSIPATION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SOD123 footprint

    Abstract: SOD-110 SOD110 footprint SOD110 1.2V zener diodes 5.1V SMA Zener Diode SOD123 12V 0.5W POWER-DI-323 Diode, Zener, 5.1v, SOD123 tumd2 package
    Text: New Product Announcement July 25, 2006 Announcing Our New Compact PowerDITM323 Power Package with Schottky Barrier Rectifiers and Zener Diodes TM PowerDI 323 Package Outline Package Cross Sections Diodes, Inc. flat lead frame heat-sink solder pad results in higher power dissipation


    Original     		PowerDITM323 PD3S0230, PD3S130L, PD3S130H, PD3S140, PD3S160 AEC-Q101 PD3Z284 SOD123 footprint SOD-110 SOD110 footprint SOD110 1.2V zener diodes 5.1V SMA Zener Diode SOD123 12V 0.5W POWER-DI-323 Diode, Zener, 5.1v, SOD123 tumd2 package PDF

    IPC-SM-780

    Abstract: VN20NSP VN20N VN20SP
    Text: APPLICATION NOTE  PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Todaythere is a great need for a true high power surface mount package. This power package was designed


    Original     		PowerSO-10TM: PowerSO-10 O-220 1999STMicroelectronics IPC-SM-780 VN20NSP VN20N VN20SP PDF

    Copper Alloy C151

    Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
    Text: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been


    Original     		PDF

    TO220S - TO-220 Heatsink Small - Aluminium

    Abstract: IPC-SM-780 "Intelligent Power Devices" VN20NSP IPC-SM-785 VN20SP
    Text: APPLICATION NOTE PowerSO-10TM: A NEW SURFACE MOUNT POWER PACKAGE by A. Ehnert, V. Sukumar and J. Diot ABSTRACT A new surface mount power package is introduced in this paper. Today there is a great need for a true high power surface mount package. This power package was designed


    Original     		PowerSO-10TM: PowerSO-10 O-220 TO220S - TO-220 Heatsink Small - Aluminium IPC-SM-780 "Intelligent Power Devices" VN20NSP IPC-SM-785 VN20SP PDF

    TL022

    Abstract: TL022C TL022CD TL022CDR TL022CP TL022M TL022MJG TL022MU
    Text: TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS SLOS076 – SEPTEMBER 1973 – REVISED SEPTEMBER 1990 • • • • • • • • TL022M . . . JG PACKAGE TL022C . . . D OR P PACKAGE TOP VIEW Very Low Power Consumption Power Dissipation With ± 2-V Supplies


    Original     		TL022C, TL022M SLOS076 TL022C TL022M TL022 TL022C TL022CD TL022CDR TL022CP TL022MJG TL022MU PDF

    RD2.0FM

    Abstract: C11531E RD10FM RD11FM RD120FM RD12FM RD13FM RD15FM RD16FM RD18FM
    Text: DATA SHEET ZENER DIODES RD2.0FM to RD120FM ZENER DIODES 1 W 2 PIN POWER MINI MOLD PACKAGE DIMENSIONS DESCRIPTION Unit: mm Type RD2.0FM to RD120FM series are 2 pin power mini mold package zener diodes possessing an 4.7 ±0.3 allowable power dissipation of 1 W.


    Original     		RD120FM RD120FM C11531E) RD2.0FM C11531E RD10FM RD11FM RD12FM RD13FM RD15FM RD16FM RD18FM PDF

    RD27FS

    Abstract: RD2.0FS rd20fs RD15FS RD12FS RD24FS RD5.6FS RD51FS RD51FS(0)-T1-AY RD6.8FS
    Text: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of


    Original     		RD120FS RD120FS RD27FS RD2.0FS rd20fs RD15FS RD12FS RD24FS RD5.6FS RD51FS RD51FS(0)-T1-AY RD6.8FS PDF

    Untitled

    Abstract: No abstract text available
    Text: WILLAS FM120-M+ 2SA1036KxLT1 THRU Medium Power Transistor *32V, *0.5A FM1200-M 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V Pb Free Produc SOD-123+ PACKAGE Package outline Features • Batch process design, excellent power dissipation offers


