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    PACKAGE OPTION Search Results

    PACKAGE OPTION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE OPTION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA PACKAGE thermal profile

    Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
    Text: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.


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    PDF CII51015-2 EP2C15 BGA PACKAGE thermal profile 896-Pin TQFP 144 PACKAGE DIMENSION EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015

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    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty SN54LS323J ACTIVE CDIP J 20 SN74LS323DW OBSOLETE SOIC DW SN74LS323DW OBSOLETE SOIC DW SN74LS323DWR OBSOLETE SOIC


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    PDF 11-Apr-2013 SN54LS323J SN74LS323DW SN74LS323DWR SN74LS323N SNJ54LS323FK

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2011 PACKAGING INFORMATION Orderable Device TPS65168RSBR Status 1 ACTIVE Package Type Package Drawing WQFN RSB Pins Package Qty


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    PDF 20-Jan-2011 TPS65168RSBR Level-2-260C-1

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2011 PACKAGING INFORMATION Orderable Device TPS65196RHDR Status 1 ACTIVE Package Type Package Drawing VQFN RHD Pins Package Qty


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    PDF 26-Mar-2011 TPS65196RHDR Level-2-260C-1

    TPS65168RSBR

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65168RSBR ACTIVE Package Type Package Pins Package Drawing Qty WQFN RSB


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    PDF 11-Apr-2013 TPS65168RSBR Level-2-260C-1

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65177RHAR ACTIVE Package Type Package Pins Package Qty Drawing VQFN RHA


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    PDF 24-Jan-2013 TPS65177RHAR Level-3-260C-168

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    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE


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    PDF SCHS017 18-Sep-2008 CD4006BE CD4006BF3A

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2012 PACKAGING INFORMATION Orderable Device TPS65177RHAR Status 1 ACTIVE Package Type Package Drawing VQFN RHA Pins Package Qty


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    PDF 31-Mar-2012 TPS65177RHAR Level-3-260C-168

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    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE


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    PDF SCHS017 26-Sep-2005 CD4006BE CD4006BF3A

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65631DPDR ACTIVE Package Type Package Pins Package Drawing Qty WSON DPD


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    PDF 11-Apr-2013 TPS65631DPDR Level-2-260C-1

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    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE


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    PDF SCHS017 18-Jul-2006 CD4006BE CD4006BF3A

    Untitled

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2012 PACKAGING INFORMATION Orderable Device Status 1 TPS65631DPDR ACTIVE Package Type Package Pins Package Qty Drawing WSON DPD


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    PDF 30-Oct-2012 TPS65631DPDR Level-2-260C-1

    TPS65177

    Abstract: TPS65177RHAR
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2012 PACKAGING INFORMATION Orderable Device TPS65177RHAR Status 1 ACTIVE Package Type Package Drawing VQFN RHA Pins Package Qty


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    PDF 31-Mar-2012 TPS65177RHAR Level-3-260C-168 TPS65177

    TPS51622RSMR

    Abstract: No abstract text available
    Text: For a detailed datasheet and other design support tools please contact IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish


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    PDF 11-Apr-2013 TPS51622RSMR Level-2-260C-1 TPS51622RSMT TPS51622RSMR

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    Abstract: No abstract text available
    Text: For a detailed datasheet and other design support tools please contact IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 27-Dec-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish


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    PDF 27-Dec-2012 TPS51631RSMR Level-2-260C-1 TPS51631RSMT

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com SLVSAC1 September 2010 PACKAGE OPTION ADDENDUM www.ti.com 18-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan


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    PDF 18-Mar-2013 TPS65149RSHR TPS65149RSHT Level-3-260C-168

    TPS51631

    Abstract: No abstract text available
    Text: For a detailed datasheet and other design support tools please contact IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 23-Jul-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish


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    PDF 23-Jul-2013 TPS51631RSMR TPS51631RSMT Level-2-260C-1 TPS51631

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE CDIP


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    PDF SCHS017 9-Oct-2007 CD4006BE CD4006BF3A

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    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2011 PACKAGING INFORMATION Orderable Device TPS65194RGER Status 1 ACTIVE Package Type Package Drawing VQFN RGE Pins Package Qty


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    PDF 20-Jan-2011 TPS65194RGER Level-2-260C-1

    TPS65175

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65175RSHR ACTIVE Package Type Package Pins Package Qty Drawing VQFN RSH


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    PDF 24-Jan-2013 TPS65175RSHR Level-3-260C-168 TPS65175 TPS65175

    CD4006BE

    Abstract: CD4006BF3A
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE


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    PDF SCHS017 15-Oct-2009 CD4006BE CD4006BF3A CD4006BE CD4006BF3A

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS017 PACKAGE OPTION ADDENDUM www.ti.com 14-Aug-2007 PACKAGING INFORMATION Orderable Device Status 1 CD4006BE CD4006BF3A Pins Package Eco Plan (2) Qty Package Type Package Drawing OBSOLETE PDIP N 14 ACTIVE


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    PDF SCHS017 14-Aug-2007 CD4006BE CD4006BF3A

    Untitled

    Abstract: No abstract text available
    Text: To request a full datasheet, please send an email to: idls_contact@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 21-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS61177RGRR ACTIVE Package Type Package Pins Package Drawing Qty VQFN RGR 20 3000


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    PDF 21-Aug-2013 TPS61177RGRR Level-2-260C-1

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    Abstract: No abstract text available
    Text: For the TPS51632 datasheet please send a request through email to: nvidia_cpu_vr@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish


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    PDF TPS51632 22-Feb-2013 TPS51632RSMR Level-2-260C-1 TPS51632RSMT