QTLP690-AG
Abstract: QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B
Text: Analog Discrete Interface & Logic Optoelectronics Surface Mount LED Lamps • 0603 Package • 0606 Package • Right Angle Package • 0805 Package • 1206 Package • 1210 Package • 1.8 mm Dome Lens Package • PLCC-2 Package • PLCC-4 Package • Reflector Package
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QTLP690C-E
QTLP690C-O
QTLP690C-Y
QTLP690-AG
QTLP690-AG
QTLP630C-IG
QTLP630C-7
QTLP690C-Y
QTLP650D-3
QTLP600C-2
PLCC-2 1210
QTLP600C-4
QTLP600C-7
QTLP600C-B
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PDF
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PACKAGE DIMENSIONS
Abstract: No abstract text available
Text: Package Diagrams Index of Package Diagrams 100-Ball caBGA Package . 12 120-Pin PQFP Package . 12 128-Pin PQFP Package . 13 128-Pin TQFP Package . 13
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20-Pin
20-Pin
300-Mil)
24-Pin
24-Pin
28-Pin
PACKAGE DIMENSIONS
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PDF
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3528 LED
Abstract: led 3528 female PCB connector 2x5 HP LED 5mm 100nF 50V X7R MC7805CD2T 1B01S HSDL1001 HSMG-T400 "yellow led" 5mm
Text: Bill of Materials Qty Ref Description 4 R8-R11 22R, 1%, 0.125W, 1206 Package 5 R3-R7 330R, 1%, 0.125W, 1206 Package 1 R2 10K, 1%, 0.125W, 1206 Package 1 R1 33K, 1%, 0.125W, 1206 Package 2 C3,C9 100nF, 50V, X7R Ceramic, 1206 Package 5 C4-C8 2.2uF, 16V, Tantalum, 3216 Package
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R8-R11
100nF,
150uF,
1B01S
HSMS-T400
HSMY-T400
HSMG-T400
MC7805CD2T
SX28ACSMS-T400
3528 LED
led 3528
female PCB connector 2x5
HP LED 5mm
100nF 50V X7R
HSDL1001
"yellow led" 5mm
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PDF
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SAMSUNG 834
Abstract: No abstract text available
Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm
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STD131
SAMSUNG 834
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PDF
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pcb design 0,5 mm pitch
Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm
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STD150
pcb design 0,5 mm pitch
PBGA 1515
D 4242
STD150
Samsung ASIC
fbga 153
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PDF
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SAMSUNG 834
Abstract: pcb design 0,5 mm pitch STD130
Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm
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STD130
SAMSUNG 834
pcb design 0,5 mm pitch
STD130
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PDF
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D 4242
Abstract: pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance
Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm
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STDH150
D 4242
pcb design 0,5 mm pitch
Samsung 3232
STDH150
FBGA PACKAGE thermal resistance
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PDF
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pcb design 0,5 mm pitch
Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm
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STDL130
pcb design 0,5 mm pitch
SAMSUNG 834
QFP PACKAGE thermal resistance
package tsop1
12 x 12 fbga thermal resistance
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-48P-M15
48-pin
FPT-48P-M15)
F48025S-1C-1
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PDF
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M16 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-48P-M16
48-pin
FPT-48P-M16)
F48026S-1C-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 46 PIN PLASTIC To Top / Package Lineup / Package Index LCC-46P-M02 46-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 12.00 mm Sealing method Plastic mold LCC-46P-M02
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LCC-46P-M02
46-pin
LCC-46P-M02)
C46002S-4C-3
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PDF
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TQFP 80 PACKAGE
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-80P-M15
80-pin
FPT-80P-M15)
F80028S-1C-1
TQFP 80 PACKAGE
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PDF
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QFP-120P
Abstract: 120-pin
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm
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FPT-120P-M05
QFP120-P-1414-1
120-pin
FPT-120P-M05)
F120006S-2C-3
QFP-120P
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PDF
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TQFP120
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape
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FPT-120P-M17
TQFP120-P-1414-1
120-pin
FPT-120P-M17)
F120022S-1C-3
TQFP120
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-100P-M18
100-pin
FPT-100P-M18)
F100029S-1C-1
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PDF
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FPT-120P-M04
Abstract: QFP120
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-120P-M04
QFP120-P-2828-4
120-pin
FPT-120P-M04)
F120005S-3C-2
FPT-120P-M04
QFP120
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat
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FPT-120C-C01
120-pin
FPT-120C-C01)
F120011SC-3-2
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PDF
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FPT-64P-M09
Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing
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FPT-64P-M09
QFP064-P-1212-1
64-pin
FPT-64P-M09)
F64018S-1C-2
FPT-64P-M09
fujitsu 64-Pin Plastic QFP
QFP064-P-1212-1
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PDF
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FPT-120P-M03
Abstract: QFP120
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-120P-M03
QFP120-P-2828-3
120-pin
FPT-120P-M03)
F120004S-3C-2
FPT-120P-M03
QFP120
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PDF
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QFP080-P-1212-1
Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M05 EIAJ code :∗QFP080-P-1212-1 80-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm
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FPT-80P-M05
QFP080-P-1212-1
80-pin
FPT-80P-M05)
F80008S-2C-5
QFP080-P-1212-1
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PDF
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Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that
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CH12WIP
Ablebond 8380
smema
DA6523
nozzle heater
X3304
Theta-JC
5th mechnical engineering date sheet
alpha Resistors slide
cut template DRAWING
Die Attach epoxy stamping
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PDF
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16MM TAPE PACKAGE
Abstract: No abstract text available
Text: Micrel Semiconductor Designing With LDO Regulators Package Orientation Feed Direction Feed Direction Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed Direction Feed Direction SOT-23 Package Orientation
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OT-143
OT-223
OT-23
O-263
OT-23-5
16MM TAPE PACKAGE
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16MM TAPE PACKAGE
Abstract: No abstract text available
Text: Package O rientation Feed D irection Feed D irection Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed D irection Feed D irection SOT-23 Package Orientation 8mm Carrier Tape SOT-223 Package Orientation
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OCR Scan
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OT-143
OT-223
OT-23
O-263
OT-23-5
16MM TAPE PACKAGE
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PDF
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R604A
Abstract: diode r207 R605A 60 diode R702 erg28 AF91-471 R205A R606A
Text: DIODE MODULES Dimensions mm ERG28-12 ERG78-12 2 in one-package R201 19.6m >•> 017" AF89-692 (AF88-456) + ERG28 4-ERG78 1 1n one-package R101 (AF91-473) 2 in one-package R204 1 in one-package R102 (AF91-471) 3 M5<10 p" 59 mm 2 in one-package R207 2 in one-package
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OCR Scan
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ERG28-12
ERG78-12
AF89-692)
AF88-456)
ERG28
4-ERG78
AF91-473)
AF91-471)
R205A
AF89-746)
R604A
diode r207
R605A
60 diode
R702
AF91-471
R606A
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