Untitled
Abstract: No abstract text available
Text: PART NO. MATERIALS & SPECIFICATIONS A24001-010 REV ECO D 96882 DATE 07-14-10 APP TLM INSULATOR: POLYPHENYLENE SULFIDE PPS PER MIL-M-24519, TYPE GST 40F. CONTACT: BERYLLIUM COPPER PER ASTM B194, C17200. GOLD PLATED PER ASTM B488, (HARD GOLD) TYPE II CODE C CLASS 1.27.
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A24001-010
MIL-M-24519,
C17200.
SN63A
J-STD-006
AMS-P-81728.
AMSC-26074.
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A79618-001
Abstract: Omnetics Connector Corporation 61873 circle connector
Text: PART NO. A79618-001 REV ECO A 96155 DATE 08-31-09 APP TLM .06 1.52 .020 0.50 2 1 .025 0.64 .100 2.54 10 .150 3.81 5X .008 0.20 , SOLDER COATED 9 .040 1.02 .170 4.32 .070 1.78 5X .008 X .0025 [.20] X [.06], SOLDER COATED .080 2.03 ACTUAL SIZE .037 0.94 .087 2.21
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A79618-001
A79618-001
Omnetics Connector Corporation 61873
circle connector
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Untitled
Abstract: No abstract text available
Text: PART NO. MATERIALS & SPECIFICATIONS A24001-008 REV ECO D 96882 DATE 07-14-10 APP TLM INSULATOR: POLYPHENYLENE SULFIDE PPS PER MIL-M-24519, TYPE GST 40F. CONTACT: BERYLLIUM COPPER PER ASTM B194, C17200. GOLD PLATED PER ASTM B488, (HARD GOLD) TYPE II CODE C CLASS 1.27.
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A24001-008
MIL-M-24519,
C17200.
SN63A
J-STD-006
AMS-P-81728.
AMSC-26074.
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A29100-065
Abstract: No abstract text available
Text: PART NO. MATERIALS & SPECIFICATIONS HOUSING: ALUMINUM 6061-T6, NICKEL PLATE PER AMS-C-26074 .225 5.72 J 96465 01-30-10 .970 24.64 1.075 27.31 1 .074 1.88 PERFORMANCE: PRODUCT FAMILY TESTED TO AND PASSED THE PERFORMANCE SPECIFICATIONS OF TABLE VIII OF MIL-DTL-32139
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6061-T6,
AMS-C-26074
MIL-DTL-32139
MILDTL-32139
SN63A
J-STD-006
MIL-DTL32139,
D5138
A29100-065
A29100-065
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A29100-025
Abstract: No abstract text available
Text: MATERIALS & SPECIFICATIONS PART NO. HOUSING: ALUMINUM 6061-T6, NICKEL PLATE PER AMS-C-26074 INSULATOR: LIQUID CRYSTAL POLYMER LCP PER ASTM D5138 .010 (TYP) 0.25 SOLDER COATED REV ECO DATE J 96465 01-30-10 .137 3.48 .225 5.72 .470 11.94 .575 14.61 CURRENT RATING:
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D5138
MIL-DTL-32139
MIL-DTL32139
SN63A
J-STD-006
MIL-DTL32139,
6061-T6,
AMS-C-26074
A29100-0O
A29100-025
A29100-025
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Untitled
Abstract: No abstract text available
Text: PART NO. MATERIALS & SPECIFICATIONS A28200-025 REV ECO DATE F 96881 07-14-10 APP TLM HOUSING: ALUMINUM 6061-T6, NICKEL PLATE PER AMS-C-26074. .0575 1.46 INSULATOR: LIQUID CRYSTAL POLYMER LCP PER ASTM D5138. CONTACT: BERYLLIUM COPPER PER ASTM B194, C17200, GOLD PLATED
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A28200-025
6061-T6,
AMS-C-26074.
D5138.
C17200,
SN63A
J-STD-006
AMS-P-81728.
MIL-DTL-32139.
