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    PACKAGE DRAWING B Search Results

    PACKAGE DRAWING B Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE DRAWING B Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    16L-QFN

    Abstract: 263 qfn EIA 481 QFN ALF sot-23-5
    Text: REV: 0909-0707-01 Part Ⅰ Package Outline Drawing Part Ⅱ Carrier Tape Outline Drawing Part Ⅲ Reel Outline Drawing 1 Table of Contents Part Ⅰ - Package Outline Drawing DIPDIP-8 PACKAGE OUTLINE DRAWING - Ⅰ-1


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    09-07REV: -----------------------------------DIP-14 -----------------------------------DIP-16 -----------------------------------DIP-18 16L-QFN 263 qfn EIA 481 QFN ALF sot-23-5 PDF

    AA871

    Abstract: 263 qfn TO-263 5pin Package 20L SOT-23 PACKAGE OUTLINE qfn 48 6201ll 16L3
    Text: REV: 0909-0707-01 Part Ⅰ Package Outline Drawing 1 Table of Contents Part Ⅰ - Package Outline Drawing DIPDIP-8 PACKAGE OUTLINE DRAWING - Ⅰ-1


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    09-07REV: -----------------------------------DIP-14 -----------------------------------DIP-16 -----------------------------------DIP-18 61-POSST BA351-OM TSSOPTSSOP-16 AA871 263 qfn TO-263 5pin Package 20L SOT-23 PACKAGE OUTLINE qfn 48 6201ll 16L3 PDF

    sn1473

    Abstract: GN16 LTC1473
    Text: SPECIFICATION NOTICE LTC1473 February 1998 The 16-lead GN package drawing for the LTC 1473 data sheet is the wrong package. The correct drawing is below. For complete specifications, typical performance characteristics and applications information, please see the LTC1473 data sheet.


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    LTC1473 16-lead LTC1473 152mm) 254mm) sn1473 sn1473 GN16 PDF

    TPS51622RSMR

    Abstract: No abstract text available
    Text: For a detailed datasheet and other design support tools please contact IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish


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    11-Apr-2013 TPS51622RSMR Level-2-260C-1 TPS51622RSMT TPS51622RSMR PDF

    1653G

    Abstract: No abstract text available
    Text: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR


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    PDF

    U321

    Abstract: LNB unit
    Text: SAW Filters SAW Bandpass Filter – LNB Application Preliminary Specification Rev 2 Features .P01 Package Drawing & Pinout .P01


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish


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    17-Oct-2012 TPS65176RHDR Level-2-260C-1 TPS65176RHDT PDF

    Untitled

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 27-Jan-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish


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    27-Jan-2012 TPS65178ARSLR Level-3-260C-168 TPS65178RSLR TPS65178RSLT Level-3-260C-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.1206 LH250 – CERAMIC HERMETIC SMT PACKAGE PACKAGE OUTLINES LH250 Package Outline Drawing


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    LH250 LH250 PDF

    U327

    Abstract: No abstract text available
    Text: SAW Filters SAW Bandpass Filter – LNB Application Preliminary Specification Rev 1 Features .P01 Package Drawing & Pinout .P01


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: tps6126x_datasheet@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2011 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish


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    tps6126x 4-Jun-2011 TPS61260DRVR TPS61260DRVT TPS61261DRVR TPS61261DRVT Level-2-260C-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 21-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2)


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    21-Jun-2013 TPS65132A0YFFR Level-1-260C-UNLIM 65132A0 TPS65132AYFFR 5132A PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9203101M2A OBSOLETE LCCC


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    26-Aug-2013 5962-9203101M2A 5962-9203101MEA 5962-9203102MEA 5962-9203103Q2A 59629203103Q2A UC1863L/ 5962-9203103QEA PDF

    M38510

    Abstract: sn74ls02n SN7402 M38510/50302BRA M38510/01401BJB M38510/00104BCB M38510/30301BCB
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) JM38510/00401BCA ACTIVE CDIP J 14 1 TBD A42


