smd transistor M7A
Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages
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PD41265L-12-E1
PD41256L
PD23C32000AGX-$
PD23C32000A
smd transistor M7A
ED-7304-1
smd m7a
uPD4011BG
ED730
EIA and EIAJ tape standards
ED-7417
EIA and EIAJ standards
ED-7409
IEC-Publication-747
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78L05 equivalent
Abstract: TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A
Text: FEATURES ABSOLUTE MAXIMUM RATINGS • OUTPUT CURRENT UP TO 100mA . NO EXTERNAL COMPONENTS • INTERNAL THERMAL OVERLOAD PRO TECTION . INTERNAL SHORT CIRCUIT CURRENT LIMITING • AVAILABLE IN JEDEC TO-92 ANO LOW PROFILE TO-39 PACKAGES . OUTPUT VOLTAGES OF 2.6V, 5V, 6.2V,
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100mA
78L00-AC)
78L00C)
78L05 equivalent
TO-92 78L05 voltage regulator pin configuration
78l12 transistor
78L12A
78l02ac
12QHz
transistor 78L15a
78L06C
78L05C
78L05A
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HI-8592
Abstract: outline of the heat sink for JEDEC HI-3584
Text: HI-8592, HI-8593, HI-8594 February, 2011 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs
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HI-8592,
HI-8593,
HI-8594
HI-8592
HI-8593
HI-8594
whi03
outline of the heat sink for JEDEC
HI-3584
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Untitled
Abstract: No abstract text available
Text: HI-8592, HI-8593, HI-8594 June, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs
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HI-8592,
HI-8593,
HI-8594
HI-8592
HI-8593
HI-8594
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PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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A7647
Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package
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124 008r
Abstract: B13W
Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 March 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus
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HI-3182,
HI-3183,
HI-3184,
HI-3185
HI-3186,
HI-3187,
HI-3188
124 008r
B13W
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124 008r
Abstract: B13W ESD 138C
Text: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 September 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382
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HI-3182,
HI-3183,
HI-3184
HI-3185,
HI-3186,
HI-3188
HI-3184,
124 008r
B13W
ESD 138C
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k0319
Abstract: HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182
Text: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 March 2008 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382
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HI-3182,
HI-3183,
HI-3184
HI-3185,
HI-3186,
HI-3188
HI-3184,
k0319
HI-3183
HI-3185
HI-3182
HI-3184
HI-3186
HI-3188
HI-8382
HI-8383
HS-3182
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Holt an-300
Abstract: 05-BOTTOM
Text: HI-8592, HI-8593, HI-8594 November, 2012 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs
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HI-8592,
HI-8593,
HI-8594
HI-8592
HI-8593
HI-8594
Holt an-300
05-BOTTOM
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MS-034 1152 BGA
Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
Text: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are
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AGX52014-1
EP1AGX35
EP1AGX50
EP1AGX20
EP1AGX90
FBGA35
152-pin
MS-034 1152 BGA
FBGA-484 datasheet
84 FBGA thermal
FBGA 152
FBGA-484
1152
84 FBGA outline
led flip-chip
MS-034
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Datasheet of IC 7432
Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type
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Untitled
Abstract: No abstract text available
Text: OM9Û22SC OM9Q23SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE 10 Amp, 50 To 200 Volts, 35 ns trr FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline
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OM9Q23SC
OM9024SC
OM9Q25SC
MQ-078AA
M0-078AA
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FBGA-484 datasheet
Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
Text: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are
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AGX52014-1
EP1AGX20
EP1AGX35
EP1AGX50
EP1AGX90
EP1AGX60
152-pin
FBGA-484 datasheet
84 FBGA outline
FBGA-484
asme y14.5m
MS 034
MS-034
bt 146
FBGA PACKAGE thermal resistance
FBGA1152
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Untitled
Abstract: No abstract text available
Text: HI-8592, HI-8593, HI-8594 September, 2013 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs
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HI-8592,
HI-8593,
HI-8594
HI-8592
HI-8593
HI-8594
24-PIN
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FBGA-484 datasheet
Abstract: arria MS-034 AGX52014-1
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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152-pin
FBGA-484 datasheet
arria
MS-034
AGX52014-1
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SF1154
Abstract: A430 A430A A430B A437A A437B A570 A570A A570B A596
Text: RECTIFIERS 183 750 TO 1500 AMPERES GE TYPE JEDEC SPECIFICATIONS_ . Max. average forward current FM A V (1 phase operation) (A) A437 A 596 A430 A 540 A 696 A 570 A 640 - - - - - - - 750 1000 1000 1000 1500 1500 65 126 100 - 80 80 750 -j >T c - (°C)
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A437A
A430A
A570A
A437B
A430B
A570B
A437C
A430C
A570C
A437D
SF1154
A430
A570
A570B
A596
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FAST RECOVERY SINGLE-PHASE BRIDGE RECTIFIER
Abstract: OM9022SC OM9023SC OM9024SC OM9025SC
Text: OM9022SC OM9Q23SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE 10 Amp, 50 To 200 Volts, 35 ns trr FEATURES Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline Low Thermal Resistance
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OM9022SC
OM9Q23SC
OM9024SC
QM9025SC
MQ-078AA
M0-078AA
flT073
00D11ST
FAST RECOVERY SINGLE-PHASE BRIDGE RECTIFIER
OM9023SC
OM9025SC
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FBGA-484 datasheet
Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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Packa35
152-pin
FBGA-484 datasheet
MS-034 1152 BGA
484-pin BGA
JEDEC FBGA
moisture sensitivity
AGX52014-1
MS-034
EP1AGX90
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ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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outline of the heat slug for JEDEC
Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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88 lead cpga
Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on
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CH13WIP
88 lead cpga
JEDEC Matrix Tray outlines
cpu Shipping Trays
outline of the heat slug for JEDEC
ceramic pin grid array package wire bond
I 6506
PLASTIC PIN GRID ARRAY PACKAGING
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Untitled
Abstract: No abstract text available
Text: OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC QM5260SC/RC/DC HERMETIC JEDEC TO-258AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER 40 Amp, 50 To 200 Volts, 50 ns trr FEATURES Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-258AA Outline
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OM5257SC/RC/DC
OM5259SC/RC/DC
OM5258SC/RC/DC
QM5260SC/RC/DC
O-258AA
MIL-S-19500,
300/js
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Untitled
Abstract: No abstract text available
Text: OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM5260SA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER 40 Amp, 50 To 200 Volts, 50 ns trr FEATURES • • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-254AA Outline
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OM5257SA/RA/DA
OM5259SA/RA/DA
OM5258SA/RA/DA
OM5260SA/RA/DA
O-254AA
MIL-S-19500,
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