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A29400-025
Abstract: MIL-DTL-32139
Text: MATERIALS & SPECIFICATIONS PART NO. HOUSING: ALUMINUM 6061-T6, NICKEL PLATE PER AMS-C-26074 .470 11.94 INSULATOR: LIQUID CRYSTAL POLYMER LCP PER ASTM D5138 .038 0.95 .025 0.64 .040 1.02 .050 1.27 (TYP) 2X 97503 04-05-11 TLM 2X #0-80 UNF-2B .070 (TYP) 1.78
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D5138
AMS-C-26074
A29400-025
A29400-025
MIL-DTL-32139
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A29100-031
Abstract: MIL-DTL-32139 Omnetics Connector Corporation 61873 MILDTL32139
Text: PART NO. MATERIALS & SPECIFICATIONS HOUSING: ALUMINUM 6061-T6, NICKEL PLATE PER AMS-C-26074 .010 0.25 SOLDER COATED INSULATOR: LIQUID CRYSTAL POLYMER LCP PER ASTM D5138 A29100-031 REV ECO DATE APP J 96465 01-30-10 TLM .085 2.16 2X #0-80 UNF-2B .137 3.48
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6061-T6,
AMS-C-26074
D5138
MIL-DTL32139,
SN63A
J-STD-006
MIL-DTL-32139
MILDTL-32139
MIL-DTL-32139
A29100-031
A29100-031
Omnetics Connector Corporation 61873
MILDTL32139
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Untitled
Abstract: No abstract text available
Text: PART NO. .0 2 0 0 .5 1 A 7 9 6 0 8 -0 0 1 REV ECO DATE APP B 96931 08-02-10 TLM .0 6 1 .5 2 1 .0 2 5 0 .6 4 .1 0 0 2 .5 4 .0 5 0 1 .2 7 3X 6 .0 0 8 , 0 .2 0 SOLDER CO ATED 5 .0 4 0 1 .0 2 .1 7 0 4 .3 2 .0 7 0 1 .7 8 3X .0 0 8 X .0 0 2 5 , [.2 0 ] X [.0 6 ]
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Abstract: No abstract text available
Text: PART NO. A 1 0 0 7 0 2 -0 0 1 REV ECO DATE APP B 98555 0 5 -1 8 -1 2 T LM A C T U A L S IZ E .0 1 9 X .0 0 5 T Y P SO LD ER C O ATED 2X . 0 6 7± . 0 0 3 .2 8 5 .1 4 3 .0 8 5 . 3 0 0± . 0 0 3 .4 7 BONDED . 1 0 M AX .1 0 0 .0 7 (2 ) S P A C E S @ . 0 5 0 = .1 0 0
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Abstract: No abstract text available
Text: PART NO. A 1 0 0 7 0 4 -0 0 1 REV ECO DATE APP A 97825 0 8 -0 8 -1 1 T LM A C T U A L S IZ E .0 1 9 X .0 0 5 T Y P SO LD ER C O AT ED 2X . 0 6 7± . 0 0 3 .2 8 5 .1 4 3 . 5 0 0± . 0 0 3 .0 8 5 .6 7 BO NDED . 1 0 M AX .1 0 0 .0 7 (6 ) S P A C E S @ . 0 5 0 = .3 0 0
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Untitled
Abstract: No abstract text available
Text: PART NO. A 1 0 0 7 0 3 -0 0 1 REV ECO DATE APP A 97825 0 8 -0 8 -1 1 T LM A C T U A L S IZ E .0 1 9 X .0 0 5 T Y P S O LD ER C O A TE D 2X . 0 6 7± . 0 0 3 .2 8 5 .1 4 3 . 4 0 0± . 0 0 3 .0 8 5 .5 7 BONDED . 1 0 M AX .1 0 0 .0 7 (4 ) S P A C E S @ . 0 5 0 = .2 0 0
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Untitled
Abstract: No abstract text available
Text: PART NO. M A T E R IA L S & S P E C IF IC A T IO N S INSULATOR: P O L Y P H E N Y L E N E S U L F ID E P P S P E R M IL -M -2 4 5 1 9 , T Y P E G S T 40F. A 2 4 0 0 0 -0 0 4 REV ECO DATE APP D 968 82 0 7 -1 4 -1 0 TLM 2 6 A W G (7 -3 4 ) PTFE, COLOR CODED
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Untitled
Abstract: No abstract text available
Text: PART NO. M A T E R IA L S & S P E C IF IC A T IO N S .1 7 4 .3 2 INSULATOR: P O L Y P H E N Y L E N E S U L F ID E P P S P E R M IL -M -2 4 5 1 9 , TYPE G ST 40F. A 2 5 0 0 0 -0 0 2 REV ECO DATE APP D 968 84 0 7 -1 4 -1 0 TLM .0 7 5 1 .9 1 CONTACT: C O P P E R A L L O Y P E R M IL D T L -8 3 5 1 3 , G O L D P L A T E D
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Untitled
Abstract: No abstract text available
