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    OUTLINE OF THE HEAT SLUG FOR JEDEC Search Results

    OUTLINE OF THE HEAT SLUG FOR JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    OUTLINE OF THE HEAT SLUG FOR JEDEC Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MO-166

    Abstract: powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt
    Text: APPLICATION NOTE A New High Power IC Surface Mount Package: PowerSO-20 Power IC Packaging from Insertion to Surface Mounting by P. Casati and C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration


    Original     		PowerSO-20TM MO-166. PowerSO-20 MO-166 MO-166 powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt PDF

    powerso-36 and pcb footprint

    Abstract: powerso-20 and pcb footprint ST Microelectronics, mold compound MO-166 POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 powerso-20
    Text: AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20 & PowerSO-36 Power IC Packaging from Insertion to Surface Mount ing by P. Casati & C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and


    Original     		AN668 PowerSO-20TM PowerSO-36 MO-166. PowerSO-20 MO-166 PowerSO-20TM powerso-36 and pcb footprint powerso-20 and pcb footprint ST Microelectronics, mold compound POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 PDF

    powerso-20 and pcb footprint

    Abstract: powerso-36 and pcb footprint MO-166 MOUNTING OF SURFACE MOUNT COMPONENTS POWERSO20 solder voids to263 AN668 LEAD FRAME SURFACE MOUNT fr4 metal slug FR4 epoxy pcb double sided
    Text: AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20 & PowerSO-36 Power IC Packaging from Insertion to Surface Mounting by P. Casati & C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and


    Original     		AN668 PowerSO-20TM PowerSO-36 MO-166. PowerSO-20 MO-166 PowerSO-20TM powerso-20 and pcb footprint powerso-36 and pcb footprint MOUNTING OF SURFACE MOUNT COMPONENTS POWERSO20 solder voids to263 AN668 LEAD FRAME SURFACE MOUNT fr4 metal slug FR4 epoxy pcb double sided PDF

    outline of the heat slug for JEDEC

    Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		MS-029/022 outline of the heat slug for JEDEC heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Supertex inc. HV809 Off-Line, High Voltage EL Lamp Driver Features ►► ►► ►► ►► ►► General Description Processed with HVCMOS technology Input voltage up to 200V DC 400V peak-to-peak output voltage Output load up to 350nF 100in2 for 3.5nF/in2 lamp


    Original     		HV809 350nF 100in2 HV809 350nF 400Hz. HV809ch DSFP-HV809 B071013 PDF

    Untitled

    Abstract: No abstract text available
    Text: Supertex inc. CL7 Linear, 100mA, Constant Current LED Driver with Enable Input Features General Description ►► 100mA ±5% constant current drive ►► Built-in reverse polarity protection ►► Logic level enable ►► Dimmable via EN pin ►► Overtemperature protection


    Original     		100mA, 100mA 100mA A030314 PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CL7 Linear, 100mA, Constant Current LED Driver with Enable Features General Description ► ► ► ► ► ► The CL7 is a linear fixed current regulator designed for driving high brightness LEDs at 100mA from nominal 12V, 24V, and 48V power supplies. With a maximum rating of


    Original     		100mA, 100mA 100mA MS-012, C071408. NR071708 PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    MS-029

    Abstract: 144 QFP body size amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		out029 MS-029/022 MS-029 144 QFP body size amkor PDF

    C090408

    Abstract: No abstract text available
    Text: CL7 Linear, 100mA, Constant Current LED Driver with Enable Features General Description ► ► ► ► ► ► The CL7 is a linear fixed current regulator designed for driving high brightness LEDs at 100mA from nominal 12V, 24V, and 48V power supplies. With a maximum rating of


    Original     		100mA, 100mA 100mA A091508 C090408 PDF

    outline of the heat slug for JEDEC

    Abstract: dimmable LED driver
    Text: CL7 Linear, 100mA, Constant Current LED Driver with Enable Features General Description ► ► ► ► ► ► The CL7 is a linear fixed current regulator designed for driving high brightness LEDs at 100mA from nominal 12V, 24V, and 48V power supplies. With a maximum rating of


    Original     		100mA, 100mA 100mA A102908 outline of the heat slug for JEDEC dimmable LED driver PDF

    CL320SG-G

    Abstract: CL320
    Text: CL320 3-Channel 20mA Linear LED Driver Features General Description ► ±6% current accuracy @ 4.0 -15V ► 90V standoff voltage ► Separate enable pins for each channel allow for PWM dimming ► Over-temperature protection ► 8-Lead SOIC w/Heat Slug package


