Mitsubishi
Abstract: outline packages
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4. PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS Each type of individual pack, inner and outer cartons are specified here, together with an outline drawing. The content indication labels also
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w502
Abstract: W302 W203 W101 w603 W702 x101 W103 X103 w401
Text: OUTLINE DRAWING The content of this specification may change without notification 7/01/09 PIN Switches Outline Drawings Size: mm Outling Drawings X101 X103 X104 X105 W101 W102 OUTLINE DRAWING The content of this specification may change without notification 7/01/09
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t431
Abstract: 3I 46 content t163
Text: Outline Drawings for Amplifiers The content of this specification may change without notification 8/01/09 A mplifiers Outline Drawings Size: mm S11 A1 C T16-3 T43 1 Outline Drawings for Amplifiers The content of this specification may change without notification 8/01/09
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T16-3
t431
3I 46
content
t163
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9939
Abstract: footprints
Text: VCO Package Outline Drawings & Footprints All specifications are subject to change without notice. 9939 Via Pasar, San Diego, CA 92126 | Tel: 858.621.2700 | Fax: 858.621.2722 Email: applications@zcomm.com | URL: www.zcomm.com VCO Package Outline Drawings & Footprints
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9939
Abstract: 2722
Text: PLL Package Outline Drawings & Footprints All specifications are subject to change without notice. 9939 Via Pasar, San Diego, CA 92126 | Tel: 858.621.2700 | Fax: 858.621.2722 Email: applications@zcomm.com | URL: www.zcomm.com PLL Package Outline Drawings & Footprints
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footprints
Abstract: No abstract text available
Text: VCO Package Outline Drawings & Footprints All specifications are subject to change without notice. 14118 Stowe Drive, Suite B, Poway, CA 92064 | Tel: 858.621.2700 | Fax: 858.486.1927 Email: applications@zcomm.com | URL: www.zcomm.com VCO Package Outline Drawings & Footprints
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Untitled
Abstract: No abstract text available
Text: PLL Package Outline Drawings & Footprints All specifications are subject to change without notice. 14118 Stowe Drive, Suite B, Poway, CA 92064 | Tel: 858.621.2700 | Fax: 858.486.1927 Email: applications@zcomm.com | URL: www.zcomm.com PLL Package Outline Drawings & Footprints
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SSOP20 300 mil
Abstract: DIP20 SC603 Package Outline philips ic06
Text: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3
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OT27-1
OT38-4
OT146-1
OT101-1
OT222-1
OT117-1
OT96-1
OT108-1
OT355-1
MO-153AD
SSOP20 300 mil
DIP20
SC603
Package Outline philips ic06
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nec 44 pin LQFP
Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
nec 44 pin LQFP
BGA and QFP Package
256-pin BGA drawing
14 pin ic
28-pin QFP
nec 44-pin qfp
44-Pin QFN
65A1
nec 44-pin LQFP
ic packages
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OP07P
Abstract: OP-07P L7667mja max3912 IH514851 max703mja IH5341MTW MX7502SQ IH5048
Text: SCOPE: HIGH VOLTAGE, FAULT PROTECTED, ANALOG MULTIPLEXER Device Type 01 02 Generic Number MAX378M x /883B MAX379M(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JE LP Case Outline Package Code
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MAX378M
/883B
MAX379M
/883B
Mil-Std-1835
GDIP1-T16
CDIP2-T16
CQCC1-N20
20-Pin
OP07P
OP-07P
L7667mja
max3912
IH514851
max703mja
IH5341MTW
MX7502SQ
IH5048
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sop package tray
Abstract: 29754* intel weight of SOP package SOP JEDEC tray
Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.