Text: PART NO. M A T E R IA L S & S P E C IF IC A T IO N S INSULATOR: P O L Y P H E N Y L E N E S U L F ID E P P S P E R M IL -M -2 4 5 1 9 , T Y P E G S T 40F. A 2 4 0 0 0 -0 0 2 REV ECO DATE APP D 968 82 0 7 -1 4 -1 0 TLM 2 6 A W G (7 -3 4 ) PTFE, COLO R CODED
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NASA SP-R-0022
Abstract: Omnetics Connector J-STD-006 MIL-M-24519 NSD-44-DD-GS nano connector SP-R-0022 NSS-24-WC-18 76357 Omnetics yyww
Text: O m n e t ic s CONNECTOR CORPORATION MICRO-SSB-SERIES: Single Row Horizontal T hru-H o le {TYPE BB Single Row Horizontal Thru-H o le {TYPE H2) Single Row H orizontal Thru-H o le {TYPE CC) Single Row Soldercup {TYPE SS) Single Row Pre-W ired {TYPE W D) MICRO-PS1/PS2-SERIES:
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NPD-48-WD-18
NPD-48-WC-18
NASA SP-R-0022
Omnetics Connector
J-STD-006
MIL-M-24519
NSD-44-DD-GS
nano connector
SP-R-0022
NSS-24-WC-18
76357
Omnetics yyww
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g vertical thru hole jack PCB Connector
Abstract: J-STD-006 MIL-M-24519 PS2 series SSB-24-AA-LT CI VERTICAL LA 7036 NASA SP-R-0022 DRP12 Omnetics yyww Omnetics
Text: CONNECTOR CORPORATION MICRO-SSB-SERIES: Single Row Horizontal S M T {TYPE AA S ingle Row Straight Tail {TYPE DD) Single Row Horizontal T hru-H o le {TYPE BB) Single Row Horizontal Thru-H o le {TYPE H2) Single Row H orizontal Thru-H o le {TYPE CC) Single Row
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TY3925
PSM-11-WD-18
PSM-11-WC-18
g vertical thru hole jack PCB Connector
J-STD-006
MIL-M-24519
PS2 series
SSB-24-AA-LT
CI VERTICAL LA 7036
NASA SP-R-0022
DRP12
Omnetics yyww
Omnetics
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Omnetics
Abstract: IR520 Omnetics Connector A7260 Omnetics yyww ir 520
Text: I PART NO. |A17595-001 .035 REV .450 APR ECO DATE 95243 0 6 - 2 6 - 0 8 TLM .050 TYP .275 1 ir- .100 “ T .170 _L MICRO-SCREW HOLDS & KEYS r W / 1 / 8 " FLOAT CLEARANCE <&: .09” LENGTH OF THREAD .520 I 1 r OMNETICS YYWW .12 6 ± .0 1 0 .245 1 _ 26 AWG ( 7 - 3 4 )
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A17595-001
A17595
Omnetics
IR520
Omnetics Connector
A7260
Omnetics yyww
ir 520
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SAE-AMS-4911
Abstract: MNSO-37-AA-N-ETH-HTE-M MNSLP-25-AA-N-HTE SAE-AMS-QQ-P-416 MNSO-37-W-N-ETH-HTE 1140L4 Micro-D connectors MIL-T-81556 135G21 SAE-AS22759
Text: M. A O C o +* o — •Q C ra o >“ O Bi-Lobe .025" (.64 mm Centerline Nano Table o f C onten ts Picture Flex Pin Contact System .4
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Untitled
Abstract: No abstract text available
Text: I PART ND. IA10450-001 R E V ECD 97432 DATE 0 3 -0 8 -1 1 APP TLM .126+.010 WHITE DDT <22 S P A C E S @ .050 = 1.100 C031) * .170 .100 J _ PDSITIDN WIRE CDLDR 1 BLUE 2 BLUE 3 CLEA R 4 CLEA R 5 BLUE 6 BLUE 7 CLEA R 8 CLEA R 1.162) REFi HONEYW ELL 8 5 2 8 1 2 2 -1
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IA10450-001
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Untitled
Abstract: No abstract text available
Text: I PART NO. |A 8 2 8 7 — 001 REV ECO 97999 DATE 10- 2 1 -1 1 APR TLM .0 0 8 X .0 0 2 5 TYP SOLDER COATED MATERIALS THERMORPLASTIC POLYESTER PER MIL— M— 2 4 5 1 9 , TYPE G L C P -3 0 F CONTACT MATL: BERYLLIUM COPPER PER ASTM B 19 4 , ALLOY C 17 200 CONTACT PLATING:
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A8287-001
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