SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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Original
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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PDF
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FX315P2
Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
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Original
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FX315
FX315LG
24-pin
FX315P2
mX 1524 pin diagram
CML marking
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PDF
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date code marking samsung
Abstract: samsung date code samsung samsung year code
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
date code marking samsung
samsung
date code samsung
samsung year code
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PDF
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samsung date code
Abstract: samsung year code date code marking samsung
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
samsung date code
samsung year code
date code marking samsung
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PDF
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KS88P0424
Abstract: KS88P0416
Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS88P_
KS88P0424
KS88P0416
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PDF
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date code marking samsung
Abstract: samsung date code functions of remocon
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
date code marking samsung
samsung date code
functions of remocon
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PDF
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date code samsung
Abstract: date code marking samsung telephone microcontroller caller id
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
date code samsung
date code marking samsung
telephone microcontroller caller id
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PDF
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samsung year code
Abstract: No abstract text available
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
samsung year code
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PDF
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date code marking samsung
Abstract: KS57P samsung date code
Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS57P_
date code marking samsung
KS57P
samsung date code
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PDF
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9203101M2A OBSOLETE LCCC
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Original
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26-Aug-2013
5962-9203101M2A
5962-9203101MEA
5962-9203102MEA
5962-9203103Q2A
59629203103Q2A
UC1863L/
5962-9203103QEA
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PDF
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JM38510/01405BEA
Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Text: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP
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Original
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21-Mar-2013
5962-9687802QEA
5962-9687802QFA
JM38510/16303BEA
JM38510/16304BEA
JM38510/32201B2A
JM38510/01405BEA
SN74368A
SN54LS367A-SP
M38510
SN74367A
SN54365A
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PDF
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samsung 2416
Abstract: eprom 2416 samsung date code date code marking samsung date code samsung samsung year code
Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS88P_
samsung 2416
eprom 2416
samsung date code
date code marking samsung
date code samsung
samsung year code
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PDF
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samsung date code
Abstract: date code marking samsung samsung date code marking samsung year code date code samsung
Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
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Original
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KS88P_
samsung date code
date code marking samsung
samsung date code marking
samsung year code
date code samsung
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PDF
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FX315P2
Abstract: FX315 FX315LG
Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
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Original
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FX315
FX315LG
24-pin
FX315LG
FX315P2
14-pin
FX315P2
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PDF
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LS27
Abstract: JM38510/01405BEA M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00404BCA OBSOLETE CDIP
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Original
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11-Apr-2013
JM38510/00404BCA
JM38510/30302B2A
JM38510/
30302B2A
JM38510/30302BCA
LS27
JM38510/01405BEA
M38510
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PDF
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JM38510/01405BEA
Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP
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Original
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11-Apr-2013
5962-9687802QEA
5962-9687802QFA
JM38510/16303BEA
JM38510/1630ti
JM38510/01405BEA
SN74368A
SN54LS367A-SP
M38510
SN74367A
SN54365A
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PDF
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) JM38510/30607B2A OBSOLETE LCCC
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Original
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11-Apr-2013
JM38510/30607B2A
JM38510/30607BEA
SN54LS395AJ
SN74LS395AD
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PDF
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Untitled
Abstract: No abstract text available
Text: SDLS946 – PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) SN5496J OBSOLETE
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Original
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SDLS946
11-Apr-2013
SN5496J
SN7496N
SN74LS96D
SN74LS96DR
SN74LS96J
SN74LS96N
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PDF
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JM38510/01405BEA
Abstract: M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00903BCA OBSOLETE CDIP
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Original
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11-Apr-2013
JM38510/00903BCA
JM38510/30605B2A
JM38510/
30605B2A
JM38510/30605BCA
JM38510/01405BEA
M38510
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PDF
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JM38510/01405BEA
Abstract: SN74LS02N M38510/01401BJB M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00401BCA ACTIVE CDIP
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Original
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11-Apr-2013
JM38510/00401BCA
JM38510/00401BDA
JM38510/07301BCA
JM38510/07301BDA
JM38510/30301B2A
JM38510/01405BEA
SN74LS02N
M38510/01401BJB
M38510
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PDF
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JM38510/01405BEA
Abstract: M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 31-May-2014 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) JM38510/00903BCA OBSOLETE
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Original
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31-May-2014
JM38510/00903BCA
JM38510/30605B2A
JM38510/
30605B2A
JM38510/30605BCA
JM38510ti
JM38510/01405BEA
M38510
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PDF
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JM38510/01405BEA
Abstract: JM38510 M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00401BCA ACTIVE CDIP
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Original
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11-Apr-2013
JM38510/00401BCA
JM38510/
00401BCA
JM38510/00401BDA
00401BDA
JM38510/01405BEA
JM38510
M38510
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PDF
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JM38510/01405BEA
Abstract: 74ls20 M38510
Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP
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Original
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12-Apr-2013
JM38510/07006BCA
JM38510/
07006BCA
JM38510/07006BDA
07006BDA
JM38510/01405BEA
74ls20
M38510
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PDF
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07102BEA ACTIVE CDIP
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Original
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11-Apr-2013
JM38510/07102BEA
JM38510/07102B
JM38510/07102BFA
JM38510/
07102BFA
JM38510/30103B2A
30103B2A
JM38510/30103BEA
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PDF
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