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    23-Mar-2012 JM38510/00401BCA JM38510/00401BDA JM38510/07301BCA JM38510/07301BDA JM38510/30301B2A M38510 sn74ls02n SN7402 M38510/50302BRA M38510/01401BJB M38510/00104BCB M38510/30301BCB PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-8415301VRA ACTIVE CDIP J 20 20 TBD A42


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    23-Mar-2012 5962-8415301VRA 5962-8415301VSA 4151012A 8415101RA 8415101SA 4152012A 8415201RA 8415201SA 4153012A PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-8415301VRA ACTIVE CDIP J 20 20 TBD A42


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    23-Mar-2012 5962-8415301VRA 5962-8415301VSA 4151012A 8415101RA 8415101SA 4152012A 8415201RA 8415201SA 4153012A PDF

    JM38510/01405BEA

    Abstract: M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP


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    23-Apr-2013 JM38510/07006BCA JM38510/ 07006BCA JM38510/07006BDA 07006BDA JM38510/01405BEA M38510 PDF

    LS27

    Abstract: JM38510/01405BEA M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00404BCA OBSOLETE CDIP


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    11-Apr-2013 JM38510/00404BCA JM38510/30302B2A JM38510/ 30302B2A JM38510/30302BCA LS27 JM38510/01405BEA M38510 PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74ALS2540N OBSOLETE PDIP N 20 TBD Call TI SN74ALS2541DW OBSOLETE


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    5-Sep-2005 SN74ALS2540N SN74ALS2541DW SN74ALS2541DWR SN74ALS2541DWRE4 SN74ALS2541N SN74ALS2541NE4 SN74ALS2541NSR SN74ALS2541NSRE4 Level-1-260C-UNLIM PDF

    65132B0

    Abstract: No abstract text available
    Text: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp


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    1-Nov-2013 TPS65132A0YFFR Level-1-260C-UNLIM 65132A0 TPS65132AYFFR 5132A TPS65132B0YFFR 65132B0 PDF

    SN54LS109AJ

    Abstract: SN74109N SN74LS109AD SN74LS109ADE4 SN74LS109ADG4 SN74LS109ADR
    Text: PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30109B2A ACTIVE LCCC FK 20 1 TBD JM38510/30109BEA ACTIVE


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    15-Oct-2009 JM38510/30109B2A JM38510/30109BEA JM38510/30109BFA JM38510/30109SEA SN54LS109AJ SN74109N SN74LS109AD SN74LS109ADE4 SN74LS109ADG4 SN74LS109ADR PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) UCC2570D OBSOLETE SOIC D 14 TBD Call TI


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    20-Jan-2012 UCC2570D UCC2570DG4 UCC2570DTR UCC2570DTRG4 UCC2570N UCC2570NG4 UCC3570D UCC3570DG4 UCC3570DTR PDF

    MO-187

    Abstract: JEDEC MO-187 MO187
    Text: DETAIL X E E Seatin g _ Plane 0.10 C N Leads Drawing #: MDP0043 Rev: C Date: 6 /1 4 /9 9 Units: m m JEDEC Reg: MO-187 0.08 C A B See Detail ”X PACKAGE OUTLINE DRAWING MINI SO PACKAGE M SOP PACKAGE FAMILY Sem icon du ctor, Inc. HIGH PERFORMANCE ANALOG INTEGRATED CIRCUITS


    OCR Scan
    MDP0043 MO-187 MO-187 JEDEC MO-187 MO187 PDF

    SOL16-P

    Abstract: 200mil SOP 8 200MIL
    Text: TOSHIBA_ 10. [10] Package Package SOP 14PIN 200mil BODY OUTLINE DRAWING (SQP14-P-300-1.27) Unit in mm 14 I , 10.8MAX i 10.310.2 «! a 'M ¡5 3 'in n r o T n c 9? Ö W eight : 0.1 8 g (TYP.) SOP 16PIN (200mil BODY) OUTLINE DRAWING (SOP16-P-3QO-1.27)


    OCR Scan
    14PIN 200mil SQP14-P-300-1 16PIN OP16-P-3QO-1 20PIN OP20-P-300-1 SOL16-P SOP 8 200MIL PDF