PACKAGE LQFP128
Abstract: 1000ppm LQFP128 QFP15-128PIN QFP15 P-LQFP128-1414-0
Text: Eu-RoHS Compliance Package-type Epson Package name ； QFP15-128PIN JEITA Package name； P-LQFP128-1414-0.40 Terminal plating； Lead Pb Free The product which consisted of above package is compliant with RoHS Directive (2002/95/EC) RoHS Directive chemicals:
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QFP15-128PIN
P-LQFP128-1414-0
2002/95/EC)
100ppm
1000ppm
PACKAGE LQFP128
1000ppm
LQFP128
QFP15-128PIN
QFP15
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LQFP128
Abstract: LQFP128 20 14 1.4
Text: Philips Semiconductors Package outlines LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm 1997 Aug 04 640 SOT425-1
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LQFP128:
OT425-1
LQFP128
LQFP128 20 14 1.4
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DIP40
Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
Text: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)
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OT97-1
DIP14
OT27-1
DIP16
OT38-1
DIP20
OT146-1
DIP24
OT101-1
DIP28
DIP40
LQFP100
LQFP128
LQFP64
QFP44
DIP20
DIP28
015ad
ZE 004-1
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DIP18
Abstract: DIP20 DIP28 DIP40 LQFP100 LQFP128 LQFP32 LQFP64 ZE 004-1
Text: PACKAGE INFORMATION Page Index 1694 DIP LQFP QFP SDIP SO SSOP TSSOP VSO 1696 1706 1710 1712 1713 1721 1725 1726 Soldering 1728 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)
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OT97-1
DIP14
OT27-1
DIP16
OT38-1
OT38-4
OT38-9
DIP18
DIP18
DIP20
DIP28
DIP40
LQFP100
LQFP128
LQFP32
LQFP64
ZE 004-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP128 package SOT425-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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LQFP128
OT425-1
OT425-1
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100P6S-A
Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Text: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –
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16-BIT
100P6S-A
QFP100-P-1420-0
100pin
1420mm
LQFP100-P-1414-0
1414mm
100P6Q-A
128pin
100P6S-A
LQFP128-P-1420-0
128P6Q-A
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sc6038
Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
Text: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL
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OT157-2
DBS13P
OT141-6
OT97-1
DIP16
OT38-1
DIP20
OT146-1
DIP28
OT316-1
sc6038
SC-6038
K 2941
SOT393-1
DBS13P
DIP20
HDIP18
LQFP100
LQFP48
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LQFP128
Abstract: PACKAGE LQFP128 ZD 103 MS-026
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 102 103 65 64 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e
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LQFP128:
OT425-1
136E28
MS-026
LQFP128
PACKAGE LQFP128
ZD 103
MS-026
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sot425
Abstract: LQFP128 20 14 1.4
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e
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LQFP128:
OT425-1
OT425-1
sot425
LQFP128 20 14 1.4
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ZD 103
Abstract: PACKAGE LQFP128 LQFP128 MS-026
Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 c y X A 65 102 64 103 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 39 128 1 38 v M A ZD wM bp e
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LQFP128:
OT425-1
136E28
MS-026
ZD 103
PACKAGE LQFP128
LQFP128
MS-026
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LQFP128
Abstract: PACKAGE LQFP128 lqfp128 MS-026 MS-026 sot420
Text: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 33 32 128 1 v M A ZD wM bp e D
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LQFP128:
OT420-1
MS-026
LQFP128
PACKAGE LQFP128
lqfp128 MS-026
MS-026
sot420
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LQFP128
Abstract: MS-026 lqfp128 MS-026
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 33 32 128 1 v M A ZD wM bp e D
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LQFP128:
OT420-1
MS-026
LQFP128
MS-026
lqfp128 MS-026
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Untitled
Abstract: No abstract text available
Text: Package outline LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm SOT420-1 c y X A 65 64 96 97 ZE e E HE A A2 A 1 A 3 θ wM Lp bp pin 1 index L detail X 128 33 32 1 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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LQFP128:
OT420-1
MS-026
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Tuner matsushita vhf
Abstract: MN88441
Text: DATA SHEET Part No. MN88441 Package Code No. LQFP128-P-1818C SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: December 2004 SDB00109AEM 1 MN88441 MN88441 OFDM Demodulation LSI for Digital Terrestrial Broadcasting in Japan Overview
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MN88441
LQFP128-P-1818C
SDB00109AEM
Tuner matsushita vhf
MN88441
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SLIC-DC - PEF 4268
Abstract: vinetic PEB 3332 ADM5120 Vinetic Infineon VoIP 12V RELAY 1 C/O 723 ic ADM5120 reference board SoC SLIC PEF 4268
Text: To o l B r i e f EASY 5120 Wireless VoIP Router Reference Package The EASY 5120 reference package demonstrates Infineon’s Wireless VoIP router capabilities. This reference platform allows system engineers to develop time-to-market VoIP router products. The EASY 5120 reference design is based on Infineon’s VoIP, SLIC,
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B000-H0000-X-X-7600
SLIC-DC - PEF 4268
vinetic PEB 3332
ADM5120
Vinetic
Infineon VoIP
12V RELAY 1 C/O
723 ic
ADM5120 reference board
SoC SLIC
PEF 4268
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LQFP144
Abstract: QFP100-P-1818B scl-3b
Text: MN103L03 Series MN103LF03R Type Internal ROM type FLASH ROM byte 1024K RAM (byte) 63.5K LQFP128-P-1818C (Under development), LQFP144-P-2020A (Under development), QFP100-P-1818B (Under development) Package (Lead-free) Minimum Instruction Execution Time 25 ns (at 2.7 V to 3.6 V, 40 MHz)
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MN103L03
MN103LF03R
1024K
LQFP128-P-1818C
LQFP144-P-2020A
QFP100-P-1818B
LQFP144
QFP100-P-1818B
scl-3b
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MN102L2403
Abstract: No abstract text available
Text: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time
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MN102L2403
16-bit)
LQFP128-P-1818B
MN102L2403
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Untitled
Abstract: No abstract text available
Text: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time
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MN102L2403
16-bit)
LQFP128-P-1818B
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76VDD
Abstract: No abstract text available
Text: MN102L2403 Type MN102L2403 [ES Engineering Sample available] ROM (x× 8-bit / × 16-bit) Maximum 16 M in total (special register 1 K included) RAM (×× 8-bit / × 16-bit) External ROM, RAM 3 K Package LQFP128-P-1818B Minimum Instruction Execution Time
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MN102L2403
16-bit)
LQFP128-P-1818B
76VDD
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Untitled
Abstract: No abstract text available
Text: MN102H46 Series MN102H460B Type External Internal ROM type ROM byte RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)
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MN102H46
MN102H460B
LQFP128-P-1818C,
TQFP128-P-1414B
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AD03
Abstract: AD04 MN102L360C MN102L36K 128 k rom
Text: MN102L36K , MN102L360C Type MN102L36K [ES Engineering Sample available] MN102L360C ROM (x× 8-bit / × 16-bit) 256 K External RAM (×× 8-bit / × 16-bit) 10 K 5K Package LQFP128-P-1818C *Pb free Minimum Instruction Execution Time 100 ns (at 4.5 V to 5.5 V, 20 MHz)
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MN102L36K
MN102L360C
16-bit)
LQFP128-P-1818C
AD03
AD04
MN102L360C
MN102L36K
128 k rom
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AN13
Abstract: AN14 AN15 MN102H460B
Text: MN102H46 Series MN102H460B Type External Internal ROM type ROM byte RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)
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MN102H46
MN102H460B
LQFP128-P-1818C,
TQFP128-P-1414B
AN13
AN14
AN15
MN102H460B
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Untitled
Abstract: No abstract text available
Text: MN102H460B MN102H460B Type External Internal ROM type ROM byte RAM (byte) 4K Package (Lead-free) Minimum Instruction Execution Time LQFP128-P-1818C, TQFP128-P-1414B [With main clock operated] 50 ns (at 3.0 V to 3.6 V, 40 MHz) 100 ns (at 2.0 V to 3.6 V, 20 MHz)
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MN102H460B
MN102H460B
LQFP128-P-1818C,
TQFP128-P-1414B
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ccd camera module
Abstract: QFP144-P-2020 CCD Linear Image Sensors DIODE MARKING B85 L69A TQFP100-P-1414 b86a T07 marking
Text: Package Outlines MOS LSI L O U 170 MOS Memories (M H O ) 185 CCD Area/Linear Image Sensors (C C O ) 190 CCD Camera Modules ( C C Q 193 TFT LCD Device (C C D ) 193 Bipolar IC s (B Q D ) 194 Discrete Semiconductors (DQZJ) 208 169 Package Outlines (MOS LSI)
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OCR Scan
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DIP008-P-0300
DIP014-P-0300C
DIP014-P-0300A
DIP018-P-0300D
DIP014-P-0300B
HDIP014-P-0300F
DIP016-P-0300A
DIP016-P-
SIL-10)
SIL-12)
ccd camera module
QFP144-P-2020
CCD Linear Image Sensors
DIODE MARKING B85
L69A
TQFP100-P-1414
b86a
T07 marking
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