Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    OM6254U Search Results

    OM6254U Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    OM6254U NXP Semiconductors fine-pitch land grid array package; 274 lands Original PDF

    OM6254U Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Bare die outline WLCSP9: wafer level chip-size package; 9 bumps; 1.26 x 1.89 x 0.22 mm OM6254U D e e1 y e2 E x 0,0 X Y 2 P1 P2 A1 detail X A2 A Dimensions Unit(1) mm A A1 A2 max nom 0.215 0.015 0.2 min D(1) E(1) detail Y e e1 1.26 1.89 1.05 0.22 P1 e2 0.9


    Original     		OM6254U PC8564A-1 om6254u PDF