    Original     		FM120-M+ 2SA1036KxLT1 FM1200-M OD-123+ OD-123H 500mA FM120-MH FM130-MH FM140-MH FM150-MH PDF

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of


    Original     		RD120FS RD120FS PDF

    RD27FS

    Abstract: RD2.0FS
    Text: DATA SHEET ZENER DIODES RD2.0FS to RD120FS ZENER DIODES 1.0 W PLANAR TYPE 2-PIN SMALL POWER MINI MOLD DESCRIPTION PACKAGE DIMENSION Unit: mm Type RD2.0FS to RD120FS series are 2-pin small power mini mold 3.5±0.2 package Zener diodes possessing an allowable power dissipation of


    Original     		RD120FS RD120FS RD27FS RD2.0FS PDF

    TSSOP16

    Abstract: TSSOP16 datasheet sot223 transistor SOT23 sot89 To92 transistor TSSOP-16 SOP8 Package SSOT24
    Text: Package Power Dissipation Power Dissipation: Pd（mW） Package Power Dissipation vs. Ambient Temperature Ambient Temperature: Ta（℃） USP6B/C SOT23/25/26/26W, SSOT24, MSOP8A/10 SOP8, TO92, SOT223 TSSOP16 SOT89/89-5 SOT23/25/26 When mounted on PCB TSSOP16 (When mounted on PCB)


    Original     		OT23/25/26/26W, SSOT24, MSOP8A/10 OT223 TSSOP16 OT89/89-5 OT23/25/26 USP3/4/8/10 TSSOP16 TSSOP16 datasheet sot223 transistor SOT23 sot89 To92 transistor TSSOP-16 SOP8 Package SSOT24 PDF

    QFP PACKAGE thermal resistance

    Abstract: ic and equivalent
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-signal transistors, extremely small so that with the exception of power ICs


    Original     		PDF

    "MARKING CODE CA"

    Abstract: zener 6.8v
    Text: MMSZ4691WS SERIES SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 6.2 ~ 15 Volts 200 mWatts POWER FEATURES 0.078 1.95 0.068(1.75) • Planar Die construction • 200mW Power Dissipation • Ultra Thin Profile Package for Space Constrained Utilization • Package suitable for Automated Handling


    Original     		MMSZ4691WS 200mW 2002/95/EC IEC61249 OD-323, MIL-STD-750, 2012-REV "MARKING CODE CA" zener 6.8v PDF

    2SC4911

    Abstract: 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k
    Text: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.


    OCR Scan     		O-220, 2SA1037AKLN 2SA1455K 2SC2412KLN 2SC3722K 2SC4911 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k PDF

    2SC5072

    Abstract: 2sc5073 25d13 25D-13
    Text: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.


    OCR Scan     		O-220, 1k5k10k-- 2SC5072 2sc5073 25d13 25D-13 PDF

    2SA1885

    Abstract: T147
    Text: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to T0-220, Pc=35W transistors. EM3 • UMT • SMT Three types are available to allow the most suitable package depending on size specifications. Pc (mW)


    OCR Scan     		T0-220, 2SA1774 2SC4617 2SA1576A 2SA1579 2SC4081 2SC4102 2SC4723 2SA1577 2SC4097 2SA1885 T147 PDF

    TL044CN

    Abstract: TL044 TL044CJ TL044C
    Text: TL044M, TL044C QUAD LOW-POWER OPERATIONAL AMPLIFIERS D1662, SEPTEMBER 1973-REVISED JUNE 1988 Very Low Power Consumption T L044M . . . J OR W DUAL-IN-LINE PACKAGE T L044C . . . J OR N PACKAGE Typical Power Dissipation with ±2-V Supplies . . . 340 pW TOP VIEW


    OCR Scan     		TL044M, TL044C D1662, 1973-REVISED TL044M TL044CN TL044 TL044CJ PDF

    TPP4000

    Abstract: No abstract text available
    Text: T P P 4000 MEDIVM-POWER DARLINGTON ARRAY This medium-power array consists of four Darlington pairs in a single 14-pin dual in-line plastic package. Features include a collectorcurrent rating of 4 A, a minimum hFE of 2000, and a package power dissipation rating of 2 W.


    OCR Scan     		14-pin TPP4000 PDF

    s0103

    Abstract: BAT42 equivalent BAT43 equivalent S0103C
    Text: Schottky Diodes Silicon Schottky Barrier Diodes DO-35 Glass Package, MiniMELF Glass Package, SOD123 Plastic Package, SOT23 Plastic Package Type Peak Inv. Voltage PIV Power Dissipation at 25 °C Junction Temp. Forward Voltage Drop VF at lF Volts Reverse Current


    OCR Scan     		DO-35 OD123 SD101A* SD101B SD101C SD103A SD103B SD103C BAT42 s0103 BAT42 equivalent BAT43 equivalent S0103C PDF

    TL022 equivalent

    Abstract: No abstract text available
    Text: TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1661, SEPTEM BER 1 9 7 3 -R E V IS E D SEPTEM BER 1990 TL022M . . . JG PACKAGE TL022C , . , D OR P PACKAGE TOP VIEWI • Very Low Power Consumption • Power Dissipation with +2-V Supplies . . . 170 pW Typ


    OCR Scan     		TL022C, TL022M TL022M TL022C TL022 equivalent PDF

    TCA365

    Abstract: P-T66-5-H TCA365B TCA 365 tca 365 to220 tca 220
    Text: Power Operational Amplifiers • TCA 365 Bipolar 1C Type □ ■TCA 365 ■TC A 365 H Ordering Code Package Q67000-A1875 Q67000-A2145 Plastic power package P-T66-5-H Plastic power package P-T66-5-J similar to TO-220 The TCA 365 ICs are power op amps in a P-T66-5-H or a P-T66-5-J package. At a maximum


    OCR Scan     		Q67000-A1875 Q67000-A2145 P-T66-5-H P-T66-5-J O-220) P-T66-5-H P-T66-5-J TCA365 TCA365B TCA 365 tca 365 to220 tca 220 PDF

    Untitled

    Abstract: No abstract text available
    Text: TL022M, TL022C DUAL LOW-POWER OPERATIONAL AMPLIFIERS D 1 6 6 1 , SEPTEMBER 1 9 7 3 -R E V IS E D JULY 1 9 8 8 TL022M . . . JG PACKAGE TL022C . . . D, JG. OR P PACKAGE Very Low Power Consumption Power Dissipation with ± 2-V Supplies . . . 170 /tW Typ TOP VIEW


    OCR Scan     		TL022M, TL022C TL022M TL022M TL022C device00 TL022M. PDF

    Untitled

    Abstract: No abstract text available
    Text: 10160-F FEATURES LOGIC DIAGRAM • High functional density on on* chip reduces package count and saves system power • Fast propagation delay = 4.0ns TYP • Low power dissipation = 325mW/package type no load • High fanout capability — can drive 50Q lines


    OCR Scan     		10160-F 325mW/package 50-ohm PDF

    QTLP670C-2

    Abstract: No abstract text available
    Text: 0ÆRU&HT SURFACE MOUNT LED LAMP PLCC - 2 PACKAGE PACKAGE DIMENSIONS Green QTLP670C4.7713D FEATURES • Non-diffused package excellent for back-lighting and coupling to light pipe • Low package profile • Low power dissipation • W ide viewing angle of 120°


    OCR Scan     		QTLP670C4 7713D QTLP670C-7 QTLP670C-2 EIA-535 00118A PDF