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max703mja
Abstract: LCC-28 OP07P OP-07P TRUE RMS-TO-DC CONVERTER MX7502SQ IH5048
Text: SCOPE: QUAD, SPST, CMOS, TTL-Compatible Analog Switches Device Type: -01 -02 Generic Number: DG308AA x /883B DG309A(x)/883B Case Outline(s). Outline Letter Mil-Std-1835 K GDIP1-T16 or CDIP2-T16 Case Outline 16 LEAD CERDIP Package Code J16 Absolute Maximum Ratings
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Mil-Std-1835
GDIP1-T16
CDIP2-T16
DG308AA
/883B
DG309A
/883B
REF02AJ/883B
REF02
REF02AZ/883B
max703mja
LCC-28
OP07P
OP-07P
TRUE RMS-TO-DC CONVERTER
MX7502SQ
IH5048
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IH5048
Abstract: No abstract text available
Text: SCOPE: 100mA CMOS SWITCHED-CAPACITOR VOLTAGE CONVERTER 1.5V TO 8V Device Type 01 Generic Number MAX665M x /883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JA Mil-Std-1835 GDIP1-T8 or CDIP2-T8 Case Outline
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100mA
MAX665M
/883B
Mil-Std-1835
120mA
REF02J/883B
REF02
REF02Z/883B
426MJA/883B
IH5048
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Untitled
Abstract: No abstract text available
Text: OUTLINE DRAWINGS Outline 101 Outline 102 Outline 105 Outline 107 Outlines/ General Info c Outline 108 X PULSAR MICROWAVE CORPORATION 3 OUTLINE DRAWINGS 3 Outlines/ General Info c 48 Industrial West • Clifton, NJ 07012 • Tel: (973) 779-6262 • Fax: (973) 779-2727
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RM 1206
Abstract: No abstract text available
Text: Multilayer Ceramic Capacitors Outline Drawings Chip capacitors Outline drawing 1 Size 0805 1.2S;o,is Outline drawing 2 Size 1206 l,3m ax L" 1/14 o 0,5 ~T T e rm ina tion Termination Outline drawing 3 Size 1210 — 2.Si0.î — Outline drawing 4 Size 1812 1,3max
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050T0
Abstract: No abstract text available
Text: Multilayer Ceramic Capacitors Outline Drawings Radiai-tead capacitors Outline drawing 6 Outline drawing 8 Outline drawing 7 S 5,0 max 2,5 m o* 5,0 max El A Yn \ N S. iMl B3 / f< i i / ! 0.50±0,05t 0.50t0,05 1 . K KE0222-U Outline drawing 9 X W M 2 5 -S
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KE0222-U
E0225-J
050T0
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Untitled
Abstract: No abstract text available
Text: 2 Outline drawings (Unit: mm) •O utline 1 (forming type) Outline 1 Dimension H1 4.5 7.5 ! 6.0 3.5 1 5.0 9.0 10.0 Forming type ■O utline 2 (straight type) Outline 2 TPS Dimension HO 2 .5 4 (5 .0 ) ( 17.5 : 20.5 ): SEL5020 and SEL5021 series Straight type
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SEL5020
SEL5021
SID300
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JEDEC
Abstract: No abstract text available
Text: Standard Outline Dimensions Various typ es o f H itachi diode p ackages are availab le to fu lfill sp e c ific a p p lication s and perform ance. For guaranteed d im en sio n on individual package, refer to the outline drawings for each d ev ice data sheet. Standard outline
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DO-34
O-220FM
O-220AB
SC-46
JEDEC
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TO8 package
Abstract: Linearizer SQ package SG412
Text: Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings 5 Pin TO-8 Package T5 .625” Sq. Package (SG4) 12 Pin TO-8B Package (T9) - 468- Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings SMA Connectorized Housing
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SOP 8 200MIL
Abstract: DIP16-P-300 0903 24pin SOP20-P-300
Text: C2M0S Logic TC74HC/HCT Series 14 Outline Drawings i— i i— i r— i i— > i— i i— i 1— 1 19.75MAX DIP 14-PIN Outline Drawing (DIP14-P-300 Ä J71 r a . n n i~ i n I8! 1t.7SM«x DIP 16-Pin Outline Drawing (DIP16-P-300) Units: mm TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
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TC74HC/HCT
75MAX
14-PIN
DIP14-P-300)
16-Pin
DIP16-P-300)
20-PIN
DIP20-P-300A)
24-PIN
SOP 8 200MIL
DIP16-P-300
0903 24pin
SOP20-P-300
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chip Capacitors 100 nf
Abstract: No abstract text available
Text: Ceramic Capacitors Contents Multilayer chip capacitors Outline drawings COG X7R Z5U Radial-lead multilayer capacitors Outline drawings COG X7R Z5U V P, Type Page B37871 B37949 B37872, B37941 B37872 . B37956 B37942 B37873 . B37957 182 183 185 185 187 187
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B37871
B37949
B37872,
B37941
B37872
B37956
B37942
B37873
B37957
B37979,
chip Capacitors 100 nf
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Untitled
Abstract: No abstract text available
Text: ~PMO£N/;< M/c/?om^cap. Outline Drawings Pin# 1 2 3 .XX .XXX .02 .010 All Dimensions are in inches Std. outline Flipped Version Function Function RF In RF Out Vcc or R* Vcc or R* RF Out RF In
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siemens ICA
Abstract: LX141 siemens r LG7137 DLO7135 0xlp
Text: Intelligente LED-Anzeigen Intelligent Displays Maßbilder in mm Siemens Aktiengesellschaft Outline drawings (in mm) 65 Intelligent Displays Intelligente LED-Anzeigen Maßbilder (in mm) Outline drawings (in mm) DL 3416 Figures 101 Figure 6 EIA date code Lum inous
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2416T
L2416TX
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siemens ICA
LX141
siemens r
LG7137
DLO7135
0xlp
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Untitled
Abstract: No abstract text available
Text: Digital Attenuator Outline Drawings .625” Gullwing Package SG4 .800” x 1.37” DIP Package (DP5) .990” x 1.99” DIP Package (DP8) - 466 - Digital Attenuator Outline Drawings .775” Sq. DIP Package (DP11) Attenuator SMA Connectorized Housing 1
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