    Original     		CL320 CL320 MS-012, DSFP-CL320 NR111207 CL320SG-G PDF

    1 watt led with heat led driver circuit diagram

    Abstract: 350nF nr09 HV809 outline of the heat slug for JEDEC HV809K2 HV809K2-G HV809LG-G HV809SG-G DC400V
    Text: HV809 Off-Line, High Voltage EL Lamp Driver Features General Description ► Processed with HVCMOS technology The Supertex HV809 is an off-line, high voltage, EL lamp driver integrated circuit designed for driving EL lamps of up to 350nF at 400Hz. The input supply voltage can be a


    Original     		HV809 HV809 350nF 400Hz. 350nF DSFP-HV809 A103008 1 watt led with heat led driver circuit diagram nr09 outline of the heat slug for JEDEC HV809K2 HV809K2-G HV809LG-G HV809SG-G DC400V PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    Zener 5.1V

    Abstract: DO-204AA Package ZENER DIODE 5.1V documentation JEDEC do-204 DO-204AH 1N5254-B 1N5231BTA double slug diode DO-204AA 1N5253
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1N5221B SERIES 500 mW DO-35 Glass Zener Voltage Regulator Diodes 500 mW DO-35 GLASS GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP 500 Milliwatt Hermetically Sealed Glass Silicon Zener Diodes GLASS ZENER DIODES 500 MILLIWATTS


    Original     		DO-35 1N5221B DO-204AH DO-204AA DO-204 \\Roarer\root\data13\imaging\BITTING\cpl mismatch\20000817\08162000 3\ONSM\08032000 1N5246BRA1 Zener 5.1V DO-204AA Package ZENER DIODE 5.1V documentation JEDEC do-204 1N5254-B 1N5231BTA double slug diode 1N5253 PDF

    Untitled

    Abstract: No abstract text available
    Text: CL7 Linear, 100mA, Constant Current LED Driver with Enable Features General Description The CL7 is a linear fixed current regulator designed for driving high brightness LEDs at 100mA from nominal 12V, 24V, and 48V power supplies. With a maximum rating of


    Original     		100mA, 100mA 100mA A102908 PDF

    Untitled

    Abstract: No abstract text available
    Text: Supertex inc. HV809 Off-Line, High Voltage EL Lamp Driver Features General Description Processed with HVCMOS technology Input voltage up to 200V DC 400V peak-to-peak output voltage Output load up to 350nF 100in2 for 3.5nF/in2 lamp Adjustable output lamp frequency


    Original     		HV809 350nF 100in2 HV809 350nF 400Hz. DSFP-HV809 A033010 PDF

    CL330

    Abstract: CL330SG-G
    Text: CL330 3-Channel 30mA Linear LED Driver Features General Description ► ±6% current accuracy @ 4.0 -15V ► 90V standoff voltage ► Separate enable pins for each channel allow for PWM dimming ► Over-temperature protection ► 8-Lead SOIC w/Heat Slug package


    Original     		CL330 CL330 MS-012, DSFP-CL330 NR110907 CL330SG-G PDF

    C070908

    Abstract: No abstract text available
    Text: CL325 3-Channel 25mA Linear LED Driver Features General Description ► ±6% current accuracy @ 4.0 -15V ► 90V standoff voltage ► Separate enable pins for each channel allow for PWM dimming ► Over-temperature protection ► 8-Lead SOIC w/Heat Slug package


    Original     		CL325 MS-012, C070908. DSFP-CL325 A071008 C070908 PDF

    Untitled

    Abstract: No abstract text available
    Text: CL330 3-Channel 30mA Linear LED Driver Features General Description ► ±6% current accuracy @ 4.0 -15V ► 90V standoff voltage ► Separate enable pins for each channel allow for PWM dimming ► Over-temperature protection ► 8-Lead SOIC w/Heat Slug package


    Original     		CL330 CL330 MS-012, DSFP-CL330 NR011108 PDF

    HV809

    Abstract: HV809K2 HV809K2-G HV809LG-G HV809SG-G product marking L 350nF
    Text: Supertex inc. HV809 Off-Line, High Voltage EL Lamp Driver Features General Description ► Processed with HVCMOS technology The Supertex HV809 is an off-line, high voltage, EL lamp driver integrated circuit designed for driving EL lamps of up to 350nF at 400Hz. The input supply voltage can be a


    Original     		HV809 HV809 350nF 400Hz. 350nF 100in2 DSFP-HV809 A033010 HV809K2 HV809K2-G HV809LG-G HV809SG-G product marking L PDF