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    JESD22-B111

    Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5
    Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA


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    multicore solder paste

    Abstract: JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E
    Text: Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies T. T. Mattila, R. J. James, L. Nguyen* and J. K. Kivilahti Laboratory of Electronic Production Technology Helsinki University of Technology Otakaari 7 A, P.O.Box 3000


    Original     		PDF HUTEPT-13, fi/Diss/2005/isbn9512279843/T) multicore solder paste JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E

    JESD22-B111

    Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
    Text: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation


    Original     		PDF JESD22-B111 100-bumps 36-bumps 48-leads gov/div898/handbook/, gov/div853/lead 20free/part